公开(公告)号：US20060057868A1

公开(公告)日：2006-03-16

申请号：US11224401

申请日：2005-09-12

申请人： Ming-Yu Chen

发明人： Ming-Yu Chen

IPC分类号： H05K1/00

CPC分类号： G01R1/0433

摘要： Disclosed is a socket (10) including a base (12), an array of contacts (22) in columns and rows, a plurality of positioning blocks (121) between the rows of the contacts of the base. Each of the contacts includes two deflectable contact pieces (223) at a distal region thereof to capture one ball (200) of an IC device (20) in a manner to prevent movement of that ball in a first horizontal direction. Some of the positioning blocks are arranged for preventing movement of balls of the IC device in a second horizontal direction substantially perpendicular to the first horizontal direction. Thus, the IC device may be accurately positioned on the test socket.

摘要翻译： 公开了一种插座（10），其包括基座（12），列和列中的触点阵列（22），在基座的触点的行之间的多个定位块（121）。 每个触点在其远端区域处包括两个可偏转的接触片（223），以以防止该球在第一水平方向上移动的方式捕获IC器件（20）的一个球（200）。 一些定位块布置成用于防止IC器件的球在基本上垂直于第一水平方向的第二水平方向上移动。 因此，IC器件可以精确地定位在测试插座上。

公开(公告)号：US06976852B2

公开(公告)日：2005-12-20

申请号：US10889070

申请日：2004-07-13

申请人： Leo Azumi ,  Tsuyoshi Watanabe

发明人： Leo Azumi ,  Tsuyoshi Watanabe

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R1/073 ,  H01R33/76 ,  H01R12/00

CPC分类号： G01R1/0433

摘要： A socket for electrical parts includes driving mechanisms that move pressing members from a depressed position to a retired position when an operating member is vertically shifted. The operating member includes racks each of which has rack gears in the vertical direction. Follower gears engageable with the rack gears are also provided. The follower gears have different distances from the rotational pivot to the pitch circle. When the operating member is depressed, the follower gear with a longer distance from the rotational pivot to the pitch circle is engaged with one of the rack gears.

摘要翻译： 用于电气部件的插座包括当操作构件垂直移动时将按压构件从凹陷位置移动到退出位置的驱动机构。 操作构件包括在垂直方向上具有齿条的齿条。 还提供了与齿条接合的从动齿轮。 从动齿轮与旋转枢轴到节圆具有不同的距离。 当操作构件被压下时，从旋转枢轴到节圆的距离较长的从动齿轮与其中一个齿条啮合。

公开(公告)号：US06969262B2

公开(公告)日：2005-11-29

申请号：US10233500

申请日：2002-09-04

申请人： Katsumi Suzuki ,  Takehiro Ito

发明人： Katsumi Suzuki ,  Takehiro Ito

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R1/073 ,  G01R3/00 ,  H01R33/76 ,  H01R12/14

CPC分类号： G01R1/0466 ,  G01R1/0433 ,  G01R3/00

摘要： An IC socket formed by attaching a socket frame to a test board via a contact sheet, wherein the contact sheet has a plurality of cantilever spring type contacts arranged on a insulation film and a spacer member, to tightly attach the socket frame to the test board via the contact sheet without any inclination.

摘要翻译： 一种IC插座，其通过接触片将插座框架连接到测试板而形成，其中接触片具有布置在绝缘膜和间隔构件上的多个悬臂弹簧型触头，以将插座框架紧紧地附接到测试板 通过接触片无任何倾斜。

公开(公告)号：US06887723B1

公开(公告)日：2005-05-03

申请号：US09260794

申请日：1999-03-01

申请人： Douglas S. Ondricek ,  David V. Pederson

发明人： Douglas S. Ondricek ,  David V. Pederson

IPC分类号： G01R1/04 ,  G01R31/01 ,  G01R31/28 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/48 ,  H01L23/538 ,  H05K3/32 ,  G01R31/26 ,  H01L21/18 ,  H01L21/44 ,  H01L21/50 ,  H01L21/66

CPC分类号： G01R1/0466 ,  G01R1/0408 ,  G01R1/0433 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2893 ,  H01L21/67294 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/73251 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K3/325 ,  H05K2201/09472 ,  H01L2924/00 ,  H01L2224/72

摘要： Methods for processing at least one die which comprises an integrated circuit. In one example of a method of the invention, an identification code is applied to a carrier. A singulated die is deposited into the carrier which holds the singulated die. The singulated die comprises an integrated circuit. The identification code may be applied to the carrier before or after depositing the singulated die into the carrier. The carrier may be used in testing the singulated die and may include a plurality of singulated die or just one singulated die. In another example of a method of the invention, an identification code is applied to a die. The die is deposited into a carrier which holds the die. The die comprises an integrated circuit, and the carrier holds the die in singulated form. Typically the die is placed in the carrier without any packaging which may protect the die. The identification code may be applied to the die before or after it is deposited into the carrier.

摘要翻译： 用于处理包括集成电路的至少一个管芯的方法。 在本发明的方法的一个示例中，将识别码应用于载体。 单片模具沉积在保持单模模具的载体中。 单片模具包括集成电路。 可以在将分割的裸片沉积到载体中之前或之后将识别码应用于载体。 载体可以用于测试单个模具，并且可以包括多个单个模具或仅一个单模模具。 在本发明方法的另一个例子中，将识别码应用于管芯。 模具沉积在保持模具的载体中。 芯片包括集成电路，并且载体以单模形式保持模具。 通常，模具被放置在载体中而没有任何可保护模具的包装。 识别码可以在将其沉积到载体中之前或之后施加于该芯片。

公开(公告)号：US20050042782A1

公开(公告)日：2005-02-24

申请号：US10919676

申请日：2004-08-16

申请人： Steven Hamren ,  Daniel Cram

发明人： Steven Hamren ,  Daniel Cram

IPC分类号： G01R1/04 ,  H05K3/32 ,  G01R31/26

CPC分类号： G01R1/0408 ,  G01R1/0433 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/321 ,  H01L2224/29099 ,  H01L2224/05599

摘要： Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.

公开(公告)号：US06853178B2

公开(公告)日：2005-02-08

申请号：US09873057

申请日：2001-06-02

申请人： Kambiz Hayat-Dawoodi

发明人： Kambiz Hayat-Dawoodi

IPC分类号： G01R1/04 ,  G01R15/20 ,  H01L23/495 ,  G01R33/07 ,  H05K7/18

CPC分类号： G01R15/202 ,  G01R1/0433 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A metallic leadframe for use with a semiconductor chip intended for operation in a changing magnetic field comprises a chip mount pad having at least one slit penetrating the whole thickness of the pad and substantially traversing the area of the pad from one edge to the opposite edge. This slit is wide enough to interrupt electron flow in the pad plane, but not wide enough to significantly reduce thermal conduction in a direction normal to the pad plane, whereby the slit is operable to disrupt eddy currents induced in the pad by the changing magnetic field.A semiconductor device intended for operation in a changing magnetic field, comprising a leadframe with a chip mount pad having at least one slit in a configuration operable to suppress eddy currents induced in the pad by the changing magnetic field; an integrated circuit chip, having an active and a passive surface; the passive surface attached to the mount pad by a polymeric material; and the active surface having a Hall structure including current and voltage terminals integrated into the circuit, whereby the changing magnetic field can be measured without diminution by said eddy currents.

摘要翻译： 与用于在变化的磁场中操作的半导体芯片一起使用的金属引线框架包括芯片安装焊盘，其具有贯穿焊盘整个厚度的至少一个狭缝，并且基本上从焊盘的一个边缘横向到相对的边缘。 该狭缝足够大以阻止焊盘平面中的电子流动，但不足够宽以显着减小垂直于焊盘平面的方向上的热传导，从而狭缝可操作地通过改变磁场来破坏在焊盘中感应的涡流 一种旨在用于在变化的磁场中操作的半导体器件，包括具有芯片安装焊盘的引线框架，其具有至少一个狭缝，其中可配置为可以通过改变磁场来抑制在焊盘中感应的涡流; 具有主动和被动表面的集成电路芯片; 被动表面通过聚合材料附接到安装垫; 并且所述有源表面具有包括集成到所述电路中的电流和电压端子的霍尔结构，由此可以在不减小所述涡流的情况下测量变化的磁场。

公开(公告)号：US20040214409A1

公开(公告)日：2004-10-28

申请号：US10847969

申请日：2004-05-18

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H01L021/301

CPC分类号： H01L23/49838 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863 ,  G01R31/287 ,  G01R31/2889 ,  G01R31/2893 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/80 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die. In the assembled carrier the die and interconnect are biased together by a force distribution mechanism that includes a bridge clamp, a pressure plate and a spring clip. Following testing of the die, the carrier is disassembled and the tested die is removed.

公开(公告)号：US20040201394A1

公开(公告)日：2004-10-14

申请号：US10414196

申请日：2003-04-14

发明人： John A. Benavides

IPC分类号： G01R031/26

CPC分类号： G01R31/31718 ,  G01R1/0433 ,  G11C29/02 ,  G11C2029/5006

摘要： An embodiment of this invention provides a circuit and method for improving testability and reducing test time for packaged integrated circuits. An LED is physically mounted to a test socket. One lead of the LED is electrically connected to a positive voltage through a pin on the socket. The other lead of the LED is electrically connected to a driving device physically located on the packaged IC. A packaged IC is inserted in the socket. The packaged IC runs a self-test on itself. If the self-test is positive, the driving device activates the LED.

摘要翻译： 本发明的实施例提供了一种用于提高可测试性并减少封装集成电路的测试时间的电路和方法。 LED物理安装在测试插座上。 LED的一个引线通过插座上的引脚电连接到正电压。 LED的另一引线电连接到物理上位于封装IC上的驱动装置。 封装的IC插入插座。 封装的IC自身运行自检。 如果自检为正，则驱动装置激活LED。

公开(公告)号：US20040152348A1

公开(公告)日：2004-08-05

申请号：US10749028

申请日：2003-12-30

申请人： FormFactor, Inc.

发明人： David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

IPC分类号： H05K001/00

CPC分类号： H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

摘要： Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

摘要翻译： 提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。 插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。 公开了各种捕获垫结构。 通过邻近插座基板表面的导电迹线提供与外部设备的连接。 插座基板可以由支撑基板支撑。 在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

公开(公告)号：US20040135592A1

公开(公告)日：2004-07-15

申请号：US10340102

申请日：2003-01-10

申请人： QualiTau, Inc.

发明人： Peter Cuevas

IPC分类号： G01R031/02

CPC分类号： G01R1/0433

摘要： A test socket assembly for use in testing integrated circuits includes a spring holder plate having a plurality of holes for receiving a plurality of electrically conducting springs, and a plurality of electrically conducting springs in the plurality of holes. A test socket including a plurality of pins for receiving leads of an integrated circuit is mounted on the spring holder plate with the pins extending into the plurality of holes in the spring holder plate with each pin engaging a spring. The holder plate is positionable on a printed circuit board with the plurality of holes in the spring holder plate being in alignment with electrical contacts or pads on the printed circuit board, the plurality of springs electrically interconnecting the contacts and the plurality of pins.