公开(公告)号：US06426021B2

公开(公告)日：2002-07-30

申请号：US09809279

申请日：2001-03-16

Applicant: Yasuhiro Suga ,  Motohide Takeichi

Inventor： Yasuhiro Suga ,  Motohide Takeichi

IPC: H01B102

CPC classification number: H01L24/28 ,  C08L2666/54 ,  C09J5/06 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10674 ,  Y10T428/24917 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (E′) of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1) 0.02≦E/E′≦0/5  (1)

Abstract translation: 各向异性导电粘合剂材料由热固性树脂和分散在热固性树脂中的导电颗粒构成，其中导电颗粒中10％的压缩弹性模量（E）和突出电极的纵向弹性模量（E'） 通过各向异性导电粘合剂材料连接的电子元件满足下述关系式（1）

公开(公告)号：US06381164B1

公开(公告)日：2002-04-30

申请号：US09835123

申请日：2001-04-13

Applicant: Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

Inventor： Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

IPC: G11C502

CPC classification number: H05K7/1061 ,  G11C5/063 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/7082 ,  H05K1/112 ,  H05K1/144 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/0314 ,  H05K2201/0394 ,  H05K2201/09845 ,  H05K2201/10378 ,  H01L2924/00

Abstract: The present invention provides a low profile, high density electronic package for high speed, high performance semiconductors, such as memory devices. It includes a plurality of modules having high speed, impedance-controlled transmission line buses, short interconnections between modules and, optionally, driver line terminators built into one of the modules, for maintaining high electrical performance. Suitable applications include microprocessor data buses and memory buses such as RAMBUS and DDR. The modules may be formed on conventional printed circuit cards with unpacked or packed memory chips attached directly to the memory module. Thermal control structures may be included to maintain the high density modules within a reliable range of operating temperatures.

Abstract translation: 本发明提供了用于高速，高性能半导体（例如存储器件）的薄型，高密度电子封装。 它包括多个模块，其具有高速，阻抗控制的传输线总线，模块之间的短互连，以及可选地，内置在模块之一中的驱动器线路终端器，用于维持高电气性能。 适用的应用包括微处理器数据总线和诸如RAMBUS和DDR之类的存储器总线。 模块可以在具有直接附接到存储器模块的未包装或打包的存储器芯片的常规印刷电路卡上形成。 可以包括热控制结构以将高密度模块保持在可靠的操作温度范围内。

公开(公告)号：US20010026866A1

公开(公告)日：2001-10-04

申请号：US09809279

申请日：2001-03-16

Applicant: SONY CHEMICALS CORP

Inventor： Yasuhiro Suga ,  Motohide Takeichi

IPC: B32B003/00 ,  C09J001/00

CPC classification number: H01L24/28 ,  C08L2666/54 ,  C09J5/06 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10674 ,  Y10T428/24917 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (Enull) of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1). 0.02nullE/Enullnull0.5nullnull(1)

Abstract translation: 各向异性导电粘合剂材料由热固性树脂和分散在热固性树脂中的导电颗粒构成，其中导电颗粒中10％的压缩弹性模量（E）和突出电极的纵向弹性模量（E'） 通过各向异性导电粘合剂材料连接的电子元件满足下述关系式（1）。 <段落lvl =“0”> 0.02 <= E / E'<= 0.5（1）

公开(公告)号：US06236565B1

公开(公告)日：2001-05-22

申请号：US09594363

申请日：2000-06-15

Applicant: Mark G. Gordon

Inventor： Mark G. Gordon

IPC: H05K720

CPC classification number: H05K1/141 ,  H01L23/467 ,  H01L2924/0002 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/302 ,  H01L2924/00

Abstract: A stackable integrated circuit chip package comprising a carrier and a flex circuit. The flex circuit itself comprises a flexible substrate having opposed top and bottom surfaces, and a conductive pattern which is disposed on the substrate. The substrate is wrapped about and attached to at least a portion of the carrier such that the conductive pattern defines first and second portions. The chip package further comprises an integrated circuit chip which is electrically connected to the first portion of the conductive pattern such that an air path is defined between the integrated circuit chip and the carrier. The chip package is configured such that the second portion of the conductive pattern and the integrated circuit chip are each electrically connectable to another stackable integrated circuit chip package. A chip stack assembled using chip packages of the present invention is preferably used in conjunction with an active cooling system operative to circulate cooling air through the air path defined by each chip package.

Abstract translation: 一种包括载体和柔性电路的可堆叠集成电路芯片封装。 柔性电路本身包括具有相对的顶表面和底表面的柔性基板和设置在基板上的导电图案。 衬底围绕并附着到载体的至少一部分上，使得导电图案限定第一和第二部分。 芯片封装还包括集成电路芯片，其与导电图案的第一部分电连接，使得在集成电路芯片和载体之间限定空气通路。 芯片封装被构造成使得导电图案的第二部分和集成电路芯片各自可电连接到另一可堆叠集成电路芯片封装。 使用本发明的芯片封装件组装的芯片堆叠优选地与主动冷却系统结合使用，该主动冷却系统可操作以使冷却空气通过由每个芯片封装限定的空气路径循环。

公开(公告)号：US6081430A

公开(公告)日：2000-06-27

申请号：US072792

申请日：1998-05-05

Applicant: George Sterling La Rue

Inventor： George Sterling La Rue

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H05K7/14 ,  H01K12/16

CPC classification number: H05K1/025 ,  H05K1/141 ,  H05K7/1441 ,  H05K2201/0314 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/0792 ,  H05K2201/09236 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10689 ,  H05K3/325 ,  H05K3/366 ,  H05K3/368

Abstract: A backplane consisting of segmented bus lines on a mother board with loop-through connections to active transceivers mounted on connectors to daughter boards. The transceivers isolate the interconnect to the daughter boards from the bus lines. The loop-through transmission line on the connectors preserves the impedance of the bus lines and allows the interconnect stub to the transceivers to be short, minimizing reflections and enabling high-speed backplane operation. The connectors are removable from the motherboard for repair.

Abstract translation: 一个背板，由主板上的分段总线线路组成，其中连接到与子板连接器上的主动收发器。 收发器将母线的互连与子板隔离。 连接器上的环通传输线保留总线的阻抗，并允许收发器的互连短路短路，最小化反射并实现高速背板操作。 连接器可从主板上拆下进行维修。

公开(公告)号：US6077091A

公开(公告)日：2000-06-20

申请号：US247657

申请日：1999-02-09

Applicant: Paula E. McKenna-Olson ,  Scott G. Barcellos ,  Daniel W. Altman

Inventor： Paula E. McKenna-Olson ,  Scott G. Barcellos ,  Daniel W. Altman

IPC: G01R1/04 ,  H01R13/24 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01R13/2414 ,  G01R1/04 ,  H05K1/141 ,  H01R12/714 ,  H05K2201/0314 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K3/325 ,  H05K3/368 ,  Y10S439/912

Abstract: An adapter for interfacing a tester with the leads of a dual-flatpack or quad-flatpack is disclosed herein. The adapter includes lengths of a conductive elastomer for making electrical contact with the rows of leads extending from the flatpack. The lengths of conductive elastomer are each located within a slot formed in a body of the adapter and are exposed within a depression in the adapter, where the width and length of the depression correspond to the width and length of the flatpack. The adapter is frictionally secured to the flatpack when the adapter is pressed onto the flatpack. The resilient conductive elastomer makes reliable contact to the leads of the flatpack.

Abstract translation: 本文公开了一种用于将测试器与双平面包装或四边形包装的引线连接的适配器。 适配器包括导电弹性体的长度，用于与从扁平包装体延伸的引线行电接触。 导电弹性体的长度各自位于形成在适配器的主体内的槽内，并且暴露在适配器的凹部内，其中凹陷的宽度和长度对应于扁平包装的宽度和长度。 当适配器按压到扁平包装上时，适配器摩擦地固定在扁平包装上。 弹性导电弹性体与扁平包装的引线可靠接触。

公开(公告)号：US5855063A

公开(公告)日：1999-01-05

申请号：US944776

申请日：1997-10-06

Applicant: Chris M. Schreiber ,  Bao Le

Inventor： Chris M. Schreiber ,  Bao Le

IPC: H01R12/00 ,  H01R13/24 ,  H05K1/09 ,  H05K3/20 ,  H05K3/40 ,  H01K3/22

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K3/4007 ,  H05K1/095 ,  H05K2201/0314 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K3/205 ,  Y10T29/49158 ,  Y10T29/49204 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: A printed-circuit-type electrical contact pad having a plurality of electrically conductive metal traces and a plurality of protuberant electrical contacts projecting from the traces. The protuberances comprise an electrically conductive elastomer having a wide base portion anchored in the end of the trace by a truncated portion of the trace upstanding from the face of the pad. A denuded tip portion of the elastomer extends from the base portion for resiliently engaging a contact site on an electrical device to which the pad is coupled. A unique process for making the aforesaid pad is disclosed and claimed.

Abstract translation: 印刷电路式电接触焊盘，其具有多个导电金属迹线和从该迹线突出的多个突出的电触点。 突起包括导电弹性体，该导电弹性体具有宽的基部，其在轨迹的末端被从垫的表面直立的截面的截断部分锚定。 弹性体的裸露的尖端部分从基部延伸，用于弹性地接合焊盘耦合到的电气装置上的接触部位。 公开并要求保护制造上述垫的独特工艺。

公开(公告)号：US5261158A

公开(公告)日：1993-11-16

申请号：US919472

申请日：1992-07-24

Applicant: Christopher M. Schreiber ,  William R. Crumly

Inventor： Christopher M. Schreiber ,  William R. Crumly

IPC: B29C33/56 ,  H01L23/50 ,  H01R12/61 ,  H01R13/24 ,  H01R43/16 ,  H05K1/00 ,  H05K3/20 ,  H05K3/36 ,  H05K3/40 ,  H01K3/22

CPC classification number: H01R12/613 ,  H05K3/4007 ,  H01L2924/0002 ,  H01R13/24 ,  H01R43/16 ,  H05K1/0393 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0726 ,  H05K3/205 ,  H05K3/365 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: An elastomeric member is incorporated between a conductor and a conductive interconnection bridge. This elastomeric member serves as a spring providing compliance to an interconnection so that the flatness requirements of an opposing mating structure may be relaxed. A flat metal mandrel is provided with an elongated curved depression extending across a predetermined region where a resilient interconnection bridge is to be located. A nonconductive layer of "TEFLON" is bonded to the surface of the mandrel. Grooves are ablated in a predetermined configuration down to the conductive surface of the mandrel using an excimer laser and a computer-controlled x-y table. Fineline electrical circuits are electrodeposited into the ablated grooves. The elongated curved depression is filled with a silicone material. The silicone material is permitted to cure to form a compliant elastomeric member having the shape of the elongated curved depression. An insulating backing is laminated onto the electrical circuits and the elastomeric member, and the completed resilient interconnection bridge is removed from the mandrel. Another method is used when the interconnection site is terminated on a circuit pad or on a high density linear connector configuration. In this method, elastomeric material is dispensed onto the circuit pad or along a line transverse to the high density linear connectors. After the elastomeric material has cured, electrical conductors are bonded thereacross to form raised compliant interconnection features.

Abstract translation: 导体和导电互连桥之间并入弹性部件。 该弹性体构件用作提供对互连的顺应性的弹簧，使得可以放松相对配合结构的平坦度要求。 扁平金属心轴设置有延伸穿过弹性互连桥被定位的预定区域的细长弯曲凹陷。 “TEFLON”的非导电层结合到心轴的表面。 使用准分子激光器和计算机控制的x-y台，将凹槽以预定的形式烧蚀到心轴的导电表面。 电线电路电沉积到烧蚀槽中。 细长的弯曲凹陷填充有硅树脂材料。 允许硅氧烷材料固化以形成具有细长弯曲凹陷形状的柔顺弹性体构件。 将绝缘背衬层压到电路和弹性体构件上，并且完成的弹性互连桥从心轴移除。 当互连站点终止于电路板或高密度线性连接器配置时，使用另一种方法。 在该方法中，将弹性体材料分配到电路板上或沿着与高密度线性连接器横向的线分配。 在弹性体材料固化之后，电导体在其上结合以形成凸起的顺应互连特征。

公开(公告)号：US5239447A

公开(公告)日：1993-08-24

申请号：US760038

申请日：1991-09-13

Applicant: Paul W. Cotues ,  Paul A. Moskowitz ,  Philip Murphy ,  Mark B. Ritter ,  George F. Walker

Inventor： Paul W. Cotues ,  Paul A. Moskowitz ,  Philip Murphy ,  Mark B. Ritter ,  George F. Walker

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/20

CPC classification number: H05K3/366 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H05K2201/0314 ,  H05K2201/10484 ,  H05K3/325 ,  H05K3/3442

Abstract: An electronic device packaging structure is described wherein an electronic device is electrically connected to a substrate wherein the electronic device subtends a non-normal angle with respect to the substrate. In a more specific embodiment, a plurality of electronic devices are stacked at offset with respect to each other to expose contact locations on the surface of each electronic device at an edge of each electronic device to form a stepped surface exposing a plurality of electronic device contact locations. This surface is disposed against a substrate having a plurality of contact locations thereon. The electronic device contact locations can be electrically interconnected to the substrate contact locations by solder mounds or alternatively by a cylindrical shaped elastomeric body having metallization bands with a spacing corresponding to the electronic device contact locations. The elastomeric body is pressed between the edge of the stacked electronic devices having the contact locations thereon and substrate surface to form electrical interconnections between electronic device contact locations and substrate contact locations through the electrically conducting bands. The stacked electronic devices can be thermally connected to a heat dissipation member. The stacked electronic devices can have a stepped surface embodying an enhanced area for transfer of heat from the electronic device stack to the heat dissipation member.

公开(公告)号：US4828512A

公开(公告)日：1989-05-09

申请号：US911962

申请日：1986-09-25

Applicant: Larry L. McCormick ,  Thomas A. Clark

Inventor： Larry L. McCormick ,  Thomas A. Clark

IPC: H01R12/77 ,  H01R12/78 ,  H01R13/24 ,  H01R13/6598

CPC classification number: H01R12/774 ,  H01R12/78 ,  H01R13/2414 ,  H01R13/6598 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K3/365

Abstract: The invention is directed to a connector for two flat electrical cables having the same plurality of conduits. The electricity passes from one conduit to the corresponding conduit by way of a dielectric insert having holes therethrough, with electrically conductive means having at least a portion of a hemispherical surface protruding on each side of the dielectric insert. Preferably pressure is applied to the cable/insert/cable sandwich quasi-hydrostatically through a low durometer elastomeric materic material. For EMI/EMP shielding, the low durometer elastomeric material is electrically conductive and encloses completely the connection.

Abstract translation: 本发明涉及一种用于具有相同多个导管的两个扁平电缆的连接器。 电通过具有穿过其中的孔的电介质插入件从一个导管通过相应的导管，导电装置具有在电介质插入件的每一侧上突出的半球形表面的至少一部分。 优选地，通过低硬度弹性材料材料将压力施加到电缆/插入物/电缆三明治准静态地通过。 对于EMI / EMP屏蔽，低硬度弹性体材料是导电的，并且完全包围连接。