公开(公告)号：US08151457B2

公开(公告)日：2012-04-10

申请号：US12152600

申请日：2008-05-14

Applicant: Bernard Harold Hammond, Jr. ,  David Patrick Murray ,  Ian Robert George

Inventor： Bernard Harold Hammond, Jr. ,  David Patrick Murray ,  Ian Robert George

IPC: H01R43/00

CPC classification number: H01R13/6466 ,  H01R4/2416 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49117 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

Abstract translation: 本公开涉及一种电信插孔，其包括具有用于接收插头的端口的壳体。 千斤顶还包括多个接触弹簧，其适于当插头插入壳体的端口时与插头电接触，以及多个用于将插线端接到插座的导线终端触头。 千斤顶还包括将接触弹簧电连接到导线终端触点的电路板。 电路板包括用于减少插座处串扰的多区串扰补偿装置。

公开(公告)号：US20110057742A1

公开(公告)日：2011-03-10

申请号：US12557382

申请日：2009-09-10

Applicant: Robert C. Frye ,  Kai Liu

Inventor： Robert C. Frye ,  Kai Liu

IPC: H01P5/10 ,  H03H7/01 ,  H05K3/10 ,  H01P5/18

CPC classification number: H01L27/01 ,  H01L21/70 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01P5/10 ,  H03H7/48 ,  H05K1/0233 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/165 ,  H05K2201/09245 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device has a substrate and RF coupler formed over the substrate. The RF coupler has a first conductive trace with a first end coupled to a first terminal of the semiconductor device, and a second conductive trace with a first end coupled to a second terminal of the semiconductor device. The first conductive trace is placed in proximity to a first portion of the second conductive trace. An integrated passive device is formed over the substrate. A second portion of the second conductive trace operates as a circuit component of the integrated passive device. The integrated passive device can be a balun or low-pass filter. The RF coupler also has a first capacitor coupled to the first terminal of the semiconductor device, and second capacitor coupled to a third terminal of the semiconductor device for higher directivity. The second conductive trace is wound to exhibit an inductive property.

Abstract translation: 半导体器件具有在衬底上形成的衬底和RF耦合器。 RF耦合器具有第​​一导电迹线，其第一端耦合到半导体器件的第一端子，第二导电迹线具有耦合到半导体器件的第二端子的第一端。 第一导电迹线放置在第二导电迹线的第一部分附近。 在衬底上形成集成的无源器件。 第二导电迹线的第二部分用作集成无源器件的电路部件。 集成的无源器件可以是平衡 - 不平衡转换/低通滤波器。 RF耦合器还具有耦合到半导体器件的第一端子的第一电容器，并且耦合到半导体器件的第三端子的第二电容器用于更高的方向性。 第二导电迹线被卷绕以呈现感应特性。

公开(公告)号：US20110041331A1

公开(公告)日：2011-02-24

申请号：US12916687

申请日：2010-11-01

Applicant: Jack E. Caveney ,  Masud Bolouri-Saransar ,  Scott M. Lesniak

Inventor： Jack E. Caveney ,  Masud Bolouri-Saransar ,  Scott M. Lesniak

IPC: H01R43/00

CPC classification number: H01R24/64 ,  H01R4/2429 ,  H01R4/2433 ,  H01R12/592 ,  H01R12/62 ,  H01R12/675 ,  H01R12/775 ,  H01R13/46 ,  H01R13/502 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6467 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/62 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09245 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/49222

Abstract: An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

Abstract translation: 用于模块化通信连接器的插座中的串扰补偿的装置和方法包括连接到插座触点和连接到网络电缆的柔性印刷电路板。 柔性印刷电路板包括布置成一个或多个耦合以提供串扰补偿的导电迹线。

公开(公告)号：US20100300732A1

公开(公告)日：2010-12-02

申请号：US12511286

申请日：2009-07-29

Applicant: QI-JIE CHEN

Inventor： QI-JIE CHEN

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H05K2201/09245 ,  H05K2201/097

Abstract: A multi-layer printed circuit board includes a first trace layer and a second trace layer. The second trace layer and the first trace layer are located on parallel horizontal planes. A first group of traces is laid on the first trace layer. A second group of traces is laid on the second trace layer. The second group of traces and the first group of traces are positioned on up and down positions of the first trace layer and the second trace layer. The first group of traces and the second group of traces extend in different directions.

Abstract translation: 多层印刷电路板包括第一迹线层和第二迹线层。 第二迹线层和第一迹线层位于平行水平面上。 第一组迹线放置在第一个迹线层上。 第二组轨迹铺设在第二个轨迹层上。 第二组迹线和第一组迹线位于第一迹线层和第二迹线层的上下位置。 第一组轨迹和第二组轨迹沿不同方向延伸。

公开(公告)号：US07812444B2

公开(公告)日：2010-10-12

申请号：US11521156

申请日：2006-09-14

Applicant: Masashi Katsumata ,  Kenichi Kawabata ,  Toshikazu Endo

Inventor： Masashi Katsumata ,  Kenichi Kawabata ,  Toshikazu Endo

IPC: H01L23/34

CPC classification number: H01L25/18 ,  H01L23/5386 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/0715 ,  H05K2201/086 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09618 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10674

Abstract: A semiconductor IC-embedded module 100 comprises a multilayer substrate 101 having first and second insulating layers 101a and 101b, and a controller IC 012 and memory IC 103 that are embedded in the multilayer substrate 101. A wiring layer 104 is formed as an internal layer in the multilayer substrate 101. Part of the wiring layer 104 constitutes a bus line 104X. The controller IC 102 or memory IC 103 is embedded in the second insulating layer 101b. First and second ground layers 105a and 105b are provided respectively in the first and second insulating layers 101a and 101b. The effect of noise generated by bus lines is reduced, and an additional reduction in noise and a decrease in size and thickness are achieved by laying out bus lines that connect the semiconductor ICs so that distances are minimized.

Abstract translation: 半导体IC嵌入式模块100包括具有嵌入在多层基板101中的第一绝缘层101a和第二绝缘层101b以及控制器IC 012和存储器IC 103的多层基板101.布线层104形成为内层 在多层基板101中。布线层104的一部分构成总线104X。 控制器IC 102或存储器IC 103嵌入在第二绝缘层101b中。 第一和第二接地层105a和105b分别设置在第一和第二绝缘层101a和101b中。 由总线产生的噪声的影响减小，通过布置连接半导体IC的总线，使得距离最小化，可以实现额外的噪声降低和尺寸和厚度的减小。

公开(公告)号：US07779538B2

公开(公告)日：2010-08-24

申请号：US11917527

申请日：2006-06-21

Applicant: Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

Inventor： Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

IPC: H05K3/36

CPC classification number: H05K3/365 ,  H01L2224/73204 ,  H01L2224/83101 ,  H05K1/117 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49195

Abstract: A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

Abstract translation: 一种用于连接电路板的方法，包括：（i）制备具有分配给多个导体布线的端部的连接部分的第一电路板和具有分配给多个导体布线的相应端部的连接部分的第二电路板 ; （ii）将第一电路板的连接部分设置成与电路板的连接部分之间的热固性粘合膜面对第二电路板的连接部分; 和（iii）对连接部分和热固性粘合剂膜施加足够高的热量和压力，以充分地推开粘合剂膜，以便在彼此面对的电路板的连接部分之间建立电接触，并允许固化 胶粘剂; 其中构成第一和第二电路板中的至少一个的连接部分的导体配线包含非线性配线。

公开(公告)号：US20100186995A1

公开(公告)日：2010-07-29

申请号：US12149690

申请日：2008-05-06

Applicant: Shih-Kun Yeh

Inventor： Shih-Kun Yeh

IPC: H01R12/10 ,  H01R12/04

CPC classification number: H01R29/00 ,  H01R12/62 ,  H01R13/6658 ,  H01R31/065 ,  H05K1/0286 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/141 ,  H05K1/148 ,  H05K2201/09245 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A connecting device for cables and jumper wires according to the present invention at least comprises a flexible flat cable and a second connecting member, wherein the flexible flat cable and the second connecting member are linked to each other and positioned by a circuit board for turn-on, and the to circuit board is provided thereon with a plurality of circuits, and the flexible flat cable is provided with a plurality of first pins connected to each of the circuits, and the second connecting member is also provided with a plurality of second pins connected to each of the circuits, and the arranging order of each first pin differs from that of each second pin so that each circuit on the circuit board can provide a jumper connection between the flexible flat cable and the second connecting member.

Abstract translation: 根据本发明的用于电缆和跨接线的连接装置至少包括柔性扁平电缆和第二连接构件，其中柔性扁平电缆和第二连接构件彼此连接并且由电路板定位， 并且在电路板上设置有多个电路，并且柔性扁平电缆设置有连接到每个电路的多个第一引脚，并且第二连接构件还设置有多个第二引脚 连接到每个电路，并且每个第一引脚的布置顺序与每个第二引脚的布置顺序不同，使得电路板上的每个电路可以在柔性扁平电缆和第二连接构件之间提供跳线连接。

公开(公告)号：US20100183141A1

公开(公告)日：2010-07-22

申请号：US12613494

申请日：2009-11-05

Applicant: Tatsuya Arai ,  Ching-Chao Huang ,  Clement Kam Lam Luk ,  Jeremy Buan ,  Tsutomu Matsuo ,  Toshiyuki Takada ,  Masakazu Nagata

Inventor： Tatsuya Arai ,  Ching-Chao Huang ,  Clement Kam Lam Luk ,  Jeremy Buan ,  Tsutomu Matsuo ,  Toshiyuki Takada ,  Masakazu Nagata

IPC: H04M1/76 ,  H04M9/00

CPC classification number: H04M1/76 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/10689

Abstract: The present invention involves chip-to-chip communication systems for reducing Far-End Crosstalk (FEXT) through the use of novel polarity swapping to negate the cumulative effect of FEXT. Skew adjustment is used to improve the FEXT cancellation from polarity swapping. The polarity reversal location or locations among FEXT sources are optimized to achieve maximum FEXT cancellation. The novelty polarity swapping technique can be applied to a wide variety of systems that can benefit from FEXT reduction.

Abstract translation: 本发明涉及通过使用新的极性交换来减少FEXT的累积效应来减少远端串扰（FEXT）的芯片到芯片通信系统。 倾斜调整用于改善极性交换中的FEXT消除。 FEXT源中的极性反转位置或位置被优化，以实现最大的FEXT取消。 新颖的极性交换技术可以应用于可以从FEXT减少中受益的各种系统。

公开(公告)号：US20100051326A1

公开(公告)日：2010-03-04

申请号：US12494553

申请日：2009-06-30

Applicant: Katsumi Sagisaka

Inventor： Katsumi Sagisaka

IPC: H05K1/00

CPC classification number: H05K1/141 ,  H05K1/16 ,  H05K1/185 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/4602 ,  H05K3/4691 ,  H05K2201/052 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/096 ,  H05K2201/10265 ,  H05K2203/0455 ,  H05K2203/049

Abstract: A flex-rigid wiring board including a rigid printed wiring board having a rectangular shape and having a rigid base material and a conductor, and a flexible printed wiring board having a flexible base material and a conductor formed over the flexible base material. The conductor of the flexible printed wiring board is electrically connected to the conductor of the rigid printed wiring board. The flexible printed wiring board is connected to the rigid printed wiring board and extends from one or more sides of the rectangular shape of the rigid printed wiring board such that the flexible printed wiring board extends in a direction which makes an acute angle with respect to one or more sides of the rectangular shape of the rigid printed wiring board.

Abstract translation: 一种柔性刚性布线板，包括具有矩形形状并具有刚性基底材料和导体的刚性印刷线路板，以及柔性基底材料和形成在柔性基底材料上的导体的柔性印刷线路板。 柔性印刷电路板的导体电连接到刚性印刷线路板的导体。 柔性印刷电路板连接到刚性印刷线路板，并从刚性印刷线路板的矩形的一侧或多侧延伸，使得柔性印刷线路板沿相对于一个方向成锐角的方向延伸 或更多边的刚性印刷线路板的矩形形状。

公开(公告)号：US07619355B2

公开(公告)日：2009-11-17

申请号：US11766147

申请日：2007-06-21

Applicant: Masafumi Moriya ,  Kazuya Ishiwata

Inventor： Masafumi Moriya ,  Kazuya Ishiwata

IPC: H01J1/62 ,  H01J9/00

CPC classification number: H05K3/4685 ,  H01J17/04 ,  H01J29/04 ,  H05K3/107 ,  H05K2201/09245 ,  H05K2201/10287 ,  H05K2203/0315 ,  Y10T29/49162

Abstract: To provide an electron source including: a wiring board having: a substrate having a groove on its surface; a conductive wire containing a metal which is arranged along the groove in the groove; and a wiring which is arranged above the wire crossing the wire; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the conductive wire and the wiring; wherein the wire has an oxide layer of the metal contained in the wire on its surface.

Abstract translation: 提供一种电子源，包括：布线板，其具有：具有在其表面上的沟槽的衬底; 导电线，其包含沿着所述凹槽中的所述凹槽布置的金属; 以及布置在穿过导线的导线上方的布线; 以及布置在所述布线板上并电连接到所述导线和所述布线的电子发射器件; 其中所述线具有在其表面上的所述金属线中包含的金属的氧化物层。