公开(公告)号：US5077085A

公开(公告)日：1991-12-31

申请号：US22439

申请日：1987-03-06

申请人： Joel M. Schnur ,  Paul E. Schoen ,  Martin C. Peckerar ,  Christie R. K. Marrian ,  Jeffrey M. Calvert ,  Jacque H. Georger, Jr.

发明人： Joel M. Schnur ,  Paul E. Schoen ,  Martin C. Peckerar ,  Christie R. K. Marrian ,  Jeffrey M. Calvert ,  Jacque H. Georger, Jr.

IPC分类号： B05D1/18 ,  C09D4/00 ,  C40B60/14 ,  G06N3/00 ,  G06N99/00 ,  H01L21/288 ,  H05K3/18

CPC分类号： G06N99/007 ,  B05D1/185 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C09D4/00 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1882 ,  G06N3/002 ,  H01L21/288 ,  H01L21/2885 ,  H05K3/185 ,  B01J2219/00432 ,  B01J2219/00603 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00637 ,  B01J2219/00659 ,  B01J2219/00711 ,  B82Y5/00 ,  C12N2535/10 ,  C40B60/14

摘要： A process for producing metal plated paths on a solid substrate of the kind which has polar functional groups at its surface utilizes a self-assembling monomolecular film that is chemically adsorbed on the substrate's surface. The solid substrate may, for example, be an insulator of the kind used for substrates in printed circuitry or may, as another example, be a semiconductor of the kind used in semiconductor microcircuitry. The chemical reactivity in regions of the ultra-thin film is altered to produce a desired pattern in the film. A catalytic precursor which adheres only to those regions of the film having enough reactivity to bind the catalyst is applied to the film's surface. The catalyst coated structure is then immersed in an electrolers plating bath where metal plates onto the regions activated by the catalyst.

摘要翻译： 在其表面上具有极性官能团的固体基板上制造金属电镀路径的方法利用化学吸附在基板表面上的自组装单分子膜。 固体基材例如可以是用于印刷电路板中的基板的绝缘体，或者作为另一示例，可以是半导体微电路中使用的半导体。 在超薄膜的区域中的化学反应性被改变以在膜中产生所需的图案。 仅将粘合有具有足够反应性的膜结合催化剂的区域的催化前体施加到膜的表面。 然后将催化剂涂覆的结构浸入其中金属板的电极电镀浴到由催化剂活化的区域上。

公开(公告)号：US4726965A

公开(公告)日：1988-02-23

申请号：US919158

申请日：1986-10-15

申请人： Rolf Zondler

发明人： Rolf Zondler

IPC分类号： G02F1/1345 ,  B23K1/20 ,  B23K35/14 ,  C23C18/18 ,  C23C18/31 ,  G02F1/13 ,  G09F9/30 ,  H05K3/24 ,  C23C18/28

CPC分类号： H05K3/24 ,  C23C18/1651 ,  C23C18/1882 ,  H05K2201/0326 ,  H05K2201/0347

摘要： To metallize transparent conductive paths of indium tin oxide (ITO) on substrates of display devices, a solderable metal layer is applied by electroless deposition. If the metal layer is adjacent a liquid crystal display device, the display device may be manufactured and tested prior to the electroless deposition, with only an edge of the substrate being dipped into the deposition bath. Prior to the deposition of the solderable metal layer, the indium tin oxide surface may be reduced and an adhesion improving layer of may also be deposited by above the indium tin surface and below the solderable metal layer. Integrated circuits can then be soldered to the metallized conductive paths.

摘要翻译： 为了在显示装置的基板上金属化氧化铟锡（ITO）的透明导电路径，通过无电沉积施加可焊接的金属层。 如果金属层与液晶显示装置相邻，则可以在无电沉积之前制造和测试显示装置，只有基板的边缘被浸入沉积浴中。 在可焊接金属层的沉积之前，可以减少铟锡氧化物表面，并且还可以在铟锡表面上方并且在可焊接金属层之下沉积粘附改善层。 然后可以将集成电路焊接到金属化导电路径。

公开(公告)号：US10017859B2

公开(公告)日：2018-07-10

申请号：US15064477

申请日：2016-03-08

申请人： BYD COMPANY LIMITED

发明人： Fangxiang Zhou ,  Jiang Huang

IPC分类号： C23C18/16 ,  C08K3/32 ,  C23C18/20 ,  C23C18/40 ,  C09D11/322 ,  C09D11/106 ,  C09D11/14 ,  C23C18/18 ,  C23C18/28 ,  C08K3/26

CPC分类号： C23C18/1608 ,  C08K3/32 ,  C08K2003/265 ,  C08K2003/321 ,  C08K2003/325 ,  C08K2003/326 ,  C08K2003/328 ,  C09D11/106 ,  C09D11/14 ,  C09D11/322 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1882 ,  C23C18/204 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/28 ,  C23C18/405

摘要： Embodiments of the present disclosure are directed to a polymer article. The polymer article includes a polymer matrix and a metal compound dispersed in the polymer matrix. The metal compound is a compound represented by formula (I): AxCuy(PO4)2 (I). In formula (I), A represents at least one element selected from Group IIA of the periodic table of elements, x/y=0.1 to 20, x+y=3.

公开(公告)号：US20170348642A1

公开(公告)日：2017-12-07

申请号：US15175629

申请日：2016-06-07

申请人： Council of Scientific & Industrial Research

发明人： Kothandam Krishnamoorthy

IPC分类号： B01D69/02 ,  B01D63/08 ,  H01G11/22 ,  H01G11/52 ,  B01D69/12 ,  B01D71/02 ,  B01D71/66 ,  B01D71/74 ,  C23C18/16 ,  C23C18/18 ,  C23C18/30 ,  C23C18/32 ,  D06N3/12 ,  D06N3/00 ,  D06M15/63 ,  D06M11/83 ,  C25D9/02 ,  C23C28/02 ,  C23C28/00 ,  C23C18/42 ,  H01G11/58 ,  D06M101/12

CPC分类号： H01G11/58 ,  C23C18/1882 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/36 ,  C23C18/38 ,  C23C18/44 ,  C23C28/00 ,  C23C28/023 ,  C25D9/02 ,  C25D13/12 ,  D06M11/83 ,  D06M13/00 ,  D06M13/152 ,  D06M15/61 ,  D06M15/63 ,  D06M23/08 ,  D06M2101/12 ,  D10B2211/04 ,  D10B2401/021 ,  D10B2505/04 ,  H01G11/28 ,  H01G11/48 ,  H01G11/52 ,  H01G11/62 ,  H01G11/68 ,  H01G11/70

摘要： An electrode, process for preparing the electrode and devices thereof. An electrode comprising at least one metal deposited on a substrate; and at least one electrically conducting polymer. The devices comprising the electrode for energy storage and molecular separation.

公开(公告)号：US09662423B2

公开(公告)日：2017-05-30

申请号：US14184019

申请日：2014-02-19

申请人： C.R. BARD, INC.

发明人： Richard Terry ,  Fungbor Chen ,  Zhihui Yin

IPC分类号： A61L31/08 ,  A61L27/34 ,  A61L27/54 ,  A61L29/08 ,  A61L29/16 ,  A61L31/10 ,  A61L31/16 ,  B05D7/02 ,  A61L29/10 ,  A61M25/00 ,  C23C18/18 ,  C23C18/20 ,  C23C18/42 ,  B05D5/06

CPC分类号： A61L31/088 ,  A61L27/34 ,  A61L27/54 ,  A61L29/085 ,  A61L29/106 ,  A61L29/16 ,  A61L31/10 ,  A61L31/16 ,  A61L2300/104 ,  A61L2300/404 ,  A61M25/0017 ,  B05D5/067 ,  B05D7/02 ,  C23C18/1882 ,  C23C18/1893 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/42 ,  Y10T428/31692 ,  Y10T428/31707

摘要： Methods for the deposition of silver-comprising films on nonconducting substrates, and, more particularly, to deposition of such films that are very thin, are provided. The surface of nonconducting substrates is modified with a superabsorbent polymer to increase silver deposition when compared to a non-modified surface. Also provided are films produced using a swelling agent, whereby porosity of the surface of the nonconducting substrate is increased, thereby permitting increased silver deposition when compared to an unmodified surface.

公开(公告)号：US09564333B2

公开(公告)日：2017-02-07

申请号：US14766389

申请日：2014-02-21

申请人： ALCHIMER

发明人： Vincent Mevellec ,  Dominique Suhr

IPC分类号： H01L21/44 ,  H01L21/285 ,  H01L21/3205 ,  C23C18/18 ,  C23C18/16 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L21/28 ,  H01L21/288 ,  H01L31/0224

CPC分类号： H01L21/28518 ,  C23C18/1607 ,  C23C18/1639 ,  C23C18/1642 ,  C23C18/1692 ,  C23C18/1696 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L21/28052 ,  H01L21/288 ,  H01L21/32053 ,  H01L31/022425

摘要： A subject matter of the invention is a process for the formation of nickel silicide or of cobalt silicide, comprising the stages consisting in: exposing the surface of the silicon-comprising substrate with an aqueous solution comprising from 0.1 mM to 10 mM of gold ions and from 0.6 M to 3.0 M of fluorine ions for a duration of between 5 seconds and 5 minutes, depositing by an electroless route, on the activated substrate, a layer essentially composed of nickel or of cobalt, applying a rapid thermal annealing at a temperature of between 300° C. and 750° C., so as to form the nickel silicide or the cobalt silicide. The aqueous solution comprises a surface-active agent chosen from the compounds comprising at least one anionic or nonionic polar group and an alkyl chain comprising from 10 to 16 carbon atoms.This process essentially has applications in the manufacture of NAND memories and photovoltaic cells.

摘要翻译： 该过程基本上在制造NAND存储器和光伏电池中具有应用。

公开(公告)号：US09512522B2

公开(公告)日：2016-12-06

申请号：US14315166

申请日：2014-06-25

申请人： SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

发明人： Weifeng Miao

IPC分类号： C23C18/18 ,  C25D5/02 ,  C23C18/20 ,  C23C18/16 ,  H05K1/09 ,  H05K3/24 ,  C23C28/00 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  H05K3/18

CPC分类号： C23C18/1882 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  C23C18/1608 ,  C23C18/1639 ,  C23C18/165 ,  C23C18/1865 ,  C23C18/1879 ,  C23C18/2033 ,  C23C18/206 ,  C23C28/00 ,  C25D5/02 ,  H05K1/097 ,  H05K3/18 ,  H05K3/246 ,  H05K2203/1105

摘要： A mthod of metalizing a surface of an insulation substrate includes: applying an ink composition onto the surface to form an ink layer; subjecting the insulation substrate to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; plating a metal layer on the ink layer. The ink composition comprises a metal compound and an ink vehicle. The metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II, TiO2-σ(I), M1M2pOq (II), 0.05≦σ

摘要翻译： 金属化绝缘基板的表面的正面包括：将油墨组合物施加到表面上以形成油墨层; 使绝缘基板在非反应性气氛中在约500至1000摄氏度的温度下进行热处理; 在油墨层上镀金属层。 油墨组合物包含金属化合物和油墨载体。 金属化合物包括选自纳米氧化铜，纳米氧化亚铜，式I化合物和式II化合物的至少一种，TiO 2-σ（I），M1M2pOq（II）， 0.05≤σ<1.8，其中，M1为选自周期表第2,9-12族的元素中的至少一种元素，M2为选自3-8,10和10族中的至少一种元素， 周期表13，0

公开(公告)号：US09472811B2

公开(公告)日：2016-10-18

申请号：US13027911

申请日：2011-02-15

申请人： Junliang Zhang ,  Zhongyi Liu ,  Zhiqiang Yu

发明人： Junliang Zhang ,  Zhongyi Liu ,  Zhiqiang Yu

IPC分类号： H01M4/88 ,  H01M4/92 ,  H01M8/02 ,  H01M4/90 ,  H01M4/86 ,  C23C18/16 ,  C23C18/18 ,  C23C18/32 ,  C23C18/36 ,  C23C18/54 ,  H01M8/10

CPC分类号： H01M4/9083 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/32 ,  C23C18/36 ,  C23C18/54 ,  H01M4/8657 ,  H01M4/921 ,  H01M4/926 ,  H01M2008/1095 ,  Y02E60/50

摘要： A method for forming an electrocatalyst for fuel cell applications comprises electrolessly depositing a first plurality of nickel particles onto carbon-support particles. The nickel particles are formed from a nickel ion-containing aqueous solution. At least a portion of the nickel particles are replaced with platinum via a galvanic displacement reaction to form a second plurality of nickel particles coated with a platinum layer. During this displacement reaction step, the nickel particles are heated to a temperature sufficient to form the platinum layer. Finally, the second plurality of nickel particles is optionally incorporated into a cathode layer of a fuel cell.

摘要翻译： 形成燃料电池用电极催化剂的方法包括将第一多个镍颗粒无电沉积到碳载体颗粒上。 镍颗粒由含镍离子的水溶液形成。 通过电位移反应将至少一部分镍颗粒替换为铂，以形成涂有铂层的第二多个镍颗粒。 在该置换反应步骤期间，将镍颗粒加热到足以形成铂层的温度。 最后，第二组镍颗粒任选地并入燃料电池的阴极层中。

公开(公告)号：US20160010215A1

公开(公告)日：2016-01-14

申请号：US14428189

申请日：2013-09-12

申请人： NISSAN CHEMICAL INDUSTRIES, LTD.

发明人： Daigo SAITO ,  Keisuke KOJIMA

IPC分类号： C23C18/31 ,  C23C18/16

CPC分类号： C23C18/31 ,  C23C18/165 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/30

摘要： It is an object of the present invention to provide a novel primer for use in pretreatment steps in electroless plating which is environmentally friendly, by which process is easy with fewer steps, and which can realize cost reduction. A primer for forming a metal plating film on a base material by electroless plating, the primer including: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; a metal fine particle; and an alkoxysilane.

摘要翻译： 本发明的目的是提供一种用于化学镀中的预处理步骤的新型底漆，其是环保的，通过该步骤，步骤更简单，并且可以实现成本降低。 一种用于通过化学镀在基材上形成金属电镀膜的底漆，所述底漆包括：在分子末端具有铵基并且重均分子量为500至5,000,000的超支化聚合物; 金属微粒; 和烷氧基硅烷。

公开(公告)号：US20150325369A1

公开(公告)日：2015-11-12

申请号：US14805525

申请日：2015-07-22

申请人： Murata Manufacturing Co., Ltd.

发明人： Mitsunori Inoue ,  Tomohiko Mori

IPC分类号： H01G2/12 ,  C23C28/00 ,  H01C7/10 ,  H01G4/12 ,  H01F27/28 ,  H01G4/005 ,  H01C7/04 ,  H01F41/00 ,  H01C17/00 ,  H01G4/30 ,  H01F27/23 ,  C25D7/00 ,  H01C7/02

CPC分类号： H01G2/12 ,  C23C18/1641 ,  C23C18/1882 ,  C23C28/00 ,  C25D5/54 ,  C25D5/56 ,  C25D7/00 ,  H01C7/003 ,  H01C7/02 ,  H01C7/04 ,  H01C7/10 ,  H01C7/1006 ,  H01C7/102 ,  H01C17/00 ,  H01C17/02 ,  H01F27/23 ,  H01F27/2804 ,  H01F41/00 ,  H01F2027/2809 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/224 ,  H01G4/30

摘要： A ceramic electronic component that includes a ceramic main body, a coating film and external electrodes on the surface of the ceramic main body. The coating film is selectively formed on the surface of the ceramic main body by applying, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize constituent elements of the ceramic main body. The coating film includes a resin and the constituent elements of the ceramic main body, which were ionized and deposited from the ceramic main body.

摘要翻译： 一种陶瓷电子部件，其包括陶瓷主体，涂膜和陶瓷主体表面上的外部电极。 通过向陶瓷主体的表面涂敷含有陶瓷主体表面的树脂溶液，使陶瓷主体的构成元件电离，从而在陶瓷主体的表面上选择性地形成涂膜 身体。 涂膜包括从陶瓷主体离子化并沉积的树脂和陶瓷主体的构成元件。