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公开(公告)号：US10034375B2
公开(公告)日：2018-07-24
申请号：US15145828
申请日：2016-05-04
Applicant: APPLE INC.
Inventor： Dennis R. Pyper , Venkataram R. Raju , Yazan Z. Alnahhas
Abstract: An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.
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公开(公告)号：US20180092213A1
公开(公告)日：2018-03-29
申请号：US15710579
申请日：2017-09-20
Applicant: Apple Inc.
Inventor： Corey S. Provencher , Meng Chi Lee , Derek J. Walters , Ian A. Spraggs , Flynn P. Carson , Shakti S. Chauhan , Daniel W. Jarvis , David A. Pakula , Jun Zhai , Michael V. Yeh , Alex J. Crumlin , Dennis R. Pyper , Amir Salehi , Vu T. Vo , Gregory N. Stephens
CPC classification number: H05K1/181 , H05K1/0298 , H05K1/113 , H05K1/115 , H05K1/144 , H05K3/0014 , H05K3/284 , H05K3/341 , H05K3/3436 , H05K2201/10159 , H05K2201/10674 , H05K2203/1316 , Y02P70/611
Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.
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公开(公告)号：US09839133B2
公开(公告)日：2017-12-05
申请号：US14730250
申请日：2015-06-04
Applicant: APPLE INC.
Inventor： Meng Chi Lee , Shankar Pennathur , Scott L. Gooch , Dennis R. Pyper , Amir Salehi
CPC classification number: H05K1/189 , H01L23/4012 , H01L25/0652 , H01L25/0655 , H05K1/141 , H05K1/144 , H05K1/181 , H05K3/284 , H05K3/361 , H05K3/4015 , H05K2201/10318 , H05K2201/10378 , H05K2203/1316 , Y10T29/49128
Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.
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公开(公告)号：US20160345423A1
公开(公告)日：2016-11-24
申请号：US15145828
申请日：2016-05-04
Applicant: APPLE INC.
Inventor： Dennis R. Pyper , Venkataram R. Raju , Yazan Z. Alnahhas
CPC classification number: H05K1/141 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K1/183 , H05K3/368 , H05K2201/10416
Abstract: An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.
Abstract translation: 一种装置包括主基板，装置和散热器。 主基板被构造成用于将装置安装在其上的安装位置并且具有位于安装位置下方的空腔。 该装置安装在安装位置，并且散热器装配到空腔中并且耦合到装置和散热器。 散热器被配置为将热量从设备传导到散热器并且在设备和散热器之间提供电绝缘。
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公开(公告)号：US09258906B2
公开(公告)日：2016-02-09
申请号：US13863264
申请日：2013-04-15
Applicant: Apple Inc.
Inventor： James R. Krogdahl , Benjamin J. Pope , Dennis R. Pyper , Nicholas G. L. Merz , Scott A. Myers
IPC: B29C65/52 , B32B37/12 , B32B37/26 , B32B38/10 , B32B43/00 , C09J5/02 , H05K3/38 , C09J5/00 , H05K3/32 , H05K3/36
CPC classification number: H05K3/386 , C09J5/00 , C09J2201/606 , C09J2203/326 , C09J2205/31 , H05K3/323 , H05K3/361 , Y10T156/10 , Y10T428/13 , Y10T428/31678
Abstract: An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.
Abstract translation: 电子设备可以设置有诸如壳体结构，天线结构，印刷电路和与电气部件相关联的结构的电子设备结构。 结构可以使用粘合剂彼此附接。 将液体压敏粘合剂前体材料沉积在要结合的结构的一个或多个表面上。 可以施加光或热来固化液体粘合剂材料并形成压敏粘合剂层。 在固化期间，在粘合剂材料和结构之间形成化学键。 组装设备可以将结构压在一起以形成可以重新加工而不干扰粘合剂材料的化学结合部分的压敏粘合剂粘合。 压敏粘合剂可以包括用于形成导电路径的导电颗粒。
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Patent Agency Ranking
公开(公告)号：US20160021756A1
公开(公告)日：2016-01-21
申请号：US14730250
申请日：2015-06-04
Applicant: APPLE INC.
Inventor： Meng Chi Lee , Shankar Pennathur , Scott L. Gooch , Dennis R. Pyper , Amir Salehi
CPC classification number: H05K1/189 , H01L23/4012 , H01L25/0652 , H01L25/0655 , H05K1/141 , H05K1/144 , H05K1/181 , H05K3/284 , H05K3/361 , H05K3/4015 , H05K2201/10318 , H05K2201/10378 , H05K2203/1316 , Y10T29/49128
Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.
Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在电子设备中的系统级封装模块和其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚或触点以在模块和其它部件之间形成互连路径。
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公开(公告)号：US20150364253A1
公开(公告)日：2015-12-17
申请号：US14500794
申请日：2014-09-29
Applicant: Apple Inc.
Inventor： Shawn X. Arnold , Dennis R. Pyper , Gang Ning , Meng Chi Lee , Sascha Tietz , Sury N. Darbha , Zhong-Qing Gong
CPC classification number: H01G2/065 , G10K11/16 , H01G4/232 , H01G4/30 , H05K1/111 , H05K3/3442 , H05K2201/094 , H05K2201/09427 , H05K2201/10015 , H05K2201/2045 , Y02P70/611 , Y02P70/613
Abstract: Apparatus and methods are described for coupling a circuit component having piezoelectric properties, such as a ceramic capacitor, to a printed circuit board (PCB) by forming a first solder heel fillet and a second solder heel fillet that fixedly couple the circuit component to the PCB, where the first and second solder heel fillets have a height z that is less than a height h of the circuit component to reduce acoustic noise at the PCB caused by coupling the circuit component to the PCB. In various configurations, the first solder heel fillet and the second solder heel fillet can each fixedly coupled to: a bottom surface of the circuit component, a top surface of the PCB at a first solder pad and a second solder pad thereof, and a lower portion of each of a multiple side surfaces of the circuit component.
Abstract translation: 描述了用于将具有压电特性的电路部件（例如陶瓷电容器）耦合到印刷电路板（PCB）的装置和方法，该方法通过形成将电路部件固定地耦合到PCB的第一焊脚跟内圆角和第二焊脚跟内圆角 其中第一和第二焊脚后视角具有低于电路部件的高度h的高度z，以减小由于将电路部件耦合到PCB而导致的PCB处的声学噪声。 在各种配置中，第一焊脚跟内圆角和第二焊脚跟内圆角可以各自固定地连接到：电路部件的底表面，PCB的顶表面处于第一焊盘和第二焊垫，下部 电路部件的多个侧表面中的每一个的部分。
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公开(公告)号：US09155188B2
公开(公告)日：2015-10-06
申请号：US13631156
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Nicholas G. Merz , Hong Wang , Michael M. Nikkhoo , Dennis R. Pyper , Christopher Matthew Werner
CPC classification number: H05K1/0218 , H05K3/284 , H05K2201/0317 , H05K2201/09618 , H05K2201/09872 , H05K2201/09909 , H05K2201/10371 , H05K2201/2018 , Y10T29/4913 , Y10T29/49146
Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.
Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。
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29.发明申请CONNECTOR INSERTS AND RECEPTACLE TONGUES FORMED USING PRINTED CIRCUIT BOARDS 有权使用印刷电路板形成的连接器插件和插座接头公开(公告)号：US20150131245A1
公开(公告)日：2015-05-14
申请号：US14466899
申请日：2014-08-22
Applicant: Apple Inc.
Inventor： Mahmoud R. Amini , Zheng Gao , Dennis R. Pyper
CPC classification number: H05K1/0296 , B23C3/12 , B23C5/04 , B23C5/12 , B23C2210/086 , B23C2210/088 , B23C2210/244 , B23C2220/16 , B23C2226/27 , H01R13/6473 , H01R13/6658 , H01R24/60 , H01R2201/06 , H05K1/0227 , H05K1/025 , H05K1/181 , H05K3/0044 , H05K3/06 , H05K3/10 , H05K3/108 , H05K3/243 , H05K3/244 , H05K2201/09027 , H05K2201/09081 , H05K2201/09154 , H05K2201/09354 , H05K2201/09445 , H05K2203/1469
Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.
Abstract translation: 具有高信号完整性和低插入损耗的连接器插件和其他结构是可靠的，并且容易制造。 一个示例可以提供主要使用印刷电路板形成的连接器插件。 连接器插入件上的触点可以类似于印刷电路板上的触点，并且它们可以连接到在印刷电路板上具有匹配阻抗的迹线，以便改善信号完整性并减少插入损耗。 可以以增加可靠性的方式制造印刷电路板。 可以采用印刷电路板制造中的电镀，焊料块和其他制造步骤来提高可制造性。 可以使用可能在连接器插入件上提供倒角边缘的专用工具。
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公开(公告)号：US20140146495A1
公开(公告)日：2014-05-29
申请号：US14171623
申请日：2014-02-03
Applicant: Apple Inc.
Inventor： Joseph Fisher, JR. , Sean Mayo , Dennis R. Pyper , Paul Nangeroni , Jose Mantovani
IPC: H05K9/00
CPC classification number: H05K9/0084 , H01L23/552 , H01L2224/16225 , H01L2924/12044 , H01L2924/15192 , H05K3/284 , H05K9/0092 , H05K2201/0715 , H05K2201/09509 , H01L2924/00
Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.
Abstract translation: 诸如集成电路的电气部件可以安装在印刷电路板上。 为了防止电气部件受到电磁干扰，可以在部件上形成射频屏蔽结构。 射频屏蔽结构可以由一层金属涂料形成。 组件可以被一层电介质覆盖。 可以在电路块之间的电介质中形成通道。 金属涂料可用于涂覆电介质的表面并填充通道。 可以在金属涂料的表面中形成开口以将射频屏蔽彼此分开。 印刷电路板表面上的导电迹线可用于将金属漆层连接到内部印刷电路板迹线。
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