公开(公告)号：US20100221533A1

公开(公告)日：2010-09-02

申请号：US12682822

申请日：2008-10-08

Applicant: Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito ,  Tomomi Yokozumi

Inventor： Takashi Tatsuzawa ,  Kouji Kobayashi ,  Akihiro Ito ,  Tomomi Yokozumi

IPC: B32B7/12 ,  B32B5/08

CPC classification number: H05K3/323 ,  H05K2201/0133 ,  H05K2201/0212 ,  Y10T428/28

Abstract: A circuit connecting adhesive film comprising an insulating adhesive, conductive particles and a particulate non-conductive phase containing a polyamide-based elastomer and/or a polyester-based elastomer, wherein the conductive particles and non-conductive phase are dispersed in the insulating adhesive.

Abstract translation: 连接粘合膜的电路，其包含绝缘粘合剂，导电颗粒和含有聚酰胺基弹性体和/或聚酯类弹性体的颗粒非导电相，其中导电颗粒和非导电相分散在绝缘粘合剂中。

公开(公告)号：US20100096173A1

公开(公告)日：2010-04-22

申请号：US12527853

申请日：2008-02-21

Applicant: Kentaro Fujino ,  Tomoaki Sawada ,  Mitsuyoshi Nishino ,  Takashi Shinpo ,  Yoshihiko Nakamura ,  Mao Yamaguchi

Inventor： Kentaro Fujino ,  Tomoaki Sawada ,  Mitsuyoshi Nishino ,  Takashi Shinpo ,  Yoshihiko Nakamura ,  Mao Yamaguchi

IPC: H05K1/00 ,  C08K3/22 ,  B32B15/092

CPC classification number: H05K1/0373 ,  B32B5/022 ,  B32B5/024 ,  B32B5/22 ,  B32B5/26 ,  B32B15/12 ,  B32B15/14 ,  B32B15/20 ,  B32B29/005 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/558 ,  B32B2307/56 ,  B32B2307/714 ,  B32B2307/734 ,  B32B2457/08 ,  C08G59/50 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10T428/31522

Abstract: The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks.This epoxy resin composition includes: (A) an epoxy resin; (B) a curing agent composed of phenolic novolac resin curing agent or amine curing agent, (C) an inorganic filler composed of aluminum hydroxide with or without spherical silica; and (D) an elastic component made of minute particles having a core-shell structure with its shell constituted by a resin which is compatible with said epoxy resin (A). The epoxy resin composition exhibits, when cured into an article, a linear coefficient (az) of thermal expansion of 48 or less with respect to a thickness of said article.

Abstract translation: 本发明提供一种改进的环氧树脂组合物，通过降低使用环氧树脂组合物作为材料制造的层压板的厚度方向的热膨胀系数，并且通过在 固化产物，能够在钻井过程中提高层压体的钻孔加工性，抑制裂纹的发生，能够使镀液浸入与这些裂缝相关联的层叠体中。 该环氧树脂组合物包括：（A）环氧树脂; （B）由酚醛清漆树脂固化剂或胺固化剂组成的固化剂，（C）由具有或不具有球形二氧化硅的氢氧化铝组成的无机填料; 和（D）由具有壳壳结构的微小颗粒制成的弹性组分，其外壳由与所述环氧树脂（A）相容的树脂构成。 环氧树脂组合物当固化成制品时，相对于所述制品的厚度，热膨胀系数（az）为48以下。

公开(公告)号：US07635862B2

公开(公告)日：2009-12-22

申请号：US11337000

申请日：2006-01-23

Applicant: Daijiro Takano ,  Hikaru Fujita

Inventor： Daijiro Takano ,  Hikaru Fujita

IPC: H01L29/04 ,  H01L31/20 ,  H01L31/036 ,  H01L31/0376 ,  H01L31/12

CPC classification number: H05K3/323 ,  C09J9/02 ,  G02F1/13452 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/293 ,  H01L2224/29355 ,  H01L2224/29399 ,  H01L2224/2949 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/30105 ,  H01R4/04 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Anisotropic conductive adhesive has conductive particles dispersed in adhesive and includes hard particles having conductivity, a resin layer that coats the hard particles and a conductive layer that coats the resin layer. A connection structure electrically connects electrodes to each other with the anisotropic conductive adhesive. A connection method includes the steps of causing the anisotropic conductive to intervene between electrodes, applying pressure to the anisotropic conductive adhesive and allowing the adhesive to be solidified.

Abstract translation: 各向异性导电粘合剂具有分散在粘合剂中的导电颗粒，并且包括具有导电性的硬颗粒，涂覆硬颗粒的树脂层和涂覆树脂层的导电层。 连接结构通过各向异性导电粘合剂将电极彼此电连接。 连接方法包括使各向异性导电体介于电极之间，向各向异性导电粘合剂施加压力并使粘合剂固化的步骤。

公开(公告)号：US07601429B2

公开(公告)日：2009-10-13

申请号：US12068298

申请日：2008-02-05

Applicant: Yoshihiro Kato ,  Masayoshi Ueno ,  Takeshi Nobukuni

Inventor： Yoshihiro Kato ,  Masayoshi Ueno ,  Takeshi Nobukuni

IPC: B32B15/09 ,  B32B27/18 ,  B32B27/20 ,  B32B27/36

CPC classification number: C08L63/00 ,  B32B15/08 ,  C08J5/24 ,  C08J2365/00 ,  C08K3/22 ,  C08L65/00 ,  C08L79/04 ,  C08L83/04 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  C08L2666/14

Abstract: A prepreg, for printed wiring boards, comprising a flame resistant resin composition containing a specific cyanate ester resin, a nonhalogen epoxy resin, boehmite which is hardly soluble in acids or alkalis and a silicone powder which is a flame retardant assistant, and a base material, which prepreg retains high-degree flame resistance without a halogen compound and has excellent resistance to chemical, high glass transition temperature, excellent soldering heat resistance and excellent heat resistance after moisture absorption, and a laminate or metal-foil-clad laminate obtained by curing the above prepreg.

Abstract translation: 一种用于印刷线路板的预浸料，其包含含有特定氰酸酯树脂的阻燃树脂组合物，非卤素环氧树脂，几乎不溶于酸或碱的勃姆石和作为阻燃助剂的硅氧烷粉末，以及基材 该预浸料在没有卤素化合物的情况下保持高度的阻燃性，并且具有优异的耐化学性，高玻璃化转变温度，优异的耐焊接性和吸湿性优异的耐热性，以及通过固化获得的层压体或金属箔覆层压板 上述预浸料。

公开(公告)号：US20090253233A1

公开(公告)日：2009-10-08

申请号：US12486771

申请日：2009-06-18

Applicant: Shyh-Ming Chang ,  Sheng-Shu Yang

Inventor： Shyh-Ming Chang ,  Sheng-Shu Yang

IPC: H01L21/60

CPC classification number: H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/136 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29287 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of fabricating a bonding structure having compliant bumps includes first providing a first substrate and a second substrate. The first substrate includes first bonding pads. The second substrate is disposed on one side of the first substrate and includes second bonding pads and compliant bumps disposed thereon. The second bonding pads are opposite to the first bonding pads. Next, a non-conductive adhesive layer and ball-shaped spacers are formed between the first and the second substrates. Finally, the first substrate, the non-conductive adhesive layer, and the second substrate are compressed, such that the compliant bumps on the second bonding pads of the second substrate pass through the non-conductive adhesive layer and are electrically connected to the first bonding pads of the first substrate, respectively. The ball-shaped spacers are distributed in the non-conductive adhesive layer sandwiched between the first and the second substrates for maintaining the gap therebetween.

Abstract translation: 制造具有柔顺凸块的接合结构的方法包括首先提供第一基板和第二基板。 第一衬底包括第一接合焊盘。 第二基板设置在第一基板的一侧，并且包括设置在其上的第二接合焊盘和顺应凸块。 第二接合焊盘与第一接合焊盘相对。 接下来，在第一和第二基板之间形成非导电粘合剂层和球形间隔物。 最后，第一基板，非导电粘合剂层和第二基板被压缩，使得第二基板的第二接合焊盘上的顺从凸块穿过非导电粘合剂层，并且电连接到第一接合 第一基板的焊盘。 球形间隔件分布在夹在第一和第二基板之间的非导电粘合剂层中，以保持它们之间的间隙。

公开(公告)号：US20090133905A1

公开(公告)日：2009-05-28

申请号：US12089503

申请日：2006-10-04

Applicant: Kazuya Kimura ,  Hiroshi Uchida

Inventor： Kazuya Kimura ,  Hiroshi Uchida

IPC: H05K1/11 ,  C08L75/04 ,  H05K1/00

CPC classification number: H05K3/285 ,  C08G18/0823 ,  C08G18/0852 ,  C08G18/12 ,  C08G18/348 ,  C08G18/44 ,  C08G18/6659 ,  C08G18/758 ,  C08L75/04 ,  H05K2201/0162 ,  H05K2201/0212 ,  C08G18/282 ,  C08L2666/14

Abstract: A heat-curable resin composition has excellent printability, non-tackiness, matte and electrical properties. The heat-curable resin composition includes a heat-curable resin (A) and silicone powder (B). Preferably, the silicone powder (B) is spherical or substantially spherical, and has a specific gravity of 0.95 to 1.5 and a particle diameter of 0.01 to 10 μm. The heat-curable resin (A) preferably includes a carboxyl group-containing polyurethane and a heat-curable component. The carboxyl group-containing polyurethane is obtained by reacting a polyisocyanate compound (a), a polyol compound (b) (other than compound (c)), and a carboxyl group-containing dihydroxy compound (c).

Abstract translation: 热固性树脂组合物具有优异的印刷性，非粘性，无光泽和电性能。 热固性树脂组合物包含热固性树脂（A）和硅氧烷粉末（B）。 优选地，硅氧烷粉末（B）是球形或基本上球形的，比重为0.95至1.5，粒径为0.01至10微米。 热固性树脂（A）优选包含含羧基的聚氨酯和可热固化组分。 含羧基的聚氨酯通过使多异氰酸酯化合物（a），多元醇化合物（b）（化合物（c）以外）与含羧基的二羟基化合物（c）反应而得到。

公开(公告)号：US20090054577A1

公开(公告)日：2009-02-26

申请号：US12279435

申请日：2007-03-16

Applicant: Hiroshi Uchida ,  Hirofumi Inoue

Inventor： Hiroshi Uchida ,  Hirofumi Inoue

IPC: C08L71/00 ,  C08L77/00 ,  C08L67/00 ,  C08K3/22 ,  C08K3/30 ,  C08K3/34 ,  C08K3/26 ,  C08L63/00 ,  C08L61/00 ,  C08L83/00 ,  C09D11/00

CPC classification number: H05K3/285 ,  C08L71/03 ,  C09D7/47 ,  C09D7/65 ,  C09D11/52 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212

Abstract: The invention relates to a thermosetting resin composition comprising (A) 20 to 90 mass % of thermosetting resin, (B) 10 to 80 mass % of inorganic and/or organic fine particles and (C) 0.1 to 5 mass % of fluorine-containing polyether, wherein (C) is polymer having fluorinated alkyl polyoxetane structure of formula (1) or (2), (m is an integer of 1 to 100, n is an integer of 1 to 6, R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R2 and R3 each represent a straight or branched chain alkyl group having 1 to 20 carbon atoms, with a proviso that at least 50% of hydrogen atoms present in the alkyl group is substituted by fluorine and the other hydrogen atoms are substituted by hydrogen, iodine, chlorine or bromine atoms) or a composition containing copolymer which consists of monomer having fluorinated alkyl polyoxetane structure and oxygen-containing monomer having 2 to 6 carbon atoms.

Abstract translation: 本发明涉及一种热固性树脂组合物，其包含（A）20-90质量％的热固性树脂，（B）10至80质量％的无机和/或有机细颗粒和（C）0.1至5质量％的含氟 聚醚，其中（C）为具有式（1）或（2）的氟化烷基聚氧杂环丁烷结构的聚合物，（m为1〜100的整数，n为1〜6的整数，R1为氢原子或烷基 具有1至6个碳原子的基团，R 2和R 3各自表示具有1至20个碳原子的直链或支链烷基，条件是存在于烷基中的至少50％的氢原子被氟取代，而另一个 氢原子被氢，碘，氯或溴原子取代）或含有共聚物的组合物，其由具有氟代烷基聚氧杂环丁烷结构的单体和含有2-6个碳原子的含氧单体组成。

公开(公告)号：US07413452B2

公开(公告)日：2008-08-19

申请号：US10969845

申请日：2004-10-22

Applicant: Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

Inventor： Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

IPC: H01R4/58

CPC classification number: H01R12/62 ,  H01J2211/46 ,  H01R4/04 ,  H05K1/147 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: A plasma display device may include a plasma display panel, a driving circuit portion for driving the plasma display panel, a connecter for electrically connecting electrodes of the plasma display panel with the driving circuit portion, and an interconnecter for electrically connecting the connecter with the plasma display panel. The interconnecter may include an adhesive layer, a plurality of conductive pellets, and a plurality of non-conductive pellets dispersed in the adhesive layer. The conductive pellets may be positioned substantially within a first region where the wiring of the connecter overlaps the electrodes of the plasma display panel. The non-conductive pellets may be positioned substantially at least at a second region other than the first region in the adhesive layer.

Abstract translation: 等离子体显示装置可以包括等离子体显示面板，用于驱动等离子体显示面板的驱动电路部分，用于将等离子体显示面板的电极与驱动电路部分电连接的连接器和用于将连接器与等离子体电连接的互连器 显示面板。 互连器可以包括粘合剂层，多个导电颗粒和分散在粘合剂层中的多个非导电颗粒。 导电颗粒可以位于第一区域中，其中连接器的布线与等离子体显示面板的电极重叠。 非导电性颗粒可以基本上至少位于粘合剂层中除了第一区域之外的第二区域。

公开(公告)号：US20070251088A1

公开(公告)日：2007-11-01

申请号：US11790210

申请日：2007-04-24

Applicant: Akira Susaki ,  Tsutomu Nakada

Inventor： Akira Susaki ,  Tsutomu Nakada

IPC: H05K3/36

CPC classification number: H05K3/423 ,  C25D7/04 ,  C25D7/123 ,  C25D15/00 ,  C25D15/02 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76877 ,  H05K3/421 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A substrate processing method is useful for filling a hole formed in a substrate with conductive material. The substrate processing method includes forming a non-through hole in a substrate, and filling the non-through hole with conductive material by plating. The plating is performed using a plating solution containing solid particles.

Abstract translation: 基板处理方法对于用导电材料填充形成在基板中的孔是有用的。 基板处理方法包括在基板中形成非贯通孔，并且通过电镀将导电材料填充到非贯通孔中。 使用含有固体颗粒的电镀液进行电镀。

公开(公告)号：US07241644B2

公开(公告)日：2007-07-10

申请号：US11074718

申请日：2005-03-09

Applicant: Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

Inventor： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract translation: 本发明提供了一种接线端子连接粘合剂，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒，以及使用这种粘合剂的接线端子连接方法和布线结构 。