Abstract:
A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of inorganic nanowires. The plurality of inorganic nanowires is embedded throughout at least a region of the layer of cross-linked polymer. The region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film. The composite conductive film has a pencil test hardness in a range of 2H to 9H.
Abstract:
The present invention provides a circuit board, a manufacturing method thereof and a display device. The circuit board comprises a base substrate, a circuit module and a pad, the circuit module and the pad are arranged on the base substrate and are connected. The present invention uses base substrate to replace PCB in the prior art; and therefore, the production cycle of product can be shortened; moreover, the base substrate has a smaller thickness than the PCB, and the thickness of a display device is thus decreased; in the present invention, circuit modules are all provided on the same base substrate, therefore, the space occupied by the circuit modules is decreased, integration is improved, circuit impedance and path length are reduced, and operating speed of the circuit modules is enhanced.
Abstract:
A touch-sensor structure includes a substrate having a plurality of grooves formed thereon. A plurality of first axial electrode strips are disposed in the grooves individually. A plurality of second axial electrode strips are disposed on the substrate and intersect with the first axial electrode strips. An insulating layer fills in the grooves and is disposed at the intersections of the first and second axial electrode strips. Furthermore, the manufacturing method of the touch-sensor structure is provided. The insulating layer is disposed in the grooves of the substrate without a protuberant height on the substrate. Therefore, it can overcome a breakage issue in conventional conductive bridges.
Abstract:
A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of insulating substrates that has light transmissive property and flexibility; a plurality of light-emitting elements arranged between the pair of insulating substrates; an internal wiring pattern that is provided between the pair of insulating substrates, and is connected to the light-emitting elements; and a resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates. An end of the external wiring is divided into a plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern. An end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.
Abstract:
The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≦R≦95% and 0%≦α≦3%.
Abstract:
A transparent conductive film, includes: a transparent substrate, wherein a transparent substrate includes a body and a flexible board, a width of flexible board is less than that of the body, and the body includes a sensing area and a border area located at an edge of the sensing area; a conduction line, disposed on a transparent flexible substrate; a first conductive layer and a second conductive layer, disposed on two sides of the sensing area opposite to each other; a first electrode trace and a second electrode trace, disposed on the border area, and the first conductive layer and the conduction line are electrically connected through a first electrode trace; the second conductive layer and the conduction line are electrically connected through a second electrode trace. The production efficiency of the above transparent conductive film is improved.
Abstract:
A method for manufacturing of a conductive member include forming one of a conductive layer including metal nanowires or a light-scattering layer including insulating light-scattering fine particles on a substrate in a pattern shape; and forming the other of the conductive layer including metal nanowires or the light-scattering layer including insulating light-scattering fine particles on a space of the substrate wherein the one of the conductive layer or the light-scattering layer is not formed.
Abstract:
A conducting film or device electrode includes a substrate and two transparent or semitransparent conductive layers separated by a transparent or semitransparent intervening layer. The intervening layer includes electrically conductive pathways between the first and second conductive layers to help reduce interfacial reflections occurring between particular layers in devices incorporating the conducting film or electrode.
Abstract:
Disclosed is a transparent electrode including a transparent substrate 100, conductive nanowires 10 forming networks, nanoparticles bonding the nanowires 10, and a conductive layer embedded in the transparent substrate 100.
Abstract:
Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron-sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metallic substrate.