公开(公告)号：US20170171976A1

公开(公告)日：2017-06-15

申请号：US15348044

申请日：2016-11-10

Applicant: LG Display Co., Ltd.

Inventor： Jaeseung LEE

IPC: H05K1/14

CPC classification number: H05K1/14 ,  H05K1/0215 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/04 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/20 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A printed circuit board and a display device are provided. The printed circuit board includes a plurality of insulation layers; at least one metal layer between the plurality of insulation layers; and a fixing member fixed to a surface of one of the at least one metal layer and passing through an outermost one of insulation layers to protrude to the outside.

公开(公告)号：US09204559B2

公开(公告)日：2015-12-01

申请号：US14204455

申请日：2014-03-11

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Rikihiro Maruyama ,  Kenshi Kai ,  Nobuyuki Kanzawa ,  Mitsutoshi Sawano

IPC: H05K3/30 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/301 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/303 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.

Abstract translation: 半导体器件的制造方法使用具有绝缘电路板定位夹具的安装夹具，具有形成在预定位置上的多个定位孔的管状接触元件定位夹具，以插入管状接触元件，以及管状接触元件压入 夹具 通过绝缘电路板定位夹具和管状接触元件定位夹具，绝缘电路板和管状接触元件被定位，并且管状接触元件被焊接到绝缘电路板，​​同时被管状接触元件压下 夹具

公开(公告)号：US20150027766A1

公开(公告)日：2015-01-29

申请号：US14326193

申请日：2014-07-08

Applicant: CANON KABUSHIKI KAISHA

Inventor： Satoshi Ogawara

IPC: H05K1/16 ,  G03G15/00

CPC classification number: G03G15/80 ,  G03G21/1652 ,  H05K1/0254 ,  H05K1/0269 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10363

Abstract: A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.

Abstract translation: 一种印刷电路板，包括：通过焊料在其上安装部件的基板; 以及具有焊接在所述基板上的焊接部分的接触板，所述接触板被构造成与所述基板要附接的装置的接触部接触，其中所述焊接部分被焊接在所述基板的表面上 与其上安装有部件的基板的表面相对，并且其中接触板具有抑制部分，该抑制部分被配置为抑制焊料焊剂与接触板与接触部分接触的部分的粘附， 所述抑制部分使得所述焊剂从所述焊接部分流向比从所述焊接部分到所述部分的直线距离长的部分。

公开(公告)号：US20150008028A1

公开(公告)日：2015-01-08

申请号：US13935909

申请日：2013-07-05

Applicant: Kabushiki Kaisha Toshiba

Inventor： Koji Tada

IPC: H05K1/11

CPC classification number: H05K3/301 ,  H05K2201/09036 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2203/167 ,  Y02P70/611

Abstract: According to one embodiment, an electronic apparatus includes, a substrate provided with a plurality of depressions, a stud which has a plurality of projections located in the depressions and which is fixed to the substrate, and a solder connection portion intervening between the substrate and the stud.

Abstract translation: 根据一个实施例，一种电子设备包括：设置有多个凹部的基板，具有位于所述凹部中并固定在所述基板上的多个突起的螺柱，以及插入在所述基板和所述基板之间的焊料连接部 螺柱

公开(公告)号：US20140376202A1

公开(公告)日：2014-12-25

申请号：US14305948

申请日：2014-06-16

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ryuichi Shibutani

IPC: H01L23/00 ,  H05K1/11

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L25/105 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/181 ,  H05K1/186 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/2036 ,  Y02P70/613

Abstract: First electrode pads formed on one semiconductor package surface include a first reinforcing electrode pad having a surface area larger than that of other first electrode pads. Second electrode pads formed on a printed wiring board on which the semiconductor package is mounted include at least one second reinforcing electrode pad. The second reinforcing electrode pad opposes the first reinforcing electrode pad, and has a surface area greater than that of the other second electrode pads. The first and second electrode pads are connected by solder connection parts. A cylindrical enclosing member encloses an outer perimeter of a solder connection part connecting the first and second reinforcing electrode pads. Increases in the amount of warping of semiconductor devices such as the package substrate and the printed wiring board are suppressed, and the development of solder bridges with respect to adjacent solder connecting parts or adjacent components is reduced.

Abstract translation: 形成在一个半导体封装表面上的第一电极焊盘包括表面积大于其它第一电极焊盘的表面积的第一增强电极焊盘。 形成在其上安装有半导体封装的印刷线路板上的第二电极焊盘包括至少一个第二增强电极焊盘。 第二加强电极垫与第一增强电极焊盘相对，并且其表面积大于其它第二电极焊盘的表面积。 第一和第二电极焊盘通过焊接连接部分连接。 圆柱形封闭构件包围连接第一和第二增强电极焊盘的焊接连接部分的外周边。 抑制诸如封装衬底和印刷电路板的半导体器件的翘曲量的增加，并且减少了相对于相邻焊料连接部件或相邻部件的焊料桥的发展。

公开(公告)号：US07229291B2

公开(公告)日：2007-06-12

申请号：US11139846

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

公开(公告)号：US20030052156A1

公开(公告)日：2003-03-20

申请号：US09954026

申请日：2001-09-18

Inventor： Sang-Young Kim ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Seung-Kon Mok

IPC: B23K035/34 ,  B23K031/02 ,  B23K035/12

CPC classification number: H01L24/10 ,  B23K1/0008 ,  B23K35/0222 ,  B23K35/0244 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12014 ,  Y10T428/12222 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A solder structure comprising a radially-curved exterior surface enclosing a predetermined-sized cavity used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an annular conductive pad and the other planar element having either a corresponding annular or circular conductive pad, separated by a spherical solder compound comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Abstract translation: 焊料结构包括径向弯曲的外表面，其包围预定尺寸的空腔，用于在预定的导电接触点处柔性地接合两个具有不同性质的平面元件。 通过以分层布置组装两个平面元件，一个平面元件具有环形导电焊盘，另一个平面元件具有相应的环形或圆形导电焊盘，由由焊料和助熔剂构成的球形焊料化合物分开， 可以在焊料化合物的熔化和随后的冷却期间产生焊料结构。 所得中空焊料结构的可塑性/弹性特性吸收两个平面元件相对于彼此的横向移动，而不会降低焊接接头。

公开(公告)号：US06465082B1

公开(公告)日：2002-10-15

申请号：US09554502

申请日：2000-05-16

Applicant: Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

Inventor： Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

IPC: H05K100

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10257 ,  H05K2201/10992 ,  H05K2203/121 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681

Abstract: A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.

Abstract translation: 一种要安装在电路板上的应力松弛型电子部件，其中应力松弛机构部件设置在所述电子部件的表面上，所述表面位于要连接所述电子部件的连接部分的一侧 到所述电路板，并且所述应力松弛机构构件是导电的。

公开(公告)号：US06310301B1

公开(公告)日：2001-10-30

申请号：US09288749

申请日：1999-04-08

Applicant: Randy T. Heinrich ,  Robert J. Roessler ,  Thang D. Truong ,  Matthew A. Wilkowski ,  William L. Woods, Jr.

Inventor： Randy T. Heinrich ,  Robert J. Roessler ,  Thang D. Truong ,  Matthew A. Wilkowski ,  William L. Woods, Jr.

IPC: H05K116

CPC classification number: H05K3/368 ,  H05K1/141 ,  H05K1/165 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10257 ,  H05K2201/10666 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0455 ,  Y02P70/613

Abstract: An inter-substrate conductive mount for a surface mountable circuit board, a method of manufacturing the circuit board and a surface mountable power magnetic device. In one embodiment, the circuit board includes: (1) a substrate, (2) an inter-substrate conductive mount composed of a material having a melting point above a solder reflow temperature and including a compliant solder joint at an interface of the substrate and (3) a solder located proximate the conductive mount, the conductive mount of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the conductive mount in contact with the substrate as the solder is brought to the reflow temperature, the conductive mount being capable of mounting the substrate to an adjacent substrate and providing a conductive path therebetween.

Abstract translation: 一种用于表面安装电路板的基板间导电座，一种制造电路板的方法和一种可表面安装的电力磁性装置。 在一个实施例中，电路板包括：（1）基板，（2）由具有高于焊料回流温度的熔点的材料构成的基板间导电安装件，并且在基板的界面处包括柔性焊接点 （3）位于导电安装座附近的焊料，该导电安装件具有足够低的重量，使得焊料的液体状态的表面张力足以使导电安装座与衬底接触，因为焊料被带到 回流温度，导电安装件能够将衬底安装到相邻的衬底上并且在它们之间提供导电路径。

公开(公告)号：US6007349A

公开(公告)日：1999-12-28

申请号：US775945

申请日：1997-01-03

Applicant: Thomas H. Distefano ,  Joseph Fjelstad

Inventor： Thomas H. Distefano ,  Joseph Fjelstad

IPC: H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K3/34 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H05K3/3436 ,  H05K3/4092 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K2201/0373 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T29/49147

Abstract: Flexible connectors having substantially vertical conductive legs allowing the connectors to accommodate deflection in the lateral directions (x-y directions in the plane of the connectors) induced by CTE mismatches between a chip and a substrate during thermal cycling of the chip. The connectors also accommodate deflections in the vertical direction (z direction--perpendicular to the plane of the connectors) which may be caused by connection to a substrate. Such substantially vertical leg features are formed using projection lithography, such as projected x-ray or ultra-violet ("UV") radiation, to selectively expose a photoresist layer such that the substantially vertical metal features may be formed by plating or etching. The sacrificial layer may be in the form of an array of posts, such that "stool-like" post connectors are created, or may be in the form of an array of apertures, such that "basket-like" receptacles or sockets are created. Such a flexible connector may be used in different applications resulting in superior device characteristics, such as: 1) a replacement for flip chip (C4) solder connections or for BGA solder connections; 2) a flexible socket element; or 3) a flexible thermal coupling element.

Abstract translation: 柔性连接器具有基本垂直的导电腿，允许连接器在芯片的热循环期间适应芯片和衬底之间的CTE错配引起的横向（连接器平面中的x-y方向）的偏转。 连接器还可以通过连接到基板而引起垂直方向（z方向 - 垂直于连接器的平面）的偏转。 这种基本上垂直的腿部特征使用诸如投影的x射线或紫外线（“UV”）辐射的投影光刻来形成，以选择性地暴露光致抗蚀剂层，使得可以通过电镀或蚀刻形成基本垂直的金属特征。 牺牲层可以是柱的阵列的形式，使得形成“凳状”柱连接器，或者可以是孔阵列的形式，使得形成“篮状”插座或插座 。 这种柔性连接器可以用于不同的应用中，导致优异的器件特性，例如：1）替代倒装芯片（C4）焊料连接或用于BGA焊料连接; 2）柔性插座元件; 或3）柔性热耦合元件。