公开(公告)号：US08232113B2

公开(公告)日：2012-07-31

申请号：US12990684

申请日：2009-05-20

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： G01R31/26

CPC分类号： G01R31/2884 ,  G01R1/0408 ,  G01R31/2822 ,  H01L22/32 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L2224/03 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/11 ,  H01L2924/00

摘要： A method for manufacturing and for testing an integrated circuit, including the steps of forming, on the upper portion of the integrated circuit, a passivation layer including openings at the level of metal tracks of the last interconnect stack of the integrated circuit; forming, in the openings, first pads connected to second pads formed on the passivation layer by conductive track sections, the first pads being intended for the connection of the integrated circuit; testing the integrated circuit by bringing test tips in contact with the second pads; and eliminating at least a portion of at least one of the conductive track sections.

摘要翻译： 一种用于制造和测试集成电路的方法，包括以下步骤：在所述集成电路的上部形成钝化层，所述钝化层包括在所述集成电路的最后互连叠层的金属轨道的水平面处的开口; 在开口中形成通过导电轨道部分连接到形成在钝化层上的第二焊盘的第一焊盘，第一焊盘用于连接集成电路; 通过将测试头与第二个焊盘接触来测试集成电路; 以及消除所述导电轨道部分中的至少一个的至少一部分。

公开(公告)号：US20120104454A1

公开(公告)日：2012-05-03

申请号：US13241382

申请日：2011-09-23

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： H01L33/52 ,  H01L33/48 ,  H01L31/18 ,  H01L31/0203

CPC分类号： H01L31/02161 ,  G02B7/025 ,  G02B13/0085 ,  H01L31/0203 ,  H01L31/02325

摘要： An optical device includes at least one optical die (4) that is embedded, at least peripherally, in a plate made of an encapsulation material so that the optical die may transmit light, from one side of the plate to the other. An electronic package is formed by a semiconductor device which includes at least one optical, integrated-circuit chip with the optical device placed so that the optical die lies above optical integrated circuits formed in or on the integrated circuit chip. The optical device is attached onto the semiconductor device.

摘要翻译： 光学装置包括至少一个光学管芯（4），其至少外围地嵌入由封装材料制成的板中，使得光学管芯可以将光从板的一侧传输到另一侧。 电子封装由半导体器件形成，该半导体器件包括至少一个光学集成电路芯片，光学器件被放置成使得光学管芯位于形成在集成电路芯片中或其上的光学集成电路之上。 光学器件附着在半导体器件上。

公开(公告)号：US20120061849A1

公开(公告)日：2012-03-15

申请号：US13229924

申请日：2011-09-12

申请人： Romain Coffy ,  Yann Guillou

发明人： Romain Coffy ,  Yann Guillou

IPC分类号： H01L23/48

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/42 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/14519 ,  H01L2224/17519 ,  H01L2224/2518 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A first component includes a slice formed from an integrated circuit chip having a front face and a rear face. An encapsulation block encapsulates the integrated circuit chip such that front and rear faces of the chip and front and rear faces of the encapsulation block are co-planar to form front and rear faces of the slice. Front and rear electrical connection networks are provided on the front and rear faces, respectively, with the electrical connection networks linked by electrical connection vias passing through the encapsulation block. A thermal transfer layer at least partially covers the rear face. A second component may be behind and at a distance from the first component. Connection elements interposed between the first component and the second component include both thermal connection elements in contact with the thermal transfer layer and electrical connection elements interconnecting the first and second components.

摘要翻译： 第一部件包括由具有前表面和后表面的集成电路芯片形成的切片。 封装块封装集成电路芯片，使得芯片的前表面和后表面以及封装块的前后表面是共面的，以形成切片的前后面。 前后电气连接网络分别设置在前表面和后表面上，电连接网络通过通过封装块的电连接通孔连接。 至少部分地覆盖后表面的热转印层。 第二组件可以在第一组件的后面并且距离第一组件一定距离。 插入在第一部件和第二部件之间的连接元件包括与热传递层接触的热连接元件和互连第一和第二部件的电连接元件。

公开(公告)号：US20120025348A1

公开(公告)日：2012-02-02

申请号：US13179640

申请日：2011-07-11

申请人： Laurent Marechal ,  Yvon Imbs ,  Romain Coffy

发明人： Laurent Marechal ,  Yvon Imbs ,  Romain Coffy

IPC分类号： H01L23/28 ,  H01L29/92 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/5383 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/18 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19105 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10674 ,  H05K2203/1469 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor device includes a wafer having a frontside and a backside. The wafer is formed from at least one integrated circuit chip having an electrical connection frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. A passive component including at least one conductive plate and a dielectric plate is positioned adjacent the integrated circuit chip. An encapsulation block embeds the integrated circuit chip and the passive component, the block having a frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. An electrical connection is made between the electrical connection frontside and the passive component. That electrical connection includes connection lines placed on the wafer frontside and wafer backside. The electrical connection further includes at least one via passing through the encapsulation block.

摘要翻译： 半导体器件包括具有前侧和后侧的晶片。 晶片由至少一个集成电路芯片形成，该集成电路芯片具有与晶片前侧共面的电连接，以及与晶片背面共面的背面。 包括至少一个导电板和电介质板的无源部件位于集成电路芯片附近。 封装块嵌入集成电路芯片和无源部件，该块具有与晶片前侧共面的前侧和与晶片背面共面的背面。 在电连接前端和被动部件之间进行电连接。 该电连接包括放置在晶片正面和晶片背面上的连接线。 电连接还包括至少一个通过封装块的通孔。

公开(公告)号：US20110248397A1

公开(公告)日：2011-10-13

申请号：US13130169

申请日：2009-11-10

申请人： Romain Coffy ,  Remi Brechignac ,  Carlo Cognetti De Martiis

发明人： Romain Coffy ,  Remi Brechignac ,  Carlo Cognetti De Martiis

IPC分类号： H01L25/065 ,  H01L21/98 ,  H01L23/538

CPC分类号： H01L25/50 ,  H01L21/565 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2224/0401

摘要： A semiconductor device includes at least one first component (5) (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer (2) is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer (8) is formed on the front face of the first component and on the first face of the support layer. An electrical connection network (9) within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component (11) (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network. Electrical connection vias (17) pass through the support layer and selectively connect the electrical connection network to an external electrical connection formed on a second face of the support layer.

摘要翻译： 半导体器件包括至少一个第一部件（5）（例如，第一集成电路），其具有设置有电连接焊盘的正面。 第一部件嵌入在支撑层（2）中，是使得第一部件的前表面不被覆盖并平行于支撑层的第一面的位置。 在第一部件的正面和支撑层的第一面上形成中间层（8）。 中间层内的电连接网络（9）选择性地连接到第一部件的电连接焊盘。 该装置还包括至少一个第二部件（11）（例如，第二集成电路，其中一个面放置在中间层的上方，并且具有选择性地连接到电连接网络的电连接焊盘）。电连接通孔（17）通过 通过支撑层并且将电连接网络选择性地连接到形成在支撑层的第二面上的外部电连接。

公开(公告)号：US20100244249A1

公开(公告)日：2010-09-30

申请号：US12751088

申请日：2010-03-31

申请人： Romain Coffy ,  Jean-François Sauty

发明人： Romain Coffy ,  Jean-François Sauty

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L23/00

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/02126 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/274 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/85375 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01202 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/20752 ,  Y10T29/49126 ,  H01L2224/85 ,  H01L2924/01204 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package includes a semiconductor die attached to a support having electrically conductive paths, the semiconductor die having a bond-pad electrically connected to the electrically a conductive path on the support by a wire-bond of a first metallic composition, the wire-bond and the bond-pad being coated with a protection layer of a second metallic composition.

摘要翻译： 半导体封装包括附接到具有导电路径的支撑件的半导体管芯，所述半导体管芯具有通过第一金属组合物的引线键与支撑件上的导电路径电连接的接合焊盘，所述引线接合 并且所述接合垫涂覆有第二金属组合物的保护层。

公开(公告)号：US20070114654A1

公开(公告)日：2007-05-24

申请号：US11601569

申请日：2006-11-17

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： H01L23/12

CPC分类号： H01L25/105 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable semiconductor package includes a board having first electrical connections, an integrated circuit chip fixed on a front face of the board, second electrical connections which connect the chip to the first electrical connections of the board and front electrical contact terminals arranged beyond at least one edge of the chip on the front face of this board. An encapsulation block of a coating material is formed on the front face of the board and encapsulates the chip, its electrical connections and the front terminals. The block has at least one opening which at least partially uncovers the front terminals with a view to receiving electrical connection beads of a stacked second package. This one opening is preferably in the form of a groove.

摘要翻译： 可堆叠的半导体封装包括具有第一电连接的板，固定在板的前面上的集成电路芯片，将芯片连接到板的第一电连接和布置在至少一个以上的前电接触端子的第二电连接 芯片的边缘在该板的正面上。 涂层材料的封装块形成在板的正面，并封装芯片，其电气连接和前端子。 该块具有至少一个开口，其至少部分地露出前端子，以接收堆叠的第二封装的电连接珠。 该一个开口优选为凹槽的形式。

公开(公告)号：US09136292B2

公开(公告)日：2015-09-15

申请号：US13541066

申请日：2012-07-03

申请人： Romain Coffy ,  Remi Brechignac

发明人： Romain Coffy ,  Remi Brechignac

IPC分类号： H01L27/00 ,  H01L27/146 ,  G01S7/481 ,  G01S17/02 ,  H01L25/16 ,  H01L31/167 ,  H01L31/173 ,  H01L33/48 ,  H01L33/54

CPC分类号： H01L27/14618 ,  G01S7/4813 ,  G01S17/026 ,  H01L25/167 ,  H01L27/14603 ,  H01L27/14643 ,  H01L27/14647 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/167 ,  H01L31/173 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic package includes a substrate wafer having front and rear faces. An emitting integrated circuit chip is mounted to the front face of the substrate wafer and includes a light radiation optical emitter. A receiving integrated circuit chip is also mounted to the front face of the substrate wafer and includes at least one light radiation optical sensor. A transparent encapsulant extends above the optical sensor and the optical emitter. An opaque encapsulant encapsulates the transparent encapsulant. The opaque encapsulant has a front window situated above the optical emitter and which is offset laterally relative to the optical sensor. The transparent encapsulant accordingly has an uncovered front face situated above the optical emitter and offset laterally relative to the optical sensor. The opaque encapsulant may include an additional front window. The receiving integrated circuit chip further includes a second optical sensor situated opposite the additional front window.

摘要翻译： 电子封装包括具有正面和背面的衬底晶片。 发光集成电路芯片安装在基板晶片的正面，并包括光辐射光发射器。 接收集成电路芯片也安装在基板晶片的正面，并且包括至少一个光辐射光学传感器。 透明密封剂在光学传感器和光发射器之上延伸。 不透明的密封剂封装透明密封剂。 不透明密封剂具有位于光发射器上方并且相对于光学传感器横向偏移的前窗。 因此，透明密封剂具有位于光发射器上方并且相对于光学传感器横向偏移的未覆盖的正面。 不透明的密封剂可以包括另外的前窗。 接收集成电路芯片还包括与附加前窗相对的第二光学传感器。

公开(公告)号：US08847243B2

公开(公告)日：2014-09-30

申请号：US13433447

申请日：2012-03-29

申请人： Romain Coffy ,  Emmanuelle Vigier-Blanc

发明人： Romain Coffy ,  Emmanuelle Vigier-Blanc

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00 ,  H01L31/0203 ,  H01L27/146 ,  H01L21/00 ,  H01L31/167 ,  H01L25/16 ,  G01S17/02 ,  H01L31/0216 ,  H01L31/173 ,  G01S7/481

CPC分类号： G01S7/4813 ,  G01S17/026 ,  H01L25/167 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/167 ,  H01L31/173 ,  H01L2224/16225

摘要： A semiconductor package includes a transmissive support plate and includes at least one elongate hole. An integrated circuit semiconductor device is mounted on a rear face of the support plate. The semiconductor device includes first and second optical elements oriented towards the rear face of the support plate, where the first and second optical elements are placed on either side of the elongate hole. An encapsulation material made of an opaque material encapsulates the semiconductor device and fills the elongate hole so as to form an optical insulation partition between the first and second optical elements. A cavity is left, however, between each optical element and a rear face of the support plate.

摘要翻译： 半导体封装包括透射支撑板并且包括至少一个细长孔。 集成电路半导体器件安装在支撑板的后表面上。 半导体器件包括朝向支撑板的后表面定向的第一和第二光学元件，其中第一和第二光学元件被放置在细长孔的任一侧上。 由不透明材料制成的封装材料封装半导体器件并填充细长孔，以在第一和第二光学元件之间形成光绝缘分隔。 然而，在每个光学元件和支撑板的后表面之间留有空腔。

公开(公告)号：US08482116B2

公开(公告)日：2013-07-09

申请号：US13130169

申请日：2009-11-10

申请人： Romain Coffy ,  Remi Brechignac ,  Carlo Cognetti de Martiis

发明人： Romain Coffy ,  Remi Brechignac ,  Carlo Cognetti de Martiis

IPC分类号： H01L23/04

CPC分类号： H01L25/50 ,  H01L21/565 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2224/0401

摘要： A semiconductor device includes at least one first component (5) (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer (2) is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer (8) is formed on the front face of the first component and on the first face of the support layer. An electrical connection network (9) within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component (11) (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network. Electrical connection vias (17) pass through the support layer and selectively connect the electrical connection network to an external electrical connection formed on a second face of the support layer.

摘要翻译： 半导体器件包括至少一个第一部件（5）（例如，第一集成电路），其具有设置有电连接焊盘的正面。 第一部件嵌入在支撑层（2）中，是使得第一部件的前表面不被覆盖并平行于支撑层的第一面的位置。 在第一部件的正面和支撑层的第一面上形成中间层（8）。 中间层内的电连接网络（9）选择性地连接到第一部件的电连接焊盘。 该装置还包括至少一个第二部件（11）（例如，第二集成电路，其中一个面放置在中间层的上方，并且具有选择性地连接到电连接网络的电连接焊盘）。电连接通孔（17）通过 通过支撑层并且将电连接网络选择性地连接到形成在支撑层的第二面上的外部电连接。