公开(公告)号：US08461672B2

公开(公告)日：2013-06-11

申请号：US12670952

申请日：2008-07-25

申请人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

发明人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

IPC分类号： H01L23/02

CPC分类号： H01L21/50 ,  H01L24/24 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.

摘要翻译： 提供堆叠的微电子单元，其可以包括多个垂直堆叠的微电子元件（12,12A），每个微电子元件具有前表面（117），在前表面暴露的触点（22），后表面（118）和边缘（18 ，20）在前表面和后表面之间延伸。 与触点连接的轨迹（24）可以沿着前表面朝着微电子元件的边缘延伸，其中至少一个堆叠的微电子元件的后表面与微电子单元的顶面（90）相邻。 多个导体（66）可以沿着微电子元件的边缘从迹线（24）延伸到顶面（90）。 导体可以与单元触点（76）导电连接，使得单元触点覆盖邻近顶面的至少一个微电子元件（12A）的后表面（118）。

公开(公告)号：US20120103196A1

公开(公告)日：2012-05-03

申请号：US12914786

申请日：2010-10-28

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： B03C3/36 ,  H01B5/02 ,  B05D5/12 ,  B05D3/02 ,  C23C28/02 ,  C23C14/34 ,  G03G15/02 ,  C25D5/10 ,  B03C3/40

CPC分类号： G03G21/206 ,  B03C3/06 ,  B03C3/60 ,  B03C2201/14 ,  C23C10/28 ,  C23C14/16 ,  C23C14/5806 ,  C25D7/00

摘要： A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. One of the electrodes includes a solid solution formed of a solvent metal having a first performance characteristic and a solute material having a second performance characteristic. The first and second performance characteristics are exhibited substantially independently in the electrode as the solvent metal and solute material remain substantially pure within the solid solution. A method of making an EHD product includes providing an electrode with such a solid solution and positioning the electrode relative to another electrode to motivate fluid flow when energized.

摘要翻译： 热管理装置包括电动液体加速器，其中发射电极和另一电极通电以激励流体流动。 电极之一包括由具有第一性能特性的溶剂金属和具有第二性能特性的溶质材料形成的固溶体。 第一和第二性能特征在电极中基本独立地表现，因为溶剂金属和溶质材料在固溶体中保持基本上纯的。 制造EHD产品的方法包括向电极提供这样的固溶体，并且相对于另一电极定位电极以在通电时激励流体流动。

公开(公告)号：US20110248410A1

公开(公告)日：2011-10-13

申请号：US12671993

申请日：2008-08-01

申请人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

发明人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L25/00 ,  H01L21/77 ,  H01L21/58

CPC分类号： H01L25/00 ,  H01L21/50 ,  H01L21/568 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.

摘要翻译： 提供堆叠的微电子单元，其具有远离顶表面的顶表面和底表面以及其中的多个垂直堆叠的微电子元件，包括至少一个微电子元件，其具有与顶表面相邻的前表面和朝向后表面 朝向底面。 每个微电子元件具有从前面的触点延伸超过微电子元件的边缘的迹线。 电介质层接触微电子元件的边缘并且位于至少一个微电子元件的后表面的下方。 引线连接到沿着介电层延伸的迹线。 在顶表面暴露的单元触点连接到引线。

公开(公告)号：US07935568B2

公开(公告)日：2011-05-03

申请号：US11590616

申请日：2006-10-31

申请人： Vage Oganesian ,  David Ovrutsky ,  Charles Rosenstein ,  Belgacem Haba ,  Giles Humpston

发明人： Vage Oganesian ,  David Ovrutsky ,  Charles Rosenstein ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L24/06 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/274 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and rear surfaces. At least some of the conductive features are insulated from the exposed semiconductive or conductive material. By electrodeposition, an insulative layer is formed to overlie the at least one of exposed semiconductive material or conductive material. Subsequently, a plurality of conductive contacts and a plurality of conductive traces are formed overlying the electrodeposited insulative layer, the conductive traces connecting the conductive features to the conductive contacts. The unit can be incorporated in a camera module having an optical element in registration with an imaging area of the semiconductor element.

摘要翻译： 提供了一种用于制造包括诸如传感器单元的半导体元件的单元的方法，例如用于光学成像。 半导体元件具有在前表面处暴露的多个导电特征，并且暴露在前表面和后表面中的至少一个上的半导体或导电材料。 至少一些导电特征与暴露的半导电材料或导电材料绝缘。 通过电沉积，形成绝缘层以覆盖暴露的半导体材料或导电材料中的至少一种。 随后，多个导电触点和多个导电迹线形成在电沉积绝缘层上，导电迹线将导电特征连接到导电触点。 该单元可以结合在具有与半导体元件的成像区域对准的光学元件的相机模块中。

公开(公告)号：US20100270679A1

公开(公告)日：2010-10-28

申请号：US12829709

申请日：2010-07-02

申请人： Belgacem Haba ,  Giles Humpston

发明人： Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

摘要翻译： 制造微电子封装的方法包括通过提供具有顶表面，底表面和在顶表面和底表面之间延伸的开口的板来制造子组件，将柔性层附接到板的顶表面，顺应层具有开口， 与延伸穿过板的开口对齐，并且在柔性层上提供导电特征。 在制造子组件之后，板的底表面与半导体晶片的顶表面相连，使得延伸穿过该板的开口与晶片上的触点对准。 柔性层上的至少一些导电特征与半导体晶片上的触点电互连。

公开(公告)号：US20090065907A1

公开(公告)日：2009-03-12

申请号：US12221204

申请日：2008-07-31

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L23/538 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 410 extending from the rear surface through the semiconductor element 401 and through the contacts 403. A dielectric layer 411 can line the through holes 410. A conductive layer 412 may overlie the dielectric layer 411 within the through holes 410. The conductive layer 412 can conductively interconnect the contacts 403 with unit contacts.

摘要翻译： 微电子单元400可以包括具有前表面的半导体元件401，与前表面相邻的微电子半导体器件，在前表面处的触点403和远离前表面的后表面。 半导体元件401可以具有从后表面延伸通过半导体元件401并通过触点403的通孔410.电介质层411可以使通孔410线化。导电层412可覆盖通孔内的电介质层411 导电层412可以将触点403与单元触点导电地互连。

公开(公告)号：US20080088033A1

公开(公告)日：2008-04-17

申请号：US11581888

申请日：2006-10-17

申请人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

发明人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base that is in contact with the flexible substrate and a conductive tip that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

摘要翻译： 微电子封装包括具有触点的微电子元件，与微电子元件隔开并覆盖的柔性基板以及从柔性基板延伸并远离微电子元件突出的多个导电柱。 导电柱与微电子元件电互连。 每个导电柱具有与柔性基板接触的导电基底和从基部延伸的导电尖端，导电柱的基部具有比导电柱的尖端更大的直径。 在某些实施例中，导电基底和导电尖端具有圆柱形形状。

公开(公告)号：US20080036100A1

公开(公告)日：2008-02-14

申请号：US11435970

申请日：2006-05-17

申请人： Bruce M. McWilliams ,  Belgacem Haba ,  Giles Humpston

发明人： Bruce M. McWilliams ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/58 ,  B23K31/02

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11902 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Elongated solder masses are formed by contacting the molten solder with the walls of holes in a dielectric layer overlying the front face of a chip element such as a wafer. The elongated solder masses have a relatively large aspect ratio, or ratio of height to maximum diameter, and thus provide a high reliability connection with a relatively small diameter compatible with closely spaced contacts on the chip.

摘要翻译： 通过使熔融焊料与位于诸如晶片的芯片元件的前表面上的介电层中的孔的壁接触来形成细长的焊料质量。 细长的焊料质量具有相对较大的纵横比或高度与最大直径的比率，并因此提供与芯片上紧密间隔的触头相兼容的相对较小直径的高可靠性连接。

公开(公告)号：US20070138644A1

公开(公告)日：2007-06-21

申请号：US11300900

申请日：2005-12-15

申请人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  Robert Burtzlaff

发明人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  Robert Burtzlaff

IPC分类号： H01L23/48

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3011 ,  H03H3/007 ,  H03H9/1092 ,  H01L2924/00014 ,  H01L2924/00

摘要： A capped chip is provided which includes a chip having a front surface, a plurality of conductive features exposed at the front surface and a cap. The cap has an inner surface facing the front surface of the chip, an outer surface opposite the inner surface, and a through hole extending from the outer surface to the inner surface. A conductive interconnect extends at least partially through the through hole. The interconnect includes a conductive article which occupies a substantial portion of a volume of the interconnect and the interconnect further includes a flowable conductive medium which joins the conductive article to at least one of the plurality of conductive features of the chip or to the cap.

摘要翻译： 提供了一种封盖芯片，其包括具有前表面的芯片，在前表面处暴露的多个导电特征和盖。 盖具有面向芯片的前表面的内表面，与内表面相对的外表面，以及从外表面延伸到内表面的通孔。 导电互连件至少部分延伸穿过通孔。 互连件包括占据互连体积的主要部分的导电制品，并且互连件还包括将导电制品连接到芯片的多个导电特征中的至少一个或帽的至少一个的可流动导电介质。

公开(公告)号：US07224056B2

公开(公告)日：2007-05-29

申请号：US10949844

申请日：2004-09-24

申请人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David B. Tuckerman ,  Michael Warner ,  Craig S. Mitchell

发明人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David B. Tuckerman ,  Michael Warner ,  Craig S. Mitchell

IPC分类号： H01L23/12

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.

摘要翻译： 提供一种封装的微电子器件，其包括：（a）具有面向上的前表面和面向下的后表面的芯片的单元，覆盖所述芯片的前表面的至少一部分的盖，所述盖具有 面向上远离芯片的顶表面和暴露在盖的顶表面处的单元连接。 至少一些单元连接电连接到芯片。 封装的微电子器件还包括包括限定封装端子的结构的封装结构，至少一些封装端子电连接到芯片。 封装结构，单元或两者限定了封装的向下的底部表面，端子在底部表面露出。