公开(公告)号：US20110280012A1

公开(公告)日：2011-11-17

申请号：US13085945

申请日：2011-04-13

Applicant: Gun Kyo LEE

Inventor： Gun Kyo LEE

IPC: F21V9/00 ,  F21S4/00

CPC classification number: F21K9/17 ,  F21K9/27 ,  F21V31/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H05K3/281 ,  H05K2201/0125 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A light emitting device module is provided comprising a light emitting device package, a printed circuit board on which the light emitting device package is arranged and a sealing member that surrounds the light emitting device package and the printed circuit board, wherein a predetermined space is formed between the light emitting device package and the printed circuit board and the sealing member.

Abstract translation: 提供一种发光器件模块，其包括发光器件封装，其上布置有发光器件封装的印刷电路板和围绕发光器件封装和印刷电路板的密封构件，其中形成预定空间 在发光器件封装和印刷电路板之间以及密封构件。

公开(公告)号：US20100085722A1

公开(公告)日：2010-04-08

申请号：US12631970

申请日：2009-12-07

Applicant: Kunihiro KOYAMA ,  Muneyoshi YAMAMOTO ,  Takanori UEJIMA ,  Dai NAKAGAWA ,  Masaki KIMURA

Inventor： Kunihiro KOYAMA ,  Muneyoshi YAMAMOTO ,  Takanori UEJIMA ,  Dai NAKAGAWA ,  Masaki KIMURA

IPC: H05K7/02

CPC classification number: H01L25/165 ,  H01L23/3121 ,  H01L24/16 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/288 ,  H05K3/303 ,  H05K2201/0125 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K2203/083 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.

Abstract translation: 吸引面构件设置在电子部件模块上，该电子部件模块包括电子部件基板和安装在电子部件基板上的表面安装装置，以便在与基本上等于或高于 作为最高的表面安装器件的晶体管的上端。 吸头粘附到吸力表面以保持电子部件模块，电子部件模块安装在限定目标板的主板上。 然后进行处理以防止吸附表面构件的上端高于安装在电子部件基板上的最高表面安装装置的上端的情况。

公开(公告)号：US06908790B2

公开(公告)日：2005-06-21

申请号：US10698452

申请日：2003-11-03

Applicant: Kouki Nakahara ,  Hitoshi Morishita

Inventor： Kouki Nakahara ,  Hitoshi Morishita

IPC: G02F1/1345 ,  G02F1/13 ,  G09F9/00 ,  H01L21/60 ,  H01L23/498 ,  H05K1/00 ,  H05K3/28 ,  H05K3/36 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K1/0281 ,  G02F1/13452 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/0125 ,  H05K2201/09909 ,  H05K2201/10681 ,  H05K2201/2009

Abstract: A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wiring and mounted on the base film, and a second insulating film formed on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film. It is possible to obtain a chip carrier film capable of preventing the suspension of the base film from being generated by the self weight of the semiconductor chip when holding the base film by the delivery device and of carrying out mounting without a hindrance.

Abstract translation: 一种芯片载体膜，包括形成在基膜的表面上的金属布线，覆盖除半导体芯片连接焊盘部分之外的金属布线的第一绝缘膜和端子连接焊盘部分，连接到半导体芯片连接焊盘部分的半导体芯片 的金属布线并安装在基膜上，第二绝缘膜形成在基膜的背面上，并且具有与第一绝缘膜的固化收缩率不同的固化收缩系数。 可以获得一种芯片载体膜，其能够防止当通过输送装置保持基膜时半导体芯片的自重产生基膜的悬浮，并且无障碍地进行安装。

公开(公告)号：US20040164429A1

公开(公告)日：2004-08-26

申请号：US10698452

申请日：2003-11-03

Applicant: ADVANCED DISPLAY INC.

Inventor： Kouki Nakahara ,  Hitoshi Morishita

IPC: H01L023/48

CPC classification number: H05K1/0281 ,  G02F1/13452 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/0125 ,  H05K2201/09909 ,  H05K2201/10681 ,  H05K2201/2009

Abstract: A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wiring and mounted on the base film, and a second insulating film formed on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film. It is possible to obtain a chip carrier film capable of preventing the suspension of the base film from being generated by the self weight of the semiconductor chip when holding the base film by the delivery device and of carrying out mounting without a hindrance.

Abstract translation: 一种芯片载体膜，包括形成在基膜的表面上的金属布线，覆盖除了半导体芯片连接焊盘部分之外的金属布线的第一绝缘膜和端子连接焊盘部分，连接到半导体芯片连接焊盘部分的半导体芯片 的金属布线并安装在基膜上，第二绝缘膜形成在基膜的背面上，并且具有与第一绝缘膜的固化收缩率不同的固化收缩系数。 可以获得一种芯片载体膜，其能够防止当通过输送装置保持基膜时半导体芯片的自重产生基膜的悬浮，并且无障碍地进行安装。

公开(公告)号：US06651320B1

公开(公告)日：2003-11-25

申请号：US09509693

申请日：2000-03-20

Applicant: Yoshihiko Yagi ,  Hiroyuki Otani

Inventor： Yoshihiko Yagi ,  Hiroyuki Otani

IPC: H05K334

CPC classification number: H01L24/29 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/11 ,  H01L24/13 ,  H01L24/32 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/29007 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/3511 ,  H05K3/305 ,  H05K3/321 ,  H05K13/0469 ,  H05K2201/0125 ,  H05K2201/0187 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49171 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: The present invention provides a method for mounting a semiconductor element to a circuit board and a semiconductor device whereby connection reliability and connection strength in bonding of the semiconductor element and circuit board are enhanced and a connection resistance value is stabilized low. An insulating adhesive is applied to an opposite face of a circuit board. The circuit board is then connected with a semiconductor element by a conductive adhesive and the insulating adhesive which are interposed between an electrode on the circuit board and the projecting electrode and set in the same process. The circuit board and semiconductor element are connected by the insulating adhesive in addition to the conductive adhesive, so that connection reliability and connection strength are high and a connection resistance value is stabilized low.

Abstract translation: 本发明提供一种用于将半导体元件安装到电路板和半导体器件的方法，由此提高了半导体元件和电路板的接合的连接可靠性和连接强度，并且连接电阻值稳定在低。 将绝缘粘合剂施加到电路板的相对面上。 然后将电路板通过导电粘合剂和绝缘粘合剂与半导体元件连接，绝缘粘合剂介于电路板上的电极和突出电极之间，并以相同的工艺设置。 电路板和半导体元件除了导电粘合剂之外还通过绝缘粘合剂连接，使得连接可靠性和连接强度高，并且连接电阻值稳定在低。

公开(公告)号：US20030153160A1

公开(公告)日：2003-08-14

申请号：US10370140

申请日：2003-02-19

Inventor： Richard D. James ,  Leslie E. Stark

IPC: H01L021/76

CPC classification number: H05K3/3452 ,  H01L23/3171 ,  H01L23/49816 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/13021 ,  H01L2924/0002 ,  H01L2924/01322 ,  H01L2924/3011 ,  H05K3/3457 ,  H05K2201/0125 ,  H05K2201/09436 ,  H05K2201/099 ,  H05K2203/0191 ,  H05K2203/0594 ,  H01L2224/05552

Abstract: The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow processnulla result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.

公开(公告)号：US06315856B1

公开(公告)日：2001-11-13

申请号：US09271912

申请日：1999-03-18

Applicant: Satoru Asagiri ,  Masayoshi Yamaguchi

Inventor： Satoru Asagiri ,  Masayoshi Yamaguchi

IPC: B32B3126

CPC classification number: H05K3/323 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/321 ,  H05K2201/0125 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/10689 ,  H05K2203/0126 ,  H05K2203/013 ,  Y10T29/4913

Abstract: In a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising a resin-based binder mixed with filler, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet type adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising conductive high polymer material, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using anisotropic conductive adhesive comprising a resin-based binder mixed with filler, the electronic component is mounted on the printed circuit board using the anisotropic conductive adhesive which shrinks and cures by heating so as to electrically and mechanically connect the leads and electrodes.

Abstract translation: 在使用包含与填料混合的树脂类粘合剂的各向同性导电粘合剂将电子部件和电极的引线连接在印刷电路板上的电子部件的安装方法中，将各向同性导电性粘合剂供给到印刷电路板上的电极 通过喷墨式粘合剂涂布装置。 另外，在使用各向同性导电性粘合剂包含导电性高分子材料的情况下，通过将电子部件和电极的引线连接在印刷电路板上而安装电子部件的方法中，各向同性导电性粘合剂通过印刷电路板上的电极供给 喷墨粘合剂涂布装置。 此外，在使用包含与填料混合的树脂类粘合剂的各向异性导电粘合剂将电子部件和电极的引线连接在印刷电路板上的电子部件的安装方法中，电子部件使用 各向异性导电粘合剂通过加热收缩和固化，以便电和机械地连接引线和电极。

公开(公告)号：US20010002044A1

公开(公告)日：2001-05-31

申请号：US09736795

申请日：2000-12-14

Inventor： Michael B. Ball ,  Chad A. Cobbley

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: H01L24/12 ,  H01L24/11 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/0041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0125 ,  H05K2201/0191 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of forming conductive structures on the contact pads of a substrate, such as a semiconductor die or a printed circuit board. A solder mask is secured to an active surface of the substrate. Apertures through the solder mask are aligned with contact pads on the substrate. The apertures may be preformed or formed after a layer of the material of which the solder mask is comprised has been disposed on the substrate. Conductive material is disposed in and shaped by the apertures of the solder mask to form conductive structures in communication with the contact pads exposed to the apertures. Sides of the conductive structures are exposed through the solder mask, either by removing the solder mask from the substrate or by reducing the thickness of the solder mask. The present invention also includes semiconductor devices formed during different stages of the method of the present invention.

Abstract translation: 在诸如半导体管芯或印刷电路板的衬底的接触焊盘上形成导电结构的方法。 焊接掩模固定到基板的有效表面。 通过焊接掩模的孔径与衬底上的接触焊盘对准。 可以在其包含焊料掩模的材料层已经布置在基底上之后预先形成或形成孔。 导电材料设置在焊接掩模的孔中并由其形成，以形成与暴露于孔的接触焊盘相连通的导电结构。 通过焊接掩模暴露出导电结构的侧面，通过从衬底去除焊接掩模或通过减小焊接掩模的厚度。 本发明还包括在本发明方法的不同阶段形成的半导体器件。

公开(公告)号：US5359768A

公开(公告)日：1994-11-01

申请号：US92747

申请日：1993-07-16

Applicant: Kevin J. Haley

Inventor： Kevin J. Haley

IPC: H01L23/367 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/305 ,  H01L23/367 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/3025 ,  H05K2201/0125 ,  H05K2201/09918 ,  H05K2201/10734 ,  H05K3/303 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144

Abstract: A very small integrated circuit package. The package of the present invention includes a substrate or die coupled to a heatsink. The substrate or die has solder bumps for being directly mounted to a circuit board. The heatsink is coupled to the die before the die is mounted to the circuit board. The heatsink is mounted using adhesive. By mounting the heatsink before the die is mounted, the heatsink may be used to handle of the substrate or die during the manufacturing and testing process, thereby increasing the reliability of the die by increased protection.

Abstract translation: 一个非常小的集成电路封装。 本发明的封装包括耦合到散热器的衬底或管芯。 衬底或裸片具有用于直接安装到电路板的焊料凸块。 在将管芯安装到电路板之前，将散热器耦合到管芯。 使用粘合剂安装散热器。 通过在安装模具之前安装散热器，散热器可以在制造和测试过程中用于处理基板或模具，从而通过增加保护来提高模具的可靠性。

公开(公告)号：US5210938A

公开(公告)日：1993-05-18

申请号：US924703

申请日：1992-08-04

Applicant: Minoru Hirai

Inventor： Minoru Hirai

IPC: H01L21/56 ,  H01L21/60 ,  H05K3/30 ,  H05K3/32

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L24/75 ,  H05K3/305 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K2201/0125 ,  H05K2201/0212 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0191 ,  H05K3/325 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: In a method of assembling an electronic part device and a circuit board, an electrode formed on the electronic part device and a conductive pattern formed on the circuit board so as to be opposite to the electrode are positioned, and a thermosetting resin sheet including a thermally shrinkable particle and provided between the electronic part device and the circuit board is hardened and shrunk.

Abstract translation: 在组装电子部件装置和电路基板的方法中，形成在电子部件装置上的电极和形成在电路基板上以与电极相对的导电图案被定位，热固性树脂片材包括热 在电子部件装置与电路基板之间设置的可收缩颗粒被硬化和收缩。