公开(公告)号：US20130277824A1

公开(公告)日：2013-10-24

申请号：US13451930

申请日：2012-04-20

申请人： Joachim Mahler ,  Khalil Hosseini ,  Edward Fuergut ,  Manfred Mengel

发明人： Joachim Mahler ,  Khalil Hosseini ,  Edward Fuergut ,  Manfred Mengel

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L25/16 ,  H01L21/561 ,  H01L23/295 ,  H01L23/49805 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/743 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/245 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/27422 ,  H01L2224/27438 ,  H01L2224/2784 ,  H01L2224/27848 ,  H01L2224/29076 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/30505 ,  H01L2224/3201 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33505 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4814 ,  H01L2224/48151 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82101 ,  H01L2224/82104 ,  H01L2224/82105 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83951 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a method of manufacturing a semiconductor device, a first semiconductor element is mounted on a carrier. A b-stage curable polymer is deposited on the carrier. A second semiconductor element is affixed on the polymer.

摘要翻译： 在制造半导体器件的方法中，第一半导体元件安装在载体上。 在载体上沉积b级可固化聚合物。 第二个半导体元件固定在聚合物上。

公开(公告)号：US20120267784A1

公开(公告)日：2012-10-25

申请号：US13090092

申请日：2011-04-19

申请人： Khalil Hosseini ,  Manfred Mengel ,  Joachim Mahler

发明人： Khalil Hosseini ,  Manfred Mengel ,  Joachim Mahler

IPC分类号： H01L23/48 ,  C23C16/06 ,  B05D1/36 ,  C23C14/34 ,  C25D3/56 ,  C25D3/54 ,  C23C14/14 ,  B32B15/02 ,  B05D7/20 ,  B82Y30/00

CPC分类号： H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/43 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05017 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05179 ,  H01L2224/05184 ,  H01L2224/05558 ,  H01L2224/05564 ,  H01L2224/05679 ,  H01L2224/05681 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/29179 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/43826 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45664 ,  H01L2224/45679 ,  H01L2224/45681 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48879 ,  H01L2224/48881 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/013 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T428/2938 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor chip, a contact pad of the semiconductor chip and a first layer arranged over the contact pad. The first layer includes niobium, tantalum or an alloy including niobium and tantalum.

摘要翻译： 半导体器件包括半导体芯片，半导体芯片的接触焊盘和布置在接触焊盘上的第一层。 第一层包括铌，钽或包括铌和钽的合金。

公开(公告)号：US20120068364A1

公开(公告)日：2012-03-22

申请号：US12886851

申请日：2010-09-21

申请人： Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini

发明人： Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini

IPC分类号： H01L23/485 ,  H01L21/78 ,  H01L23/488

CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/0401

摘要： A device includes a semiconductor material having a first surface. A first material is applied to the first surface and a fiber material is embedded in the first material.

摘要翻译： 一种器件包括具有第一表面的半导体材料。 将第一材料施加到第一表面，并且将纤维材料嵌入第一材料中。

公开(公告)号：US11189537B2

公开(公告)日：2021-11-30

申请号：US13425589

申请日：2012-03-21

申请人： Khalil Hosseini ,  Joachim Mahler ,  Edward Fuergut

发明人： Khalil Hosseini ,  Joachim Mahler ,  Edward Fuergut

IPC分类号： H01L23/051 ,  H01L21/56 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

摘要： A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.

公开(公告)号：US08824145B2

公开(公告)日：2014-09-02

申请号：US13492751

申请日：2012-06-08

申请人： Khalil Hosseini ,  Joachim Mahler

发明人： Khalil Hosseini ,  Joachim Mahler

IPC分类号： H05K7/20

CPC分类号： F28D15/0233 ,  F28D15/02 ,  H01L23/427 ,  H01L23/473 ,  H01L23/492 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37028 ,  H01L2224/3703 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/37194 ,  H01L2224/37624 ,  H01L2224/37647 ,  H01L2224/37655 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/0781 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A system and method for manufacturing an electric device package are disclosed. An embodiment comprises a carrier, a component disposed on the carrier, the component having a first component contact pad, and a first electrical connection between the first component contact pad and a first carrier contact pad, wherein the first electrical connection comprises a first hollow space, the first hollow space comprising a first liquid.

摘要翻译： 公开了一种用于制造电子器件封装的系统和方法。 实施例包括载体，设置在载体上的部件，具有第一部件接触焊盘的部件和第一部件接触焊盘与第一载体接触焊盘之间的第一电连接，其中第一电连接包括第一中空空间 所述第一中空空间包括第一液体。

公开(公告)号：US20130264721A1

公开(公告)日：2013-10-10

申请号：US13440478

申请日：2012-04-05

申请人： Stefan Landau ,  Joachim Mahler ,  Khalil Hosseini ,  Ivan Nikitin ,  Thomas Wowra ,  Lukas Ossowski

发明人： Stefan Landau ,  Joachim Mahler ,  Khalil Hosseini ,  Ivan Nikitin ,  Thomas Wowra ,  Lukas Ossowski

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/563 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/27436 ,  H01L2224/2902 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/321 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/73253 ,  H01L2224/73269 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/8485 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： The electronic module includes a first carrier and a first semiconductor chip arranged on the first carrier. A second semiconductor chip is arranged above the first semiconductor chip. A material layer adheres the second semiconductor chip to the first carrier and encapsulates the first semiconductor chip.

摘要翻译： 电子模块包括第一载体和布置在第一载体上的第一半导体芯片。 第二半导体芯片布置在第一半导体芯片的上方。 材料层将第二半导体芯片粘附到第一载体并封装第一半导体芯片。

公开(公告)号：US20130127031A1

公开(公告)日：2013-05-23

申请号：US13301823

申请日：2011-11-22

申请人： Khalil Hosseini ,  Joachim Mahler ,  Anton Prueckl

发明人： Khalil Hosseini ,  Joachim Mahler ,  Anton Prueckl

IPC分类号： H01L23/495 ,  H01L21/768

CPC分类号： H01L23/49503 ,  H01L23/13 ,  H01L23/492 ,  H01L23/49513 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32257 ,  H01L2224/83192 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/014 ,  H01L2924/00014

摘要： Various embodiments provide a chip-carrier including, a chip-carrier surface configured to carry a first chip from a first chip bottom side, wherein a first chip top side of the first chip is configured above the chip-carrier surface; and at least one cavity extending into the chip-carrier from the chip-carrier surface; wherein the at least one cavity is configured to carry a second chip from a second chip bottom side, wherein a second chip top side of the second chip is substantially level with the first chip top side. The second chip is electrically insulated from the chip-carrier by an electrical insulation material inside the cavity.

摘要翻译： 各种实施例提供一种芯片载体，其包括：芯片载体表面，被配置为从第一芯片底侧承载第一芯片，其中第一芯片的第一芯片顶侧配置在芯片载体表面之上; 以及从所述芯片载体表面延伸到所述芯片载体中的至少一个空腔; 其中所述至少一个腔被配置为从第二芯片底侧承载第二芯片，其中所述第二芯片的第二芯片顶侧基本上与所述第一芯片顶侧平齐。 第二芯片通过腔内的电绝缘材料与芯片载体电绝缘。

公开(公告)号：US07834467B2

公开(公告)日：2010-11-16

申请号：US11692322

申请日：2007-03-28

申请人： Michael Bauer ,  Alfred Haimerl ,  Khalil Hosseini ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Khalil Hosseini ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/28 ,  H01L23/495

CPC分类号： H01L23/3142 ,  B82Y10/00 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S977/742 ,  Y10S977/785 ,  Y10S977/831 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.

摘要翻译： 一层改善了半导体器件中不同部件的界面之间的粘附。 第一部件的界面包括电路载体的表面，第二部件的界面包括塑料封装模塑料的接触表面。 粘附改善层包括聚合链分子和碳纳米管的混合物。

公开(公告)号：US07728415B2

公开(公告)日：2010-06-01

申请号：US11955710

申请日：2007-12-13

申请人： Khalil Hosseini ,  Alexander Koenigsberger ,  Ralf Otremba ,  Joachim Mahler ,  Xaver Schloegel ,  Klaus Schiess

发明人： Khalil Hosseini ,  Alexander Koenigsberger ,  Ralf Otremba ,  Joachim Mahler ,  Xaver Schloegel ,  Klaus Schiess

IPC分类号： H01L23/495 ,  H01L27/088

CPC分类号： H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L25/117 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A power semiconductor component stack, using lead technology with surface-mountable external contacts, includes at least two MOSFET power semiconductor components each having a top side and an underside. The underside includes: a drain external contact area, a source external contact area and a gate external contact area. The top side includes at least one source external contact area and a gate external contact area. The gate external contact areas on the top side and the underside are electrically connected to one another. The power semiconductor component stack is a series circuit or a parallel circuit of MOSFET power semiconductor components arranged one above another in a plastic housing composition.

摘要翻译： 使用具有表面可安装外部触点的引线技术的功率半导体元件堆叠包括至少两个MOSFET功率半导体元件，每个MOSFET功率半导体元件具有顶侧和下侧。 下侧包括：漏极外部接触区域，源极外部接触区域和栅极外部接触区域。 顶侧包括至少一个源极外部接触区域和栅极外部接触区域。 上侧和下侧的栅极外部接触区域彼此电连接。 功率半导体元件堆叠是在塑料外壳组合物中一个在另一个之上布置的MOSFET功率半导体元件的串联电路或并联电路。

公开(公告)号：US08835219B2

公开(公告)日：2014-09-16

申请号：US13529969

申请日：2012-06-21

申请人： Joachim Mahler ,  Khalil Hosseini

发明人： Joachim Mahler ,  Khalil Hosseini

IPC分类号： H01L23/34 ,  H01L23/48

CPC分类号： H01L24/29 ,  H01L23/16 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/45 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/83856 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/07812 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electric device and a method of making an electric device are disclosed. In one embodiment the electric device comprises a component comprising a component contact area and a carrier comprising a carrier contact area. The electric device further comprises a first conductive connection layer connecting the component contact area with the carrier contact area, wherein the first conductive connection layer overlies a first region of the component contact area and a second connection layer connecting the component contact area with the carrier contact area, wherein the second connection layer overlies a second region of the component contact area, and wherein the second connection layer comprises a polymer layer.

摘要翻译： 公开了电气设备和制造电气设备的方法。 在一个实施例中，电子装置包括包括部件接触区域的部件和包括载体接触区域的载体。 所述电气装置还包括将所述部件接触区域与所述载体接触区域连接的第一导电连接层，其中所述第一导电连接层覆盖所述部件接触区域的第一区域，以及将所述部件接触区域与所述载体接触点连接的第二连接层 区域，其中所述第二连接层覆盖所述部件接触区域的第二区域，并且其中所述第二连接层包括聚合物层。