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    CAPACITOR FRAME ASSEMBLY
    55.
    发明申请
    CAPACITOR FRAME ASSEMBLY 有权
    电容器框架组件

    公开(公告)号：US20160344119A1

    公开(公告)日：2016-11-24

    申请号：US14714916

    申请日：2015-05-18

    Applicant: Autoliv ASP, Inc.

    Inventor： Boris G. Karasik ,  William M. Leach

    IPC: H01R12/70 ,  H05K1/18

    CPC classification number: H01R12/7076 ,  H01R12/724 ,  H01R13/719 ,  H05K1/18 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/105 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

    Abstract: An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.

    Abstract translation: 组件提供了用于将端口连接器安装在电路板上并且还将电容器固定到电路板的双重功能。 组件包括电路板和具有凸缘，卡扣结构，电容器支架和插座部分的整体式塑料框架。 凸缘具有用于将框架紧固到电路板的紧固结构。 用于端口连接器到框架的卡扣附接的卡扣结构布置在电路板的端部边缘附近。 用于保持圆柱形电容器的电容器支架邻近卡扣结构形成，并且通过气隙从电路板升高。 插座部分用于接收电容器接触引线的插座触点。

    CAPACITOR HOLDER, AND CAPACITOR HOLDING STRUCTURE
    56.
    发明申请
    CAPACITOR HOLDER, AND CAPACITOR HOLDING STRUCTURE 有权
    电容器和电容器保持结构

    公开(公告)号：US20160295697A1

    公开(公告)日：2016-10-06

    申请号：US14442105

    申请日：2013-10-29

    Applicant: KITAGAWA INDUSTRIES CO., LTD.

    Inventor： Tatsuya NAKAMURA

    IPC: H05K1/18

    CPC classification number: H05K1/181 ,  H01G2/06 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10583 ,  H05K2201/10606

    Abstract: A capacitor holder comprises: a holding portion having a cylindrical inner wall surface, at least an outer peripheral portion of the inner wall surface being open, the holding portion being configured to hold a capacitor inserted through the opening into an inside of the inner wall surface; a fixed portion formed integrally with the holding portion and positioned opposite to the opening of the holding portion; a pair of fitting grooves formed at a pair of end surfaces of the fixed portion opposed to each other adjacent to the holding portion, the fitting grooves being configured to fittably engage with end edges of a printed circuit board to extend along a surface of the printed circuit board; and a proximity suppressor configured to suppress portions of the fixed portion where the fitting grooves are formed from being brought into proximity each other.

    Abstract translation: 电容器保持器包括：具有圆筒形内壁表面的保持部分，内壁表面的至少外周部分是开放的，保持部分构造成将通过开口插入的电容器保持在内壁表面的内部 ; 与所述保持部一体形成并与所述保持部的开口相对定位的固定部; 一对嵌合槽，形成在所述固定部分的相对于所述保持部分相对的一对端面处，所述嵌合槽被配置为与所述印刷电路板的端部边缘适配地接合以沿着所述印刷电路板的表面延伸 电路板; 以及接近抑制器，被配置为抑制形成有嵌合槽的固定部分的彼此接近的部分。

    ULTRA-SMALL LED ELECTRODE ASSEMBLY AND METHOD FOR MANUFACTURING SAME
    57.
    发明申请
    ULTRA-SMALL LED ELECTRODE ASSEMBLY AND METHOD FOR MANUFACTURING SAME 有权
    超小型LED电极组件及其制造方法

    公开(公告)号：US20160148911A1

    公开(公告)日：2016-05-26

    申请号：US14903858

    申请日：2014-07-08

    Applicant: PSI CO., LTD.

    Inventor： Young Rag Do

    IPC: H01L25/075 ,  H01L33/38 ,  H01L33/62

    CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

    Abstract: Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

    Abstract translation: 提供了一种纳米级LED组件及其制造方法。 首先，独立制造的纳米级LED器件可以对准并连接到彼此不同的两个电极，以解决将具有纳米单元的纳米级LED器件耦合到彼此不同的两个电极的限制 站立状态。 此外，由于LED器件和电极设置在同一平面上，所以可以提高LED器件的光提取效率。 此外，可以调整纳米级LED器件的数量。 第二，由于纳米尺度的LED器件不能立即连接到上电极和下电极，而是要被连接到在同一平面上彼此不同的两个电极，所以光提取效率可以非常改善 。 此外，由于在LED器件的表面上形成单独的层以防止LED器件和电极电短路，所以可以使LED电极组件的缺陷最小化。 此外，为了准备LED装置的非常罕见的缺陷的发生，可以将多个LED器件连接到电极以保持纳米级LED电极组件的原始功能。

    Method of Making a Circuit Board on a Mandrel
    58.
    发明申请
    Method of Making a Circuit Board on a Mandrel 审中-公开
    在心轴上制作电路板的方法

    公开(公告)号：US20160073507A1

    公开(公告)日：2016-03-10

    申请号：US14939761

    申请日：2015-11-12

    Applicant: United States of America as Represented by the Secretary of the Army

    Inventor： Bruce V. Hughes

    IPC: H05K3/10

    CPC classification number: H05K3/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/4682 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/10583 ,  Y10T29/49155

    Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.

    Abstract translation: 非平面印刷电路板具有内表面和外表面。 在内表面和外表面之间是导电和介电材料层。 被动和有源的电气部件嵌入在内部和外部表面。 中空区域由非平面电路板的内表面限定。 非平面印刷电路板在具有非平面形状的心轴上制造，例如圆柱体或球体，以便形成中空弯曲的非平面结构。

    Surface mount bias tee
    60.
    发明授权
    Surface mount bias tee 有权
    表面安装偏置三通

    公开(公告)号：US08644029B1

    公开(公告)日：2014-02-04

    申请号：US13192709

    申请日：2011-07-28

    Applicant: Daxiong Ji

    Inventor： Daxiong Ji

    IPC: H05K1/18

    CPC classification number: H05K3/3415 ,  H05K3/306 ,  H05K3/3442 ,  H05K2201/10265 ,  H05K2201/10515 ,  H05K2201/10583 ,  Y02P70/613

    Abstract: A miniaturized wideband surface mount bias tee comprises a printed circuit board with a functioning first capacitor and a dummy second capacitor, and an inductor bonded atop the two capacitors. The capacitors, adhesive and solder are depositable by standard surface mount pick and place machinery. The inductor wires are bonded to one of the first capacitor bonding pads and to an inductor bonding pad. The circuit element bonding pads include portions bordering the pc board edges and are conductively connected to bonding pads on the bottom face of the pc board. Conductive thru-vias for the first capacitor bonding pads reduce parasitic inductance and extend the operating frequency range. A flat-topped insulating cap encloses the bias tee sides and top. The cap forms an air gap between the inductor and circuit elements and provides a surface for manipulating the bias tee with present-day assembly equipment.

    Abstract translation: 小型宽带表面贴装偏置三通包括具有功能的第一电容器和虚拟第二电容器的印刷电路板，以及结合在两个电容器顶上的电感器。 电容器，粘合剂和焊料可以通过标准表面安装拾取和放置机械进行沉积。 电感器线结合到第一电容器接合焊盘之一和电感器焊盘。 电路元件接合焊盘包括与印刷电路板边缘相邻的部分，并且与导电板的底面上的接合焊盘导电连接。 用于第一电容器接合焊盘的导电通孔减少寄生电感并延长工作频率范围。 平顶绝缘帽包围偏置三通和顶部。 盖在电感器和电路元件之间形成空气间隙，并提供用于利用当今组装设备操纵偏置三通的表面。

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