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    Systems and methods for controlling release of transferable semiconductor structures
    53.
    发明授权
    Systems and methods for controlling release of transferable semiconductor structures 有权

    公开(公告)号：US09601356B2

    公开(公告)日：2017-03-21

    申请号：US14743988

    申请日：2015-06-18

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl

    IPC: H01L21/56 ,  H01L21/683 ,  B81C99/00 ,  H01L23/00

    CPC classification number: H01L21/7813 ,  B81C99/008 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/83 ,  H01L2221/68368

    Abstract: The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.

    Printable Inorganic Semiconductor Structures
    55.
    发明申请
    Printable Inorganic Semiconductor Structures 有权
    可打印的无机半导体结构

    公开(公告)号：US20160336488A1

    公开(公告)日：2016-11-17

    申请号：US14713877

    申请日：2015-05-15

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

    IPC: H01L33/32 ,  H01L33/62 ,  H01L33/00

    CPC classification number: H01L33/0079 ,  H01L21/6835 ,  H01L29/7848 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/26 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

    Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

    Abstract translation: 本发明提供了能够构造形成在可以被微转印印刷的蓝宝石衬底上的微型LED小芯片的结构和方法。 这种印刷结构使得低成本，高性能的电连接微型LED阵列可用于例如显示系统。 此外，在一个实施例中，用于印刷的LED的电触点在单组工艺步骤中电互连。 在某些实施例中，可印刷的微器件的形成开始于半导体结构保留在衬底上。 在部分地形成可印刷的微器件之后，将手柄衬底附接到与衬底相对的系统，使得系统固定到手柄衬底。 然后可以去除衬底并完成半导体结构的形成。 完成后，可打印的微型装置可以是微转印印刷到目的基板。

    Method for Producing a Semiconductor Component and a Semiconductor Component
    58.
    发明申请
    Method for Producing a Semiconductor Component and a Semiconductor Component 有权
    用于制造半导体元件和半导体元件的方法

    公开(公告)号：US20160225953A1

    公开(公告)日：2016-08-04

    申请号：US15009736

    申请日：2016-01-28

    Applicant: OSRAM Opto Semiconductors GmbH ,  X-Celeprint Limited

    Inventor： Matthew Meitl ,  Christopher Bower ,  Tansen Varghese

    IPC: H01L33/22 ,  H01L25/075 ,  H01L33/46 ,  H01L33/00 ,  H01L33/32

    CPC classification number: H01L33/22 ,  H01L25/0753 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/32 ,  H01L33/382 ,  H01L33/465 ,  H01L2933/0033 ,  H01L2933/0058

    Abstract: A method for producing a plurality of semiconductor components and a semiconductor component is disclosed. In some embodiment, the method includes forming a semiconductor layer sequence, structuring the semiconductor layer sequence by forming trenches thereby structuring semiconductor bodies, applying an auxiliary substrate on the semiconductor layer sequence, so that the semiconductor layer sequence is arranged between the auxiliary substrate and the substrate and removing the substrate from the semiconductor layer sequence. The method further comprises applying an anchoring layer covering the trench and vertical surfaces of the semiconductor bodies, forming a plurality of tethers by structuring the anchoring layer in regions covering the trench, locally detaching the auxiliary substrate from the semiconductor bodies, wherein the tethers remain attached to the auxiliary substrate and selectively picking up a semiconductor body by separating the tethers from the auxiliary substrate, the semiconductor body including a portion of the layer sequence.

    Abstract translation: 公开了一种用于制造多个半导体部件和半导体部件的方法。 在一些实施例中，该方法包括形成半导体层序列，通过形成沟槽从而构成半导体体，构成半导体层序列，在半导体层序列上施加辅助衬底，使得半导体层序列被布置在辅助衬底和 衬底并从半导体层序列移除衬底。 该方法还包括施加覆盖半导体主体的沟槽和垂直表面的锚定层，通过在覆盖沟槽的区域中构造锚定层形成多个系绳，将辅助衬底局部地从半导体主体分离，其中系链保持连接 并且通过从辅助基板分离系绳来选择性地拾取半导体本体，半导体主体包括层序列的一部分。

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