公开(公告)号：US08065794B2

公开(公告)日：2011-11-29

申请号：US12239306

申请日：2008-09-26

申请人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

发明人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

IPC分类号： H05K3/02 ,  H01K3/22

CPC分类号： H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.

摘要翻译： 本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔 并且可以实现高可靠性的导体连接而不退火。 本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属 层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀 以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。

公开(公告)号：US08018046B2

公开(公告)日：2011-09-13

申请号：US12389456

申请日：2009-02-20

申请人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

发明人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

IPC分类号： H01L23/12 ,  H05K1/00 ,  H05K7/00

CPC分类号： H01R9/09 ,  H01L23/12 ,  H01L23/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/184 ,  H05K3/241 ,  H05K3/382 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T29/49155 ,  Y10T29/49194 ,  Y10T428/31504

摘要： A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.

摘要翻译： 一种印刷电路板，包括芯基板，形成在所述芯基板上并包括第一绝缘层的堆积层，形成在所述第一绝缘层上的导体层和形成在所述导体层上的第二绝缘层，以及一个或 在第一绝缘层上形成更多的布线图案。 导体层包括导体部分，并且导体部分分别具有跨越布线图案彼此面对的切口部分。

公开(公告)号：US07902659B2

公开(公告)日：2011-03-08

申请号：US12359663

申请日：2009-01-26

申请人： Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

发明人： Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K1/111 ,  H05K1/112 ,  H05K3/28 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T428/239

摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

摘要翻译： 一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。 导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

公开(公告)号：US07761984B2

公开(公告)日：2010-07-27

申请号：US12053237

申请日：2008-03-21

申请人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

发明人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

IPC分类号： H01K3/10

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10S430/146 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.

摘要翻译： 多层印刷电路板包括覆盖有导体层的基板，层间绝缘树脂层，层间绝缘树脂层上的蚀刻金属膜和通孔。 层间绝缘树脂层具有纤维基材。 通孔具有电解电镀膜和无电镀膜，并且连接板的导体层和蚀刻的金属膜。

公开(公告)号：US20090159327A1

公开(公告)日：2009-06-25

申请号：US12389456

申请日：2009-02-20

申请人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

发明人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

IPC分类号： H05K1/11 ,  H05K1/00

CPC分类号： H01R9/09 ,  H01L23/12 ,  H01L23/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/184 ,  H05K3/241 ,  H05K3/382 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T29/49155 ,  Y10T29/49194 ,  Y10T428/31504

摘要： A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.

摘要翻译： 一种印刷电路板，包括芯基板，形成在所述芯基板上并包括第一绝缘层的堆积层，形成在所述第一绝缘层上的导体层和形成在所述导体层上的第二绝缘层，以及一个或 在第一绝缘层上形成更多的布线图案。 导体层包括导体部分，并且导体部分分别具有跨越布线图案彼此面对的切口部分。

公开(公告)号：US20090145652A1

公开(公告)日：2009-06-11

申请号：US12239306

申请日：2008-09-26

申请人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

发明人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

IPC分类号： C23C18/31 ,  C25D5/00 ,  H01B13/00 ,  B05D5/12 ,  C09D5/10

CPC分类号： H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.

摘要翻译： 本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔 并且可以实现高可靠性的导体连接而不退火。 本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属 层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀 以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。

公开(公告)号：US07276319B2

公开(公告)日：2007-10-02

申请号：US10798200

申请日：2004-03-11

申请人： Naohiro Hirose ,  Asao Matsushima ,  Shiro Hirano ,  Hiroshi Yamazaki

发明人： Naohiro Hirose ,  Asao Matsushima ,  Shiro Hirano ,  Hiroshi Yamazaki

IPC分类号： G03G9/09

CPC分类号： G03G9/0819 ,  G03G9/0806 ,  G03G9/08797 ,  G03G9/09775

摘要： A toner for electrostatic latent image development includes a coloring agent and a resin wherein the toner is formed by a polymerization method and a content of aromatic amine contained in the toner is 50 ppm or less, and a volume average particle size of the toner is 3 to 8 μm; and an image forming method employs the same toner.

摘要翻译： 用于静电潜像显影的调色剂包括着色剂和树脂，其中通过聚合方法形成调色剂，并且调色剂中所含的芳族胺的含量为50ppm以下，调色剂的体积平均粒径为3 至8岁 并且图像形成方法使用相同的调色剂。

公开(公告)号：US20050069802A1

公开(公告)日：2005-03-31

申请号：US10951221

申请日：2004-09-27

申请人： Naohiro Hirose ,  Ken Ohmura ,  Meizo Shirose

发明人： Naohiro Hirose ,  Ken Ohmura ,  Meizo Shirose

IPC分类号： G03G9/08 ,  G03G9/087 ,  G03G9/097

CPC分类号： G03G9/08711 ,  G03G9/0804 ,  G03G9/0806 ,  G03G9/0819 ,  G03G9/0821 ,  G03G9/08728 ,  G03G9/09708

摘要： A toner for electrostatic latent image development contains a toner particle having a median diameter (d50) in number standard of 2.5 μm to 7.5 μm, acrylate of less than 12 ppm and aliphatic alcohol of 4 to 12 carbons of 40 ppm to 300 ppm.

摘要翻译： 用于静电潜像显影的调色剂含有数量标准为2.5μm至7.5μm，丙烯酸酯小于12ppm的中值粒径（d50）和4至12个碳原子的脂肪族醇为40ppm至300ppm的调色剂颗粒。

公开(公告)号：US06689524B2

公开(公告)日：2004-02-10

申请号：US10163961

申请日：2002-06-05

申请人： Ken Ohmura ,  Naohiro Hirose ,  Hiroshi Yamazaki

发明人： Ken Ohmura ,  Naohiro Hirose ,  Hiroshi Yamazaki

IPC分类号： G03G1520

CPC分类号： G03G9/08711 ,  G03G9/0821 ,  G03G9/08708 ,  G03G9/08791 ,  G03G9/08795 ,  G03G9/08797

摘要： The present invention relates to a toner for developing a static latent image, wherein a smell of the toner has a cos &thgr; of from 0.990 to 0.998 as to the smell of styrene and a cos &thgr; of from 0.986 to 0.994 as to the smell of n-butyl acrylate in the smell space formed by styrene and n-butyl acrylate, and a toner for developing a static latent image, wherein a smell of the toner has a cos &thgr; of from 0.990 to 0.998 as to the smell of styrene and a cos &thgr; of from 0.991 to 0.999 as to the smell of mercaptocarboxylic acid ester in the smell space formed by styrene and mercaptocarboxylic acid ester.

摘要翻译： 本发明涉及一种用于显影静电潜像的调色剂，其中调色剂的气味关于苯乙烯的气味的cosθ为0.990至0.998，而对于n的气味为cos，其cos cos为0.986至0.994 苯乙烯和丙烯酸正丁酯形成的气味空间中的丙烯酸丁酯和用于显影静电潜像的调色剂，其中调色剂的气味对于苯乙烯的气味为cos0.990〜0.998，cos 在由苯乙烯和巯基羧酸酯形成的气味空间中的巯基羧酸酯的气味为0.991至0.999。

公开(公告)号：US08282720B2

公开(公告)日：2012-10-09

申请号：US12647644

申请日：2009-12-28

申请人： Natsuko Kusaka ,  Naohiro Hirose ,  Hiroyuki Yasukawa

发明人： Natsuko Kusaka ,  Naohiro Hirose ,  Hiroyuki Yasukawa

IPC分类号： C09D11/02 ,  C09B47/04

CPC分类号： C09B69/008 ,  C09D11/322

摘要： A cyan ink for inkjet recording comprising at least one of a phthalocyanine compound represented by Formula (1) and a phthalocyanine compound represented by Formula (2), Z being represented by Formula (3):

摘要翻译： 一种用于喷墨记录的青色油墨，其包含由式（1）表示的酞菁化合物和由式（2）表示的酞菁化合物中的至少一种，Z由式（3）表示：