公开(公告)号：US6044548A

公开(公告)日：2000-04-04

申请号：US038366

申请日：1998-03-10

申请人： Thomas H. Distefano ,  John W. Smith, Jr.

发明人： Thomas H. Distefano ,  John W. Smith, Jr.

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/10 ,  H01L21/486 ,  H01L21/4885 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19042 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49208

摘要： A method of making connections to a microelectronic unit includes the steps of providing a connection component having a flexible dielectric top sheet, a plurality of terminals on the top sheet and a plurality of electrically conductive, elongated flexible leads connected to the terminals and extending side-by-side downwardly from the terminals away from the top sheet to bottom ends remote from the top sheet. The connection component is then engaged with a front surface of a microelectronic unit having an array of contacts thereon while subjecting the connection component and the microelectronic unit to heat and pressure so that bottom ends of the leads remote from the top sheet bond with the contacts on the microelectronic unit to form electrical connections therewith.

摘要翻译： 制造与微电子单元的连接的方法包括以下步骤：提供具有柔性电介质顶片的连接部件，顶片上的多个端子和连接到端子的多个导电细长柔性引线， 从端子向上离开顶片到远离顶片的底端。 然后，连接部件与具有触点阵列的微电子单元的前表面接合，同时对连接部件和微电子单元进行加热和压力，使得远离顶片的引线的底端与触点接合在一起 微电子单元与其形成电连接。

公开(公告)号：US5685885A

公开(公告)日：1997-11-11

申请号：US319966

申请日：1994-10-07

申请人： Igor Y. Khandros ,  Thomas H. Distefano

发明人： Igor Y. Khandros ,  Thomas H. Distefano

IPC分类号： H01L21/60 ,  H01L21/822 ,  H01L21/98 ,  H01L23/13 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/58 ,  H01L25/065 ,  H01L25/16 ,  H05K3/30

CPC分类号： H01L21/6836 ,  H01L21/822 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/485 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171

摘要： Semiconductor chip assemblies are fabricated by assembling flexible, sheetlike elements bearing terminals to a wafer, connecting the terminals of each sheetlike element to contacts on the chip, and subsequently severing the chips from the wafer to provide individual assemblies. Each assembly includes a sheetlike element and a chip, arranged so that the terminals on the flexible element.

摘要翻译： 半导体芯片组件通过将带有端子的柔性片状元件组装到晶片，将每个片状元件的端子连接到芯片上的触点，并且随后从晶片切断芯片以提供单独的组件来制造半导体芯片组件。 每个组件包括片状元件和芯片，其布置成使得柔性元件上的端子。

公开(公告)号：US5390844A

公开(公告)日：1995-02-21

申请号：US96700

申请日：1993-07-23

申请人： Thomas H. Distefano ,  Igor Y. Khandros ,  Gaetan Mathiew ,  Jason Sweis ,  John Grange ,  Gary W. Grube

发明人： Thomas H. Distefano ,  Igor Y. Khandros ,  Gaetan Mathiew ,  Jason Sweis ,  John Grange ,  Gary W. Grube

IPC分类号： H01L21/60 ,  B23K20/02 ,  B23K20/10 ,  H01L21/00 ,  H01L21/603 ,  H05K3/32

CPC分类号： H01L21/67138 ,  B23K20/025 ,  B23K20/106 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01082

摘要： A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.

摘要翻译： 用于将内部引线键合到半导体芯片的接合工具被布置成捕获和对准沿多个方向中的任一个延伸的细长引线部分，优选地在两个相互正交的方向中的任一个方向上对准。 因此，即使在多个方向上引线延伸的情况下，该工具也可以应用于将所有引线对齐并将其结合到芯片上而不转动工具或芯片。

公开(公告)号：US06388340B2

公开(公告)日：2002-05-14

申请号：US09950132

申请日：2001-09-10

申请人： Thomas H. Distefano

发明人： Thomas H. Distefano

IPC分类号： H01L2328

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor chip package, and a method of making such a package, including a flexible dielectric element with a plurality of electrically conductive terminals, an expander ring connected to the flexible dielectric element, a semiconductor chip disposed with a central opening in the expander ring, and fan-in and fan-out leads connecting the terminals to contacts on the semiconductor chip. The package also has an elastomer encapsulant disposed in the gap between the expander ring and the semiconductor chip. The size of the gap is controlled to minimize the pressure exerted on the leads by the elastomer as it expands and contracts in response to changes in temperature. The semiconductor chip and expander ring may also be connected to a heat sink or thermal spreader with a compliant adhesive.

公开(公告)号：US06354485B1

公开(公告)日：2002-03-12

申请号：US09385324

申请日：1999-08-30

申请人： Thomas H. Distefano

发明人： Thomas H. Distefano

IPC分类号： B23K3102

CPC分类号： H01L23/3121 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05664

摘要： A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding contacts overlying the front face of the chip. The flange bonding contacts are coplanar with the chip bonding contacts, or can be brought into coplanar alignment by flexure of the cap. The package can be surface-mounted to a circuit board by placing the package onto pads of solder paste, and then heating the assembly to melt the solder paste in order to join the bonding contacts on the chip and on the flange to corresponding contacts on the circuit board.

摘要翻译： 热增强半导体封装包括金属板盖，其具有设置有用于可靠地附接到电路板的焊接触点的柔性凸缘。 封装组件还包括具有面向前的接触轴承前表面的半导体芯片，以及覆盖在芯片前表面上的芯片接合触点。 凸缘接合触点与芯片接合触点共面，或者可以通过盖的挠曲而被共同对准。 通过将封装放置在焊膏垫上，将封装表面安装到电路板上，然后加热组件以熔化焊膏，以便将芯片上的接合触点和法兰上的接合触点连接到 电路板。

公开(公告)号：US06329224B1

公开(公告)日：2001-12-11

申请号：US09067698

申请日：1998-04-28

申请人： Tan Nguyen ,  Craig S. Mitchell ,  Thomas H. Distefano

发明人： Tan Nguyen ,  Craig S. Mitchell ,  Thomas H. Distefano

IPC分类号： H01L2144

CPC分类号： H01L21/565 ,  H01L21/56 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00

摘要： Microelectronic assemblies are encapsulated using disposable frames. The microelectronic assemblies are disposed within an aperture defined by a frame. The aperture is covered by top and bottom sealing layers so that the frame and sealing layers define an enclosed space encompassing the assemblies. The encapsulant is injected into this closed space. The frame is then separated from the encapsulation fixture and held in a curing oven. After cure, the frame is cut apart and the individual assemblies are severed from one another. Because the frame need not be held in the encapsulation fixture during curing, the process achieves a high throughput.

摘要翻译： 微电子组件使用一次性框架进行封装。 微电子组件设置在由框架限定的孔内。 孔被顶部和底部密封层覆盖，使得框架和密封层限定包围组件的封闭空间。 将密封剂注入该封闭空间。 然后将框架与封装固定装置分离并固定在固化炉中。 固化后，将框架切开，并将各个组件彼此切断。 因为在固化期间框架不需要保持在封装夹具中，所以该工艺实现了高的生产量。

公开(公告)号：US06247228B1

公开(公告)日：2001-06-19

申请号：US08989305

申请日：1997-12-12

申请人： Thomas H. Distefano ,  Joseph Fjelstad

发明人： Thomas H. Distefano ,  Joseph Fjelstad

IPC分类号： H05K336

CPC分类号： H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

公开(公告)号：US06218215B1

公开(公告)日：2001-04-17

申请号：US09520357

申请日：2000-03-07

申请人： Thomas H. Distefano ,  Craig S. Mitchell

发明人： Thomas H. Distefano ,  Craig S. Mitchell

IPC分类号： H01L2144

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of making a semiconductor chip package by attaching a chip to a dielectric layer; placing the dielectric layer and chip into a mold; disposing a thixotropic composition that has bee sheared to reduced its viscosity into the mold and curing the thixotropic composition after the chip and dielectric layer have been removed from the mold. A method of making a semiconductor chip package without using a mold by disposing a sheared thixotropic composition between a semiconductor chip and a dielectric layer and then curing the thixotropic composition to form a cured encapsulant. A method of making a semiconductor chip package without using a mold during the curing step and without the need to use a thixotropic composition by placing a semiconductor chip attached to a dielectric layer into a mold and disposing a liquid composition between the chip and the dielectric layer, forming a cured skin on the liquid composition, removing the work-piece from the mold and then completely the cure of the liquid composition.

摘要翻译： 一种通过将芯片附着到电介质层来制造半导体芯片封装的方法; 将介电层和芯片放置在模具中; 在将芯片和电介质层从模具中除去之后，设置具有剪切力的触变组合物以将其粘度降低到模具中并固化触变组合物。一种制备半导体芯片封装而不使用模具的方法是通过设置剪切的触变 在半导体芯片和电介质层之间的组成，然后固化触变组合物以形成固化的密封剂。一种在固化步骤期间不使用模具制造半导体芯片封装的方法，并且不需要通过将半导体芯片 将电介质层附着到模具中并在芯片和电介质层之间设置液体组合物，在液体组合物上形成固化的皮肤，从模具中除去工件，然后完全固化液体组合物。

公开(公告)号：US06202297B1

公开(公告)日：2001-03-20

申请号：US09079336

申请日：1998-05-14

申请人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

发明人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H05K330

CPC分类号： H05K7/1084 ,  H01R12/714 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

摘要： A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.

摘要翻译： 具有凸起引线的微电子器件的连接器和用于制造和使用连接器的方法。 电介质基板具有从前表面向上延伸的多个柱。 柱可以以每组在其间限定间隙的柱组的排列布置。 大体层状接触从每个顶部延伸。 凸块引线各自插入在相应的间隙内，从而使其接触，当其继续插入时，触头抵靠凸起引线。 通常，当凸块引线插入到间隙中时，触头的远端部分向下偏转朝向基板并向外远离间隙的中心。

公开(公告)号：US6133627A

公开(公告)日：2000-10-17

申请号：US984615

申请日：1997-12-03

申请人： Igor Y. Khandros ,  Thomas H. Distefano

发明人： Igor Y. Khandros ,  Thomas H. Distefano

IPC分类号： H01L21/60 ,  H01L21/822 ,  H01L21/98 ,  H01L23/13 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/58 ,  H01L25/16 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L21/6836 ,  H01L21/822 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/50 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K2201/10378

摘要： A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.

摘要翻译： 在其顶表面的中心区域上具有触点的半导体芯片设置有覆盖在顶表面的中心部分上的电介质元件。 电介质元件具有面向芯片的第一表面和背离芯片的第二表面，包围中心触点的孔和限定孔的边缘。 中心接触引线从芯片上的中心触点延伸到介质元件上的中心端子。 电介质元件上的端子可以使用通常用于电气装置的表面安装（例如焊接）的技术连接到基板。 引线，优选地介电元件是柔性的，使得端子可相对于芯片上的触点移动，以补偿芯片和基板的不同的热膨胀。 电介质元件可以设置有设置在端子和芯片之间的柔性层。 整个组件紧凑。