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公开(公告)号：US06195882B1
公开(公告)日：2001-03-06
申请号：US08924619
申请日：1997-09-05
IPC分类号： H01K310
CPC分类号： H05K3/462 , H05K3/205 , H05K3/207 , H05K3/4069 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0376 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/1461 , Y10T29/49126 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163 , Y10T29/49165
摘要： A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.
摘要翻译： 一种制造印刷电路板的方法包括以下步骤：在粘合绝缘片中的预定位置穿孔，在导电材料如导电膏或金属球填充通孔，转印形成在表面上的导电布线图案 通过热和压力将可释放的支撑片材粘合到绝缘片的表面上。 同时，通过填充到通孔中的导电材料进行层间通孔连接。
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公开(公告)号：US06171946B2
公开(公告)日：2001-01-09
申请号：US08896071
申请日：1997-07-17
申请人： Masahide Tsukamoto
发明人： Masahide Tsukamoto
IPC分类号： H01L214763
CPC分类号： H05K3/4679 , H01L21/4857 , H05K1/0269 , H05K3/0008 , H05K3/0035 , H05K3/0082 , H05K3/064 , H05K3/4644 , H05K3/4652 , H05K2203/0554
摘要： A method of forming a multilayered pattern in an electronic part wherein a pattern of multilayer wiring is formed via insulating layers in which a pattern for a succeeding layer is formed by adjusting to a position and a configuration of the pattern which was already formed by recognizing a position and configuration of the pattern.
摘要翻译： 一种在电子部件中形成多层图案的方法，其中通过经由绝缘层形成多层布线的图案，其中通过调节已经形成的图案的位置和构造，其中形成后续层的图案， 位置和配置的模式。
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33.发明授权Chip carrier with peripheral stiffener and semiconductor device using the same 失效具有外围加强件的芯片载体和使用其的半导体器件
公开(公告)号：US5841194A
公开(公告)日：1998-11-24
申请号：US814984
申请日：1997-03-14
申请人： Masahide Tsukamoto
发明人： Masahide Tsukamoto
IPC分类号： H01L23/12 , H01L23/00 , H01L23/14 , H01L23/498 , H01L23/06
CPC分类号： H01L23/562 , H01L23/145 , H01L23/49827 , H01L23/4985 , H01L24/32 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83051 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15313 , H01L2924/16152 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107
摘要： A carrier substrate comprises a flexible insulating substrate containing aramid fiber as a reinforcer, first bonding pads formed on one side of the flexible insulating substrate, and second bonding pads formed on the other side of the flexible insulating substrate, where the first bonding pads and the second bonding pads are electrically bonded by via-holes punched in the flexible insulating substrate. The carrier substrate and a peripheral stiffener made of a material whose thermal expansion coefficient is higher than that of the carrier substrate compose a chip carrier, and an LSI chip is mounted on the recess of the chip carrier.
摘要翻译： 载体基板包括含有作为增强件的芳族聚酰胺纤维的柔性绝缘基板，形成在柔性绝缘基板的一侧上的第一接合焊盘和形成在柔性绝缘基板的另一侧上的第二接合焊盘，其中第一接合焊盘和 第二接合焊盘通过冲压在柔性绝缘基板中的通孔电接合。 由热膨胀系数高于载体基板的材料制成的载体基板和周边加强件构成芯片载体，LSI芯片安装在芯片载体的凹部上。
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公开(公告)号：US5481795A
公开(公告)日：1996-01-09
申请号：US258383
申请日：1994-06-10
申请人： Akihito Hatakeyama , Hiroshi Sogo , Tamao Kojima , Yasuhiko Horio , Masahide Tsukamoto , Yasushi Fukumura
发明人： Akihito Hatakeyama , Hiroshi Sogo , Tamao Kojima , Yasuhiko Horio , Masahide Tsukamoto , Yasushi Fukumura
CPC分类号： H05K3/462 , H05K3/4069 , H05K2201/0116 , H05K2201/0269 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/28 , H05K3/4623 , Y10S428/901 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes in a porous raw material provided with cover films and having compressive shrinkage, filling electro-conductive paste into the through-holes, separating the cover films from the porous raw material filled with the electro-conductive paste in its through-holes, applying metal foils onto the surfaces of the porous raw material from which the cover films have been separated, and compressing the porous raw material applied with the metal foils through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.
摘要翻译： 一种印刷电路用有机基板的制造方法，其特征在于，包括以下步骤：在设置有覆盖膜的多孔原料中形成通孔，并具有压缩收缩率，将导电性浆料填充到通孔中， 从填充有导电糊的多孔原料在其通孔中，将金属箔施加到已经从其分离了覆盖膜的多孔原料的表面上，并且将施加有金属箔的多孔原料压缩通过 加热和加压，由此将导电浆料中的导电物质连接用于金属箔之间的电连接。
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公开(公告)号：US5439164A
公开(公告)日：1995-08-08
申请号：US71400
申请日：1993-06-04
CPC分类号： B23K20/16 , B23K35/007 , H05K3/4069 , B23K2201/36 , B23K35/025 , H05K1/095 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623
摘要： The copper or its alloys can be bonded to each other or can be bonded to noble metals or to other metals whose surface is covered with a noble metal thin film in an oxidative atmosphere. The surface of the copper or its alloys to be bonded should be covered with the layer of a noble metal thin film or a metal oxide remover or a conductive paste mainly consisting of a copper or copper alloy particles and the metal oxide remover. This method can be applied to a metallurgical industry and also to an electronics industry. This method is especially suitable for the production of a multilayered printed wiring board.
摘要翻译： 铜或其合金可以彼此键合或者可以结合到贵金属或其它金属，其表面在氧化气氛中被贵金属薄膜覆盖。 铜或其待结合的合金的表面应该被主要由铜或铜合金颗粒和金属氧化物去除剂组成的贵金属薄膜或金属氧化物去除剂或导电浆料层覆盖。 该方法可应用于冶金工业以及电子工业。 该方法特别适用于生产多层印刷线路板。
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公开(公告)号：US4909151A
公开(公告)日：1990-03-20
申请号：US178647
申请日：1988-04-07
摘要： A method of forming an ink image with a thermo-sensitive ink by using a printing plate that is used in dry lithographic printing, and printing the ink image onto an object. An ink remover is placed via a thermo-sensitive ink layer that is in a heated state on a printing surface of a printing plate having a part receptive to ink and a part capable of repelling ink. The printing plate and the ink remover are separated after they are cooled so that the ink layer on the part capable of repelling ink is transferred to the ink remover. The ink image obtained on the printing plate or the ink remover is transferred to an object. Printing that does not require maintenance that has been essential to conventional dry lithographic printing becomes possible.
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公开(公告)号：US06703565B1
公开(公告)日：2004-03-09
申请号：US09686220
申请日：2000-10-11
IPC分类号： H05K102
CPC分类号： H05K3/462 , H05K3/205 , H05K3/207 , H05K3/4069 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0376 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/1461 , Y10S156/923 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T156/1168
摘要： A printed wiring board includes at least one insulator sheet having through holes filled with conductive material and a conductive wiring pattern. The wiring pattern is embedded in the insulator sheet so that an upper surface of the wiring pattern and surrounding portions of the insulator sheet form a flat surface. The insulator sheet may be made from a glass-epoxy prepreg or of a polyester or polyimide sheet coated with an adhesive or glue. The wiring pattern can be transferred to the insulator sheet from a surface of a releasable supporting sheet.
摘要翻译： 印刷电路板包括至少一个具有填充有导电材料的通孔和导电布线图案的绝缘片。 布线图案嵌入在绝缘片中，使得布线图案的上表面和绝缘片的周围部分形成平坦表面。 绝缘片可由玻璃环氧树脂预浸料或涂有粘合剂或胶水的聚酯或聚酰亚胺片制成。 布线图案可以从可释放的支撑片的表面转移到绝缘片。
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公开(公告)号：US06683260B2
公开(公告)日：2004-01-27
申请号：US09897127
申请日：2001-07-03
申请人： Takeshi Shimamoto , Kazufumi Yamaguchi , Masahide Tsukamoto , Fumikazu Tateishii , Yutaka Taguchi
发明人： Takeshi Shimamoto , Kazufumi Yamaguchi , Masahide Tsukamoto , Fumikazu Tateishii , Yutaka Taguchi
IPC分类号： H05K100
CPC分类号： H05K1/0245 , H01P3/08 , H05K1/0219 , H05K1/0242 , H05K1/09 , H05K3/107 , H05K2201/0305 , H05K2201/09036 , H05K2201/09118 , H05K2201/09236 , H05K2201/098 , H05K2201/09981 , Y10T29/49126
摘要： Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.
摘要翻译： 传输线结构由嵌入在电介质层的一个布线区域中的一对信号导体组成，信号导体的高度大于宽度，并且构成为使得相邻信号导体之间的耦合阻抗 低于在另一布线区域中形成的信号导体和另一导体之间的耦合阻抗，从而提供具有高布线密度和优良传输特性的传输线结构的多层布线板。
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公开(公告)号：US06565954B2
公开(公告)日：2003-05-20
申请号：US09728286
申请日：2000-12-01
IPC分类号： B32B300
CPC分类号： H05K3/20 , H05K3/007 , H05K3/205 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K3/4658 , H05K3/4688 , H05K2201/0116 , H05K2201/0195 , H05K2201/10378 , H05K2203/0152 , H05K2203/0384 , H05K2203/061 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/2804
摘要： Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.
摘要翻译： 形成在其两面具有粘合层的电绝缘基板中的通孔填充有导体。 然后，将具有预定图案的布线层的支撑基板层压在电绝缘基板的两个表面上，然后被加热和加压。 之后，除去支撑基底，从而获得其中布线层已经嵌入粘合剂层中的电路板。 通孔内的导体被充分压缩，从而形成具有高可靠性的微通孔。
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40.发明授权公开(公告)号：US06513236B2
公开(公告)日：2003-02-04
申请号：US09777062
申请日：2001-02-05
申请人： Masahide Tsukamoto
发明人： Masahide Tsukamoto
IPC分类号： H05K310
CPC分类号： H01L24/75 , H01L21/563 , H01L24/29 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75315 , H01L2224/7598 , H01L2224/81209 , H01L2224/81801 , H01L2224/83101 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H05K3/284 , H05K3/303 , H05K2203/0278 , H05K2203/085 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , H01L2924/00 , H01L2224/05599
摘要： Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the separation wall and thus the bump components are pressed against the circuit board. When heating is carried out in this state, the bump components and the circuit board are connected with a conductive adhesive or solder. During the heating, the circuit board is not deformed. Therefore, a bump-component mounted body can be manufactured with high yield.
摘要翻译： 安装在支撑基板上的电路板上的凸起部件被柔性分隔壁覆盖。 在分隔壁的内侧和外侧之间设置压力差，因此凸块部件被压靠在电路板上。 当在这种状态下进行加热时，凸起部件和电路板与导电粘合剂或焊料连接。 在加热过程中，电路板不会变形。 因此，可以以高产率制造凸块部件安装体。
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