公开(公告)号：US20080289178A1

公开(公告)日：2008-11-27

申请号：US11753996

申请日：2007-05-25

申请人： Michael Nashner ,  Jeff Howerton

发明人： Michael Nashner ,  Jeff Howerton

IPC分类号： H05K5/02 ,  H01Q1/00

CPC分类号： H05K3/445 ,  H05K1/053 ,  H05K3/4061 ,  H05K5/0247 ,  H05K2201/0179 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/0315 ,  H05K2203/0323 ,  H05K2203/107 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of forming an isolated electrically conductive contact through a metal substrate by creating at least one via through the substrate. The at least one sidewall of the via is cleaned and coated with a non-conductive layer. In one example, the non-conductive layer is formed by anodizing the sidewall(s) of the via. In another example, the non-conductive layer may be formed by thin film deposition of a dielectric on the sidewall(s). An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.

摘要翻译： 通过形成至少一个通孔穿过衬底，通过金属衬底形成隔离的导电接触的方法。 通孔的至少一个侧壁被清洁并涂覆有非导电层。 在一个示例中，非导电层通过阳极氧化通孔的侧壁而形成。 在另一示例中，非导电层可以通过在侧壁上的电介质的薄膜沉积来形成。 然后将导电填料放入通孔中。 在所公开的实施例中，填料可以是导电油墨或导电环氧树脂。

公开(公告)号：US20080241997A1

公开(公告)日：2008-10-02

申请号：US12081639

申请日：2008-04-18

申请人： Masahiro Sunohara ,  Yuichi Taguchi

发明人： Masahiro Sunohara ,  Yuichi Taguchi

IPC分类号： H01L21/00

CPC分类号： H05K3/445 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/005 ,  H05K3/4053 ,  H05K2203/0108 ,  H01L2924/00

摘要： An interposer includes a substrate made of an inorganic material; a through wiring including conductors embedded in through holes; and an upper wiring and (or) a lower wiring. The through wiring, the upper wiring and the lower wiring are respectively formed on preliminary wiring patterns that are additionally simultaneously or sequentially formed on layers made of an insulating material applied to at least wiring forming parts of the substrate, and are formed with a metal mold itself used for forming the preliminary wiring patterns or layers made of a wiring material applied by a printing operation, a plating operation or a deposition on the preliminary wiring patterns formed on the layers of the insulating material by transferring a fine structure pattern of the metal mold.

摘要翻译： 插入件包括由无机材料制成的基板; 包括嵌入通孔中的导体的贯通布线; 以及上部布线和（或）下部布线。 通过布线，上布线和​​下布线分别形成在预先布线图案上，该布线图案另外同时或顺序地形成在由施加到基板的布线形成部分的绝缘材料制成的层上，并且形成有金属模具 其本身用于通过转印金属模具的精细结构图案来形成由通过印刷操作，电镀操作或沉积施加的布线材料制成的初步布线图案或层叠在形成在绝缘材料层上的预备布线图案上 。

公开(公告)号：US07420130B2

公开(公告)日：2008-09-02

申请号：US11812124

申请日：2007-06-15

申请人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

发明人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

摘要翻译： 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US07420126B2

公开(公告)日：2008-09-02

申请号：US11511496

申请日：2006-08-29

申请人： Kiyoshi Shibata ,  Ryosuke Usui

发明人： Kiyoshi Shibata ,  Ryosuke Usui

IPC分类号： H05K1/03

CPC分类号： H05K3/445 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2203/0323 ,  H05K2203/1572

摘要： A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has the circuit board in which a metal substrate having pierced holes is formed as a core member. Protrusions are formed at the top ends of the pierced holes, and round corners are formed at the bottom ends of the same. Insulating layers are formed on both sides of the metal substrate, and wiring pattern layers are formed on the respective insulating layers. The insulator formed on one side of the metal substrate and the insulator formed on the other side of the metal substrate are extended to inside the pierced holes. The joining surface between the extended portions is shifted off the center position of the metal substrate in the thickness direction, toward the same side as where the protrusions are formed. In order to electrically connect the wiring pattern layers, a conductor layer connecting the wiring layers is formed through the metal substrate via the pierced holes, thereby establishing conduction between the wiring layers. A semiconductor chip is connected directly to the top side of the circuit board via solder balls.

摘要翻译： 提供一种电路板和使用该电路板的电路装置，其具有穿过其金属基板的通孔周围的改善的散热能力，以满足对散热能力的要求。 电路装置具有电路基板，其中具有穿孔的金属基板形成为芯构件。 突起形成在穿孔的顶端，并且在其底端形成圆角。 绝缘层形成在金属基板的两侧，并且布线图案层形成在各绝缘层上。 形成在金属基板的一侧上形成的绝缘体和形成在金属基板的另一侧的绝缘体延伸到穿孔的内部。 延伸部之间的接合面从金属基板的厚度方向的中心位置偏离与形成突起的同一侧。 为了电连接布线图案层，通过穿孔穿过金属基板形成连接布线层的导体层，从而在布线层之间建立导电。 半导体芯片通过焊球直接连接到电路板的顶侧。

公开(公告)号：US07408258B2

公开(公告)日：2008-08-05

申请号：US10783662

申请日：2004-02-20

申请人： Peter C. Salmon

发明人： Peter C. Salmon

IPC分类号： H01L23/04

CPC分类号： H01L21/486 ,  H01L2224/16 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/3011 ,  H05K1/056 ,  H05K3/005 ,  H05K3/107 ,  H05K3/388 ,  H05K3/423 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/465 ,  H05K2201/0141 ,  H05K2201/09563 ,  H05K2203/0108 ,  H01L2924/00

摘要： A method for fabricating copper-faced electronic modules is described. These modules are mechanically robust, thermally accessible for cooling purposes, and capable of supporting high power circuits, including operation at 10 GHz and above. An imprinting method is described for patterning the copper layers of the interconnection circuit, including a variation of the imprinting method to create a special assembly layer having wells filled with solder. The flip chip assembly method comprising stud bumps inserted into wells enables unlimited rework of defective chips. The methods can be applied to multi chip modules that may be connected to other electronic systems or subsystems using feeds through the copper substrate, using a new type of module access cable, or by wireless means. The top copper plate can be replaced with a chamber containing circulating cooling fluid for aggressive cooling that may be required for servers and supercomputers. Application of these methods to create a liquid cooled supercomputer is described.

摘要翻译： 对铜面电子模块的制造方法进行说明。 这些模块具有机械坚固耐用性，可以进行冷却，可用于支持高功率电路，包括在10 GHz及以上的工作。 描述了用于图案化互连电路的铜层的压印方法，包括压印方法的变化以产生具有填充有焊料的阱的特殊组装层。 包括插入孔中的螺柱凸块的倒装芯片组装方法能够对有缺陷的芯片进行无限的返修。 该方法可以应用于可以使用新型的模块接入电缆或通过无线装置连接到使用通过铜基板的馈送的其他电子系统或子系统的多芯片模块。 顶部的铜板可以被包含循环冷却流体的腔室所替代，用于服务器和超级计算机所需的积极冷却。 描述了这些方法的应用以创建液冷式超级计算机。

公开(公告)号：US07353590B2

公开(公告)日：2008-04-08

申请号：US11224191

申请日：2005-09-12

申请人： Kenneth Fallon ,  Miguel A. Jimarez ,  Ross W. Keesler ,  John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  Irv Memis ,  Jim P. Paoletti ,  Marybeth Perrino ,  John A. Welsh ,  William E. Wilson

发明人： Kenneth Fallon ,  Miguel A. Jimarez ,  Ross W. Keesler ,  John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  Irv Memis ,  Jim P. Paoletti ,  Marybeth Perrino ,  John A. Welsh ,  William E. Wilson

IPC分类号： H05K3/36

CPC分类号： H05K3/445 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/056 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/0052 ,  H05K3/0094 ,  H05K3/06 ,  H05K3/108 ,  H05K3/426 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/10734 ,  H05K2203/0323 ,  H05K2203/0574 ,  H05K2203/0733 ,  H05K2203/1394 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer terminating in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.

摘要翻译： 提供了一种在两个可光成像的电介质层之间形成具有金属功率平面层的印刷电路卡的方法。 光刻图形的金属填充通孔和电镀通孔位于光图案化材料中，信号电路位于连接到通孔和电镀通孔的每个介电材料的表面上。 边框可以在卡的周围，包括从电介质层之一的边缘终止的金属层。 提供带有间隙孔的铜箔。 第一层和第二层可光成像的可固化电介质材料位于铜的相对两侧。 在可光成像材料的第一层和第二层上形成图案以通过通孔显露金属层。 开发了通孔，在两个电介质层中对其进行图案化。 可光成像材料，通孔和通孔的表面通过镀铜进行金属化，优选使用光致抗蚀剂。

公开(公告)号：US07342183B2

公开(公告)日：2008-03-11

申请号：US11177442

申请日：2005-07-11

申请人： Frank D. Egitto ,  Voya R. Markovich ,  Luis J. Matienzo

发明人： Frank D. Egitto ,  Voya R. Markovich ,  Luis J. Matienzo

IPC分类号： H01R12/04 ,  H05K1/00

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/445 ,  H05K2201/015 ,  H05K2201/0245 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

摘要翻译： 一种电路化基板，包括与低温导电浆料组合的高温电介质材料，所述糊料包括有机粘合剂成分和至少一种金属成分。 当电介质用作衬底中的层时，金属部件的薄片被烧结以形成通过电介质的导电路径。

公开(公告)号：US20080006928A1

公开(公告)日：2008-01-10

申请号：US11896013

申请日：2007-08-29

申请人： Masashi Miyazaki ,  Mitsuhiro Takayama ,  Tatsuro Sawatari

发明人： Masashi Miyazaki ,  Mitsuhiro Takayama ,  Tatsuro Sawatari

IPC分类号： H01L23/04

CPC分类号： H05K1/185 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/021 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0969 ,  H05K2201/09745 ,  H01L2924/00

摘要： A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

公开(公告)号：US07271349B2

公开(公告)日：2007-09-18

申请号：US10888064

申请日：2004-07-08

申请人： Rebecca A. Jessep ,  Terrance J. Dishongh ,  Carolyn R. McCormick ,  Thomas O. Morgan

发明人： Rebecca A. Jessep ,  Terrance J. Dishongh ,  Carolyn R. McCormick ,  Thomas O. Morgan

IPC分类号： H01R12/14 ,  H05K1/11

CPC分类号： H05K1/024 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/445 ,  H05K2201/0187 ,  H05K2201/09309 ,  H05K2201/09581 ,  H05K2201/09718

摘要： A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In one embodiment, the protective coating is sufficiently hard to deflect a drill bit being used to drill the via hole, thus protecting against misregistered drilled holes.

摘要翻译： 在印刷电路板的导电层中的间隙孔周围形成绝缘材料的保护涂层，使得间隙孔内的通路中的导电材料不会接触导电层并产生短路。 在一个实施例中，保护涂层足够难以偏转用于钻通孔的钻头，从而防止不配准的钻孔。

公开(公告)号：US20070159833A1

公开(公告)日：2007-07-12

申请号：US11586890

申请日：2006-10-26

申请人： Robert Netzel ,  Daniel Armstrong ,  Louis Teran ,  Jeffrey Barsamian ,  Dennis Dunn ,  Abhinay Agarwal

发明人： Robert Netzel ,  Daniel Armstrong ,  Louis Teran ,  Jeffrey Barsamian ,  Dennis Dunn ,  Abhinay Agarwal

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21S8/00 ,  F21V7/0025 ,  F21V7/04 ,  F21V29/74 ,  F21V29/75 ,  F21V29/76 ,  F21V29/85 ,  F21V29/89 ,  F21W2121/02 ,  F21W2131/401 ,  F21Y2115/10 ,  H05B33/0815 ,  H05B33/0857 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0209 ,  H05K2201/10106

摘要： A lighting fixture includes a heat sink having a first mounting portion attached to a housing. A first circuit board containing LEDs is mounted to a first side of a second mounting portion of the heat sink. A second circuit board include an LED control circuit is mounted to a second side of the second mounting portion. A multi-layer circuit board includes a heat-dissipating core bonded to first and second dielectric substrates, which are bonded to first and second electrically conductive layers. An electrical conductor extends through a through-hole in the board to electrically connect the first and second conductive layers. An electrical insulator inside the through-hole electrically isolates the core from the conductor. A transparent cover is shaped to cause downwardly projecting light rays emitted from the LEDs to be refracted more than upwardly projecting light rays. The cover also includes vertically extending projections for horizontally refracting light.

摘要翻译： 照明器具包括具有附接到壳体的第一安装部分的散热器。 含有LED的第一电路板安装在散热片的第二安装部分的第一侧。 第二电路板包括LED控制电路，安装在第二安装部分的第二侧。 多层电路板包括结合到第一和第二电介质基板的散热芯，其结合到第一和第二导电层。 电导体延伸穿过板中的通孔以电连接第一和第二导电层。 通孔内的电绝缘体将芯与导体电隔离。 透明盖被成形为使得从LED发射的向下突出的光线比向上投射的光线折射更多。 盖子还包括用于水平折射光的垂直延伸的突起。