公开(公告)号：US5518964A

公开(公告)日：1996-05-21

申请号：US271768

申请日：1994-07-07

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/20

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

摘要翻译： 微电子连接部件包括具有细长带状引线的区域阵列的电介质片。 每个引线具有紧固到片材的终端和从片材可拆卸的尖端。 每个引线从其终端到其尖端水平平行地延伸。 尖端附接到第二元件，例如另一个电介质片或半导体晶片。 然后，第一和第二元件相对于彼此移动，以使每个引线的尖端垂直远离电介质片，并将引线变形成弯曲的垂直广泛配置。 优选的结构提供半导体芯片组件，其具有在芯片上的平面区域阵列的触点，片材上的端子阵列被定位成使得每个端子基本上在相应的触点上方，以及连接在端子之间的金属S形带阵列 和联系人。 柔性电介质材料可以设置在片和芯片之间，基本上围绕S形带。

公开(公告)号：US06359335B1

公开(公告)日：2002-03-19

申请号：US09711036

申请日：2000-11-13

申请人： Thomas H. Distefano ,  John W. Smith ,  Craig Mitchell

发明人： Thomas H. Distefano ,  John W. Smith ,  Craig Mitchell

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/11003 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip packaging assembly comprising a frame having a central aperture, a flexible substrate attached to the frame across the central aperture, and a unitary support structure having a plurality of apertures therethrough attached to the substrate within the central aperture of the frame with at least some of the substrate terminals underlying the unitary support structure. A chip is disposed within each aperture and attached to the substrate with the electrical contacts of the chip connected to the substrate terminals. A compliant layer is disposed between the substrate and the unitary support structure and between the substrate and the chip.

公开(公告)号：US06255723B1

公开(公告)日：2001-07-03

申请号：US09179273

申请日：1998-10-27

申请人： David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

发明人： David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

IPC分类号： H01L23495

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327

摘要： A layered lead is disclosed including a layer of structural material which has top and bottom sides, a layer of fatigue-resistant material on the top and bottom surfaces and a layer of bonding material covering the fatigue-resistant layer on the bottom surface for connection to a contact on a chip. An asymmetrical distribution of bonding material on the top and bottom sides may be used to provide reinforcement of the lead against stress. The fatigue-resistant material also acts as a barrier against diffusion between the metal layers.

摘要翻译： 公开了一种分层引线，其包括具有顶侧和底侧的结构材料层，在顶表面和底表面上的耐疲劳材料层，以及覆盖底表面上的抗疲劳层的接合材料层，用于连接到 芯片上的一个接触。 可以使用顶部和底部上的接合材料的不对称分布来提供引线抵抗应力的增强。 耐疲劳材料还用作阻挡金属层之间扩散的屏障。

公开(公告)号：US06228685B1

公开(公告)日：2001-05-08

申请号：US09174074

申请日：1998-10-16

申请人： Masud Beroz ,  Thomas H. DiStefano ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L4400

CPC分类号： H01L23/544 ,  H01L21/4839 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/50 ,  H01L24/72 ,  H01L24/86 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063

摘要： A microelectronic component is fabricated by bonding a flexible sheet in tension on a rigid frame so that the sheet spans an aperture in the frame, and performing one or more operations on features on the flexible sheet which will be incorporated into the finished component. The fame maintains dimensional stability of the sheet and aids in regsitration of the sheet with external elements such as processing tools or other parts which are to be assembled with the sheet. Desirably, the frame has a coefficient of thermal expansion different from that of the sheet so that when the sheet is brought from the bonding temperature to the temperature used in processing, differential thermal expansion or contraction will cause increased tension in the sheet.

摘要翻译： 通过将刚性框架上的张力柔性片粘合在刚性框架上来制造微电子部件，使得片材跨越框架中的孔，并对将被并入成品部件的柔性片材上的特征进行一个或多个操作。 名气维持片材的尺寸稳定性，并有助于片材的外部元件如加工工具或与片材组装的其他部件的注册。 理想地，框架具有与片材不同的热膨胀系数，使得当片材从接合温度提高到加工中使用的温度时，差分热膨胀或收缩将导致片材的张力增加。

公开(公告)号：US5859472A

公开(公告)日：1999-01-12

申请号：US927601

申请日：1997-09-12

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L21/56 ,  H01L23/498 ,  H05K3/40 ,  H01L23/48 ,  H01L29/06

CPC分类号： H01L21/563 ,  H01L23/49811 ,  H05K3/4092 ,  H01L2224/73203 ,  H01L2924/01079 ,  H01L2924/01322

摘要： A microelectronic assembly includes first and second microelectronic elements having confronting surfaces that are spaced apart from one another. Vertically extensive flexible lead elements interconnect electrical connections on the microelectronic elements. Each of the flexible lead elements may include a plurality of curved conductors that are electrically connected and parallel to one another. The lead elements may initially be formed on a lead bearing surface, and have a terminal end for connection to the first microelectronic element, and a tip end for connection to the second microelectronic element. The terminal end is disposed on the lead bearing surface and fixed to it, while the tip end is releasably connected to the lead bearing surface, and spaced apart from the terminal end on an offset axis. Curved leads interconnect the tip end and the terminal end.

摘要翻译： 微电子组件包括具有彼此间隔开的相对表面的第一和第二微电子元件。 垂直广泛的柔性引线元件互连微电子元件上的电连接。 每个柔性引线元件可以包括电连接并彼此平行的多个弯曲导体。 引线元件可以最初形成在引线轴承表面上，并且具有用于连接到第一微电子元件的终端和用于连接到第二微电子元件的末端。 终端设置在引导轴承表面上并固定在其上，而前端可释放地连接到引导轴承表面，并且在偏移轴线上与终端间隔开。 弯曲导线将尖端和终端互连。

公开(公告)号：US5830782A

公开(公告)日：1998-11-03

申请号：US678808

申请日：1996-07-12

申请人： John W. Smith ,  Thomas H. Distefano

发明人： John W. Smith ,  Thomas H. Distefano

IPC分类号： H01L21/20 ,  H01L21/60 ,  H01L23/12 ,  H01L23/36 ,  H01L23/48

CPC分类号： H01L21/4839 ,  H01L21/561 ,  H01L21/6836 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/544 ,  H01L23/642 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H05K3/4084 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/13016 ,  H01L2224/13018 ,  H01L2224/13026 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13617 ,  H01L2224/13638 ,  H01L2224/13644 ,  H01L2224/1412 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/29191 ,  H01L2224/45124 ,  H01L2224/48744 ,  H01L2224/73204 ,  H01L2224/7525 ,  H01L2224/753 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75824 ,  H01L2224/81007 ,  H01L2224/81091 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2224/819 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L24/05 ,  H01L24/29 ,  H01L24/75 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361

摘要： A method of making a microelectronic assembly includes bonding a plurality of lead connection sections arranged in a row to contacts of a microelectronic element such as a semiconductor chip having contacts in rows at the periphery of the chip. The leads have terminal sections secured to a dielectric support structure, and horizontally curved sections between the terminal regions and bond regions. After bonding, the dielectric support structure is lifted upwardly relative to the chip, so as to bend the leads into a vertically-extensive orientation. Partial straightening of the original horizontal curvature allows each lead to stretch and accommodate the vertical movement.

摘要翻译： 制造微电子组件的方法包括将布置成行的多个引线连接部分接合到微电子元件的触点，例如在芯片周边具有行的触点的半导体芯片。 引线具有固定到电介质支撑结构的端子部分，以及端子区域和接合区域之间的水平弯曲部分。 在接合之后，电介质支撑结构相对于芯片向上提升，以便将引线弯曲成垂直方向。 原始水平曲率的部分矫直允许每个导线拉伸并适应垂直运动。

公开(公告)号：US5798286A

公开(公告)日：1998-08-25

申请号：US532528

申请日：1995-09-22

申请人： Tony Faraci ,  Thomas H. DiStefano ,  John W. Smith

发明人： Tony Faraci ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L25/18 ,  H01L21/60 ,  H01L25/04 ,  H01L21/44

CPC分类号： H01L24/86 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/7965 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351

摘要： A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.

公开(公告)号：US5659952A

公开(公告)日：1997-08-26

申请号：US365699

申请日：1994-12-29

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174

摘要： A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

摘要翻译： 一种用于在半导体芯片和其支撑衬底之间提供平面和兼容接口以适应其间的热膨胀失配的方法和装置。 兼容接口包括限定相邻焊盘之间的通道的多个柔性焊盘。 垫通常在柔性膜芯片载体和芯片之间被压缩。 在通道内进一步布置柔顺填料以形成具有受控厚度的均匀包封层。

公开(公告)号：US5557501A

公开(公告)日：1996-09-17

申请号：US342222

申请日：1994-11-18

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H05K7/20

CPC分类号： H05K7/20445 ,  H01L23/3672 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  Y10T29/4935

摘要： A thermal connector for conducting heat from microelectronic components such as semiconductor chips to a heat sink. The connector includes a large number of flexible thermal conductors desirably formed as elongated "S"-shaped strips or ribbons. The conductors can flex to accommodate tolerances in the assembly and displacement of the components caused by thermal expansion. The conductors may have relatively thin neck sections to increase the flexibility of the conductors, The connector may be fabricated by a process which includes fabrication of the conductors as flat strips, bonding of the conductors to a pair of opposed planar sheets and vertically moving the sheets away from one another to expand the conductors vertically to their final three-dimensional configuration.

摘要翻译： 用于将热量从诸如半导体芯片的微电子部件传导到散热器的热连接器。 连接器包括大量柔性热导体，期望形成为细长的“S”形条带。 导体可以弯曲以适应由热膨胀引起的部件的组装和位移偏差。 导体可以具有相对较薄的颈部部分以增加导体的柔性。该连接器可以通过包括将导体制成扁平条，将导体粘合到一对相对的平面片上并垂直移动片的工艺来制造 彼此远离地将导体垂直地扩展到它们的最终三维配置。

公开(公告)号：US07166914B2

公开(公告)日：2007-01-23

申请号：US10876897

申请日：2004-06-25

申请人： Thomas H. DiStefano ,  John W. Smith ,  Tony Faraci

发明人： Thomas H. DiStefano ,  John W. Smith ,  Tony Faraci

IPC分类号： H01L23/34 ,  H01L29/0623 ,  H01L23/495 ,  H01L23/06 ,  H01L23/10

CPC分类号： H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2224/81904 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H01L2924/00 ,  H01L2224/48

摘要： A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques. The assembly may include additional circuit elements such as capacitors used in conjunction with the chip.

摘要翻译： 包括芯片的封装半导体芯片和诸如散热器的封装元件通过将芯片上的触点之间的柔性引线和诸如片材或板之类的电介质元件上的端子连接并将片或板远离芯片 并且注入液体材料以形成填充封装元件和电介质元件之间的空间并且围绕引线的柔性层。 介质元件和封装元件向外延伸超过芯片的边缘，并物理保护芯片。 组件可以通过常规的表面安装技术来处理和安装。 组件可以包括附加电路元件，例如与芯片结合使用的电容器。