公开(公告)号：US09703105B2

公开(公告)日：2017-07-11

申请号：US13553784

申请日：2012-07-19

Applicant: Kuan-Hung Lin ,  Wen-Hao Hsu ,  Lung-Ling Tang

Inventor： Kuan-Hung Lin ,  Wen-Hao Hsu ,  Lung-Ling Tang

IPC: G02F1/1335 ,  G02B27/22 ,  H04N13/04 ,  G02F1/1343

CPC classification number: G02B27/2214 ,  G02F1/133512 ,  G02F2001/134345 ,  H04N13/30

Abstract: A stereo display including a display panel and a light shieldable element is provided. The display panel has at least two sub-pixel regions. Each sub-pixel region is configured with at least a first pixel electrode to define a first sub-region. The light shieldable element is disposed in front of the sub-pixel regions. Each first pixel electrode has a first shieldable region shielded by the light shieldable element and a first non-shielding region exposed by the light shieldable element. The first shieldable region is closer to the scan line than the first non-shielding region. A horizontal direction is defined as a connection line of two eyes of a user watching the stereo display. A total length A of each sub-pixel region and a length B of the first shieldable region in a predetermined direction intersected to the horizontal direction comply with a relationship that (B/A)×100% is substantially from 1.61% to 47.9%.

公开(公告)号：US09502360B2

公开(公告)日：2016-11-22

申请号：US13348449

申请日：2012-01-11

Applicant: Chun-Hung Lin ,  Yu-Feng Chen ,  Han-Ping Pu ,  Hung-Jui Kuo

Inventor： Chun-Hung Lin ,  Yu-Feng Chen ,  Han-Ping Pu ,  Hung-Jui Kuo

IPC: H01L23/52 ,  H01L23/00 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A stress compensation for use in packaging, and a method of forming, is provided. The stress compensation layer is placed on an opposing side of a substrate from an integrated circuit die. The stress compensation layer is designed to counteract at least some of the stress exerted structures on the die side of the substrate, such as stresses exerted by a molding compound that at least partially encapsulates the first integrated circuit die. A package may also be electrically coupled to the substrate.

Abstract translation: 提供了用于包装的应力补偿，以及形成方法。 应力补偿层从集成电路管芯放置在衬底的相对侧上。 应力补偿层被设计成抵抗基板的模具侧上的应力施加结构中的至少一些，例如由至少部分地封装第一集成电路管芯的模制化合物施加的应力。 封装还可以电耦合到衬底。

公开(公告)号：US09437512B2

公开(公告)日：2016-09-06

申请号：US13612764

申请日：2012-09-12

Applicant: Thomas Matthew Gregorich ,  Tzu-Hung Lin

Inventor： Thomas Matthew Gregorich ,  Tzu-Hung Lin

IPC: H01L23/48 ,  H01L23/31 ,  H01L25/10 ,  H01L23/498

CPC classification number: H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00

Abstract: An integrated circuit (IC) package structure is provided, including: a first integrated circuit (IC) package, including: a first package substrate, having opposite first and second surfaces, wherein a first semiconductor chip is disposed over a first portion of the first surface of the first package substrate. In addition, a second integrated circuit (IC) package is disposed on a second portion different from the first portion of the first surface of the first package substrate, including: a second package substrate, having opposite third and fourth surfaces, wherein a second semiconductor chip is disposed over a portion of the third surface of the second package substrate, and the second semiconductor chip has a function different from that of the first semiconductor chip.

Abstract translation: 提供了一种集成电路（IC）封装结构，包括：第一集成电路（IC）封装，包括：具有相对的第一和第二表面的第一封装衬底，其中第一半导体芯片设置在第一 第一封装基板的表面。 此外，第二集成电路（IC）封装设置在与第一封装衬底的第一表面的第一部分不同的第二部分上，包括：具有相反的第三和第四表面的第二封装衬底，其中第二半导体 芯片设置在第二封装衬底的第三表面的一部分上，并且第二半导体芯片具有与第一半导体芯片的功能不同的功能。

公开(公告)号：US09418947B2

公开(公告)日：2016-08-16

申请号：US13406031

申请日：2012-02-27

Applicant: Yu-Feng Chen ,  Chun-Hung Lin ,  Han-Ping Pu ,  Ming-Da Cheng ,  Kai-Chiang Wu

Inventor： Yu-Feng Chen ,  Chun-Hung Lin ,  Han-Ping Pu ,  Ming-Da Cheng ,  Kai-Chiang Wu

IPC: H01L23/48 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03334 ,  H01L2224/0384 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05075 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05571 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13078 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2924/206 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The described embodiments of mechanisms of forming connectors for package on package enable smaller connectors with finer pitch, which allow smaller package size and additional connections. The conductive elements on one package are partially embedded in the molding compound of the package to bond with contacts or metal pads on another package. By embedding the conductive elements, the conductive elements may be made smaller and there are is gaps between the conductive elements and the molding compound. A pitch of the connectors can be determined by adding a space margin to a maximum width of the connectors. Various types of contacts on the other package can be bonded to the conductive elements.

Abstract translation: 所描述的形成用于封装封装的连接器的机构的实施例使得具有更细间距的较小连接器能够实现更小的封装尺寸和附加的连接。 一个封装上的导电元件部分地嵌入封装的模制化合物中，以与另一封装上的触点或金属焊盘结合。 通过嵌入导电元件，可以使导电元件更小，并且在导电元件和模塑料之间存在间隙。 可以通过将连接器的最大宽度添加空间余量来确定连接器的间距。 另一个封装上的各种类型的触点可以结合到导电元件上。

公开(公告)号：US09412689B2

公开(公告)日：2016-08-09

申请号：US13357379

申请日：2012-01-24

Applicant: Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

Inventor： Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

IPC: H01L23/02 ,  H01L23/498 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/0273 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0239 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/1131 ,  H01L2224/11424 ,  H01L2224/1152 ,  H01L2224/1162 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13611 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15747 ,  H01L2924/18161 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.

Abstract translation: 提供一种用于封装半导体管芯的系统和方法。 实施例包括具有第一触点和第二触点的第一封装。 在第一接触件上形成接触后材料，以便调节接触垫之间的接头的高度，导体凸块。 在另一个实施例中，使用导电柱来控制接触垫和外部连接之间的接头的高度。

公开(公告)号：US20160128868A1

公开(公告)日：2016-05-12

申请号：US14537465

申请日：2014-11-10

Applicant: Hung-Lin LIN

Inventor： Hung-Lin LIN

IPC: A61F9/00

CPC classification number: A61F9/0026

Abstract: An eye drop container having an eye drop alignment effect is provided. At the eye drop container, an alignment device that generates an alignment color light is provided. Thus, one is assisted to readily align an eye drop opening of the eye drop container to successfully drop eye drops in the eye drop container into one's lower eyelid. With the eye drop container of the present invention, a difficulty of aligning eye drops with one's lower eyelid is eliminated, and the eye drops can be controlled to be easily dropped into the lower eyelid, thereby providing an eye disease with an optimal treatment dosage.

Abstract translation: 提供具有滴眼定位效果的眼药水容器。 在眼滴容器中，设置产生对准色光的对准装置。 因此，有助于容易地对准眼药水容器的滴眼口，以便将眼药水容器中的滴眼液成功地放入下眼睑。 利用本发明的滴眼容器，消除了将眼液与下眼睑调整的难度，并且可以将眼药液控制为容易地滴到下眼睑中，从而提供具有最佳治疗剂量的眼部疾病。

公开(公告)号：US09305859B2

公开(公告)日：2016-04-05

申请号：US13210764

申请日：2011-08-16

Applicant: Richard K. Williams ,  Keng Hung Lin

Inventor： Richard K. Williams ,  Keng Hung Lin

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/4334 ,  H01L21/4828 ,  H01L23/3677 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/05 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05096 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: In a bump-on-leadframe semiconductor package a metal bump formed on a integrated circuit die is used to facilitate the transfer of heat generated in a semiconductor substrate to a metal heat slug and then to an external mounting surface. A structure including arrays of thermal vias may be used to transfer the heat from the semiconductor substrate to the metal bump.

Abstract translation: 在凸起引导框半导体封装中，形成在集成电路管芯上的金属凸块用于促进将在半导体衬底中产生的热量传递到金属加热块，然后转移到外部安装表面。 包括热通孔阵列的结构可用于将热量从半导体衬底转移到金属凸块。

公开(公告)号：US09174123B2

公开(公告)日：2015-11-03

申请号：US12832707

申请日：2010-07-08

Applicant: Steve Nasiri ,  David Sachs ,  Alex Castro ,  Richard Li ,  Anjia Gu ,  Shang-Hung Lin ,  Takashi Nakayama

Inventor： Steve Nasiri ,  David Sachs ,  Alex Castro ,  Richard Li ,  Anjia Gu ,  Shang-Hung Lin ,  Takashi Nakayama

IPC: G05B23/00 ,  A63F13/20 ,  G06F1/16 ,  G06F3/01 ,  G06F3/0346 ,  G06F3/038 ,  G06F21/32 ,  H04M1/725

CPC classification number: G06F3/017 ,  A63F9/24 ,  A63F13/06 ,  A63F13/211 ,  A63F13/213 ,  A63F13/23 ,  A63F13/24 ,  A63F13/30 ,  A63F13/428 ,  A63F13/92 ,  A63F2009/2447 ,  A63F2300/105 ,  A63F2300/204 ,  A63F2300/6045 ,  G06F1/1626 ,  G06F1/1694 ,  G06F1/3215 ,  G06F3/0233 ,  G06F3/0346 ,  G06F3/038 ,  G06F21/32 ,  G06F2221/2105 ,  G06K9/00355 ,  G06K9/00416 ,  G08C2201/32 ,  H04M1/67 ,  H04M1/72519 ,  H04M1/72522 ,  H04M2250/12 ,  H04M2250/22 ,  H04W4/027 ,  H04W12/06 ,  H04W52/0254 ,  H04W52/0264 ,  H04W52/027 ,  H04W52/0274 ,  H04W88/02 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/164 ,  Y02D70/26

Abstract: Systems and methods for human hand gesture recognition through a training mode and a recognition mode are disclosed. In the training mode, a user can move a handheld device with a hand gesture intended to represent a command. Sensors within the handheld device can record raw data, which can be processed to obtain a set of values corresponding to a set of discrete features, which is stored in a database and associated with the intended command. The process is repeated for various hand gestures representing different commands. In the recognition mode, the user can move the handheld device with a hand gesture. A computer system can compare a set of values corresponding to a set of discrete features derived from the hand gesture with the sets of values stored in the database, select a command with the closest match and displays and/or executes the command.

Abstract translation: 公开了通过训练模式和识别模式进行人手手势识别的系统和方法。 在训练模式中，用户可以用旨在表示命令的手势来移动手持设备。 手持设备内的传感器可以记录原始数据，其可以被处理以获得对应于一组离散特征的值，其存储在数据库中并与预期命令相关联。 对于表示不同命令的各种手势重复该过程。 在识别模式下，用户可以用手势移动手持设备。 计算机系统可以将对应于从手势派生的一组离散特征的值与存储在数据库中的值集合进行比较，选择具有最匹配的命令，并显示和/或执行命令。

公开(公告)号：US09099514B2

公开(公告)日：2015-08-04

申请号：US13426334

申请日：2012-03-21

Applicant: Yi-Hung Lin ,  Li-Ting Wang ,  Tze-Liang Lee

Inventor： Yi-Hung Lin ,  Li-Ting Wang ,  Tze-Liang Lee

IPC: A47G19/08 ,  H01L21/687 ,  H01L21/683 ,  H01L21/477 ,  H01L21/306 ,  H01L21/673

CPC classification number: H05B1/0233 ,  F27B17/0025 ,  F27D5/0037 ,  H01L21/306 ,  H01L21/477 ,  H01L21/67115 ,  H01L21/67303 ,  H01L21/683 ,  H01L21/68735 ,  H01L21/68757

Abstract: An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer holder including a first portion and a second portion. The first and second portions are formed of the same continuous material. The first portion includes a first upper surface and a first lower surface, and the second portion including a second upper surface and a second lower surface. The apparatus further includes an interface between the first and second portions. The interface provides for a transition such that the first upper surface of the first portion tends toward the second upper surface of the second portion. The apparatus further includes a tapered region formed in the first portion. The tapered region starts at a radial distance from a center line of the wafer holder and terminates at the interface. The tapered region has an initial thickness that gradually decreases to a final thickness.

Abstract translation: 公开了一种装置，系统和方法。 示例性装置包括具有第一部分和第二部分的晶片保持器。 第一和第二部分由相同的连续材料形成。 第一部分包括第一上表面和第一下表面，第二部分包括第二上表面和第二下表面。 该装置还包括第一和第二部分之间的界面。 界面提供了使得第一部分的第一上表面趋向于第二部分的第二上表面的过渡。 该装置还包括形成在第一部分中的锥形区域。 锥形区域从距离晶片保持器的中心线的径向距离开始，并且在界面处终止。 锥形区域具有逐渐减小到最终厚度的初始厚度。

公开(公告)号：US09033518B2

公开(公告)日：2015-05-19

申请号：US13234122

申请日：2011-09-15

Applicant: Haw-Woei Pan ,  Chao-Shun Chen ,  Hung-Chih Chou ,  Hsin-Hung Lin ,  Yu-Yun Chang

Inventor： Haw-Woei Pan ,  Chao-Shun Chen ,  Hung-Chih Chou ,  Hsin-Hung Lin ,  Yu-Yun Chang

IPC: G03B21/14 ,  F21V9/16 ,  F21V7/00 ,  G03B21/20 ,  H04N9/31 ,  G03B33/08

CPC classification number: G03B21/204 ,  G03B33/08 ,  H04N9/3117 ,  H04N9/3158 ,  H04N9/3164

Abstract: An illumination system includes a first light source, a first rotation wheel, a first phosphor element, and a light combining element. The first light source is capable of emitting a first color beam. The first rotation wheel is disposed on a transmission path of the first color beam and includes a first transmissive region and a first reflective region. The first transmissive region is capable of allowing the first color beam to pass through so as to form a first color transmissive beam. The first reflective region is capable of reflecting the first color beam to form a first color reflective beam. One of the first color transmissive and reflective beams excites the first phosphor element to form a second color beam. The light combining element combines the second color beam and a beam originating from the other one of the first color transmissive and reflective beams.

Abstract translation: 照明系统包括第一光源，第一旋转轮，第一磷光体元件和光组合元件。 第一光源能够发射第一色光束。 第一旋转轮设置在第一颜色光束的传播路径上，并且包括第一透射区域和第一反射区域。 第一透射区域能够允许第一颜色光束通过以形成第一颜色透射光束。 第一反射区域能够反射第一颜色光束以形成第一颜色反射光束。 第一颜色透射和反射光束之一激发第一荧光体元件以形成第二色光束。 光组合元件将第二颜色光束和源自第一颜色透射和反射光束中的另一个的光束组合。