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    Waffleline-configured surface-mount package for high frequency signal coupling applications
    302.
    发明授权
    Waffleline-configured surface-mount package for high frequency signal coupling applications 失效
    Waffleline配置的表面贴装封装，用于高频信号耦合应用

    公开(公告)号：US5124677A

    公开(公告)日：1992-06-23

    申请号：US571082

    申请日：1990-08-22

    Applicant: Douglas Heckaman ,  Diane G. Caruso

    Inventor： Douglas Heckaman ,  Diane G. Caruso

    IPC: H01P5/12 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/10 ,  H05K3/34

    CPC classification number: H05K1/0253 ,  H01P5/12 ,  H05K1/0248 ,  H05K1/05 ,  H05K1/141 ,  H05K2201/09054 ,  H05K2201/09263 ,  H05K2201/09745 ,  H05K2201/10022 ,  H05K2201/10287 ,  H05K2201/10515 ,  H05K2201/10969 ,  H05K3/0061 ,  H05K3/103 ,  H05K3/3421

    Abstract: A waffeline-configured, surface-mount transmission line module contains a two-dimensional arrangement of periodically distributed conductive surface mesas and channels. Within the channels are segments of dielectrically surrounded conductor. The geometry of the arrangement of segments among the waffleline channels is defined in accordance with the intended signal coupling functionality of the interconnect structure. For example, in the case of a signal splitting application, the conductor segments may be arranged in a tree-like configuration between an input port and multiple output ports. Isolation resistors may be disposed within the channels of the waffleline between adjacent locations of diverging conductor runs among the mesas of the waffleline. The resulting transmission line module is then surface-mounted on the same printed wiring board as the signal processing components it is to interconnect, and respective portions of the segments of dielectrically surrounded conductor within the channels of the waffleline module are connected to signal ports of adjacent signal processing components. Because each waffleline interconnect module is relatively thin, multiple modules may be mounted in a stacked configuration on the printed wiring board to realize a three-dimensional waffleline module structure, with intermodule vias and interconnects provided between selected locations of conductor segments of adjacent layers.

    Abstract translation: 一个配有waffeline的表面贴装传输线模块包含周期性分布的导电表面台面和通道的二维排列。 在通道内是介电导体包围的部分。 根据互连结构的预期信号耦合功能来定义华夫线信道之间的分段布置的几何形状。 例如，在信号分割应用的情况下，导体段可以以输入端口和多个输出端口之间的树状配置来布置。 隔离电阻器可以布置在华夫线的通道内，在瓦楞纸盘的台面之间的发散导体线的相邻位置之间。 所得到的传输线模块然后表面安装在与要互连的信号处理部件相同的印刷线路板上，并且在华夫线模块的通道内的介电围绕导体的各段的各部分连接到相邻的信号端口 信号处理组件。 因为每个华夫线互连模块相对较薄，所以多个模块可以堆叠配置安装在印刷电路板上，以实现一个三维华夫线模块结构，在相邻层的导体段的选定位置之间提供模块间通孔和互连。

    Printed circuit board with a metallic layer for supporting an electrical component
    304.
    发明授权
    Printed circuit board with a metallic layer for supporting an electrical component 失效
    具有用于支撑电气部件的金属层的印刷电路板

    公开(公告)号：US4992688A

    公开(公告)日：1991-02-12

    申请号：US245302

    申请日：1988-09-16

    Applicant: Heinrich Cap ,  Georg Moosman

    Inventor： Heinrich Cap ,  Georg Moosman

    IPC: H02K29/08 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K9/00

    CPC classification number: H05K1/021 ,  H02K29/08 ,  H05K1/183 ,  H05K9/0039 ,  H05K1/056 ,  H05K2201/09036 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09745 ,  H05K2201/10166

    Abstract: A composite printed circuit board having a metallic layer supporting body with a first insulating layer thereon and wherein the insulating layer has copper printed circuits placed thereon. The printed circuit board is adapted to precisely hold and position electric components (normally electrical motor sensors) on stamped out recesses in the composite body. The stamped out recesses have edge portions for finitely positioning the components and allow for electric leads coming from the components to pass over the bent tabular portion of the recess to be soldered to the copper circuits.

    Abstract translation: 一种复合印刷电路板，其具有金属层支撑体，其上具有第一绝缘层，并且其上绝缘层具有铜印刷电路。 印刷电路板适用于在复合体中的冲压凹槽上精确地保持和定位电气部件（通常为电动机传感器）。 冲压凹口具有用于有限地定位部件的边缘部分，并允许来自部件的电引线穿过要焊接的凹槽的弯曲的平坦部分到铜电路。

    Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor
    305.
    发明授权
    Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor 失效
    具有印刷电路板的电气元件组件及其印刷电路板结构

    公开(公告)号：US4361862A

    公开(公告)日：1982-11-30

    申请号：US194179

    申请日：1980-10-06

    Applicant: Gerald J. Martyniak

    Inventor： Gerald J. Martyniak

    IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

    CPC classification number: H05K3/3421 ,  H05K1/119 ,  H05K1/183 ,  H05K3/303 ,  H05K1/0284 ,  H05K1/111 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10393 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K3/325 ,  Y02P70/613

    Abstract: Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.

    Abstract translation: 电气部件（10或30）通过形成从板的安装表面突出的多个热塑性销（20,35）紧固到印刷电路板（11）的安装表面（16），邻近于部件的位置 被安置在。 部件被放置在板上，使得部件的一部分邻近销的部分定位，随后销的部分被加热并围绕部件的部分形成以形成塑料锁定部分（22或37） 组件到板的所需位置。 板的安装表面（16）可以形成有一个口袋（18或33），该口袋（18或33）将部件接收并定位在所需的位置，使得元件引线（17或32）沿着安装表面延伸， 接触区域（14,34），其沉积在安装表面上，之后通过回流焊接将引线附接到接触区域。

    Multiwafer electrical circuit construction and method of making
    306.
    发明授权
    Multiwafer electrical circuit construction and method of making 失效
    多层电路电路结构及其制作方法

    公开(公告)号：US3917983A

    公开(公告)日：1975-11-04

    申请号：US41510273

    申请日：1973-11-12

    Applicant: BUNKER RAMO

    Inventor： KURONEN JOHN MICHAEL

    IPC: H05K3/10 ,  H05K3/44 ,  H05K3/46 ,  H05K5/00

    CPC classification number: H05K3/445 ,  H05K3/107 ,  H05K3/4614 ,  H05K2201/09745 ,  H05K2201/09809 ,  H05K2203/0369 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/12347

    Abstract: A construction and method of fabricating a multiwafer electrical circuit structure comprised of a plurality of malleable electrically conductive wafers providing X, Y and Z coaxial connections. The wafers are stacked together under pressure with deformable integral malleable contacts being provided between adjacent wafers for providing wafer-to-wafer Z-axis electrical connections as well as wafer-to-wafer ground connections. The wafers are fabricated from conductive sheets of appropriate malleability in a manner so that the deformable integral malleable Z-axis and ground contacts required between adjacent wafers are fabricated directly from the wafer material.

    Abstract translation: 一种制造多晶片电路结构的结构和方法，包括提供X，Y和Z同轴连接的多个可延展的导电晶片。 晶片在压力下堆叠在一起，可变形的整体可延展的触点设置在相邻晶片之间，用于提供晶圆到晶片的Z轴电连接以及晶圆到晶片的接地连接。 晶片由具有合适延展性的导电片制成，使得相邻晶片之间所需的可变形的整体可延展的Z轴和接地触点直接从晶片材料制造。

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