公开(公告)号：US20090115047A1

公开(公告)日：2009-05-07

申请号：US12287380

申请日：2008-10-08

申请人： Belgacem Haba ,  Vage Oganesian ,  Kimitaka Endo

发明人： Belgacem Haba ,  Vage Oganesian ,  Kimitaka Endo

IPC分类号： H01L23/522 ,  B32B38/00 ,  C23F1/00 ,  B32B38/10 ,  H01L21/768

CPC分类号： H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/24226 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/0038 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1189 ,  H01L2924/00

摘要： An interconnect element 130 can include a dielectric layer 116 having a top face 116b and a bottom face 116a remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces 132, 134. A plurality of conductive protrusions 112 can extend upwardly from the plane defined by the first metal layer 102 through the dielectric layer 116. The conductive protrusions 112 can have top surfaces 126 at a first height 115 above the first metal layer 132 which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias 128 can extend from the top surfaces 126 of the protrusions 112 to connect the protrusions 112 with the second metal layer.

摘要翻译： 互连元件130可以包括具有顶面116b和远离顶面的底面116a的介电层116，限定沿着底面延伸的平面的第一金属层和沿着顶面延伸的第二金属层。 第一或第二金属层之一或两者可以包括多个导电迹线132,134。多个导电突起112可以从由第一金属层102限定的平面向上延伸穿过电介质层116.导电 突起112可以具有在第一金属层132上方的第一高度115处的顶表面126，其可以超过介电层的高度的50％。 多个导电通孔128可以从突起112的顶表面126延伸，以将突起112与第二金属层连接。

公开(公告)号：US20100044860A1

公开(公告)日：2010-02-25

申请号：US12462208

申请日：2009-07-30

申请人： Belgacem Haba ,  Chang Myung Ryu ,  Kimitaka Endo ,  Christopher Paul Wade

发明人： Belgacem Haba ,  Chang Myung Ryu ,  Kimitaka Endo ,  Christopher Paul Wade

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/89 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13017 ,  H01L2224/13021 ,  H01L2224/13609 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An interconnection element can include a substrate, e.g., a connection substrate, element of a package, circuit panel or microelectronic substrate, e.g., semiconductor chip, the substrate having a plurality of metal conductive elements such as conductive pads, contacts, bond pads, traces, or the like exposed at the surface. A plurality of solid metal posts may overlie and project away from respective ones of the conductive elements. An intermetallic layer can be disposed between the posts and the conductive elements, such layer providing electrically conductive interconnection between the posts and the conductive elements. Bases of the posts adjacent to the intermetallic layer can be aligned with the intermetallic layer.

摘要翻译： 互连元件可以包括衬底，例如连接衬底，封装的元件，电路板或微电子衬底，例如半导体芯片，衬底具有多个金属导电元件，例如导电焊盘，触点，接合焊盘，迹线 ，或类似物暴露在表面。 多个固体金属柱可以覆盖并突出远离相应的导电元件。 金属间层可以设置在柱和导电元件之间，这种层在柱和导电元件之间提供导电互连。 与金属间化合物层相邻的柱的基底可与金属间层对准。

公开(公告)号：US20100009554A1

公开(公告)日：2010-01-14

申请号：US12459864

申请日：2009-07-08

申请人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

发明人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

IPC分类号： H01R12/00 ,  H01B13/00

CPC分类号： B81B7/0006 ,  B81C1/00539 ,  C25D7/00 ,  H01L21/4846 ,  H01L21/768 ,  H01L23/498 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/244 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

摘要： A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

摘要翻译： 微电子互连元件可以包括与第一金属线交错的多个第一金属线和多个第二金属线。 第一和第二金属线中的每一个具有在相同参考平面内延伸的表面。 第一金属线具有高于参考平面并远离其的表面，并且第二金属线具有低于参考平面并远离其的表面。 电介质层可以将第一金属线的金属线与第二金属线的相邻金属线分开。

公开(公告)号：US08461460B2

公开(公告)日：2013-06-11

申请号：US12459864

申请日：2009-07-08

申请人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

发明人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

IPC分类号： H05K1/03

CPC分类号： B81B7/0006 ,  B81C1/00539 ,  C25D7/00 ,  H01L21/4846 ,  H01L21/768 ,  H01L23/498 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/244 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

摘要： A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

摘要翻译： 微电子互连元件可以包括与第一金属线交错的多个第一金属线和多个第二金属线。 第一和第二金属线中的每一个具有在相同参考平面内延伸的表面。 第一金属线具有高于参考平面并远离其的表面，并且第二金属线具有低于参考平面并远离其的表面。 电介质层可以将第一金属线的金属线与第二金属线的相邻金属线分开。

公开(公告)号：US20090071707A1

公开(公告)日：2009-03-19

申请号：US12228537

申请日：2008-08-13

申请人： Kimitaka Endo ,  Philip Damberg ,  Craig S. Mitchell ,  Sean Moran ,  Christopher Wade ,  Belgacem Haba ,  John Riley

发明人： Kimitaka Endo ,  Philip Damberg ,  Craig S. Mitchell ,  Sean Moran ,  Christopher Wade ,  Belgacem Haba ,  John Riley

IPC分类号： H05K1/11 ,  C25D5/02

CPC分类号： H05K3/4007 ,  C25D5/02 ,  H01L21/4846 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/06 ,  H05K3/20 ,  H05K3/243 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method is provided for manufacturing a multilayer substrate. An insulating layer can have a hole overlying a patterned second metal layer. In turn, the second metal layer can overlie a first metal layer. A third metal layer can be electroplated onto the patterned second metal layer within the hole, the third metal layer extending from the second metal layer onto a wall of the hole. When plating the third metal layer, the first and second metal layers can function as a conductive commoning element.

摘要翻译： 提供了制造多层基板的方法。 绝缘层可以具有覆盖图案化的第二金属层的孔。 反过来，第二金属层可以覆盖在第一金属层上。 第三金属层可以电镀在孔内的图案化的第二金属层上，第三金属层从第二金属层延伸到孔的壁上。 当电镀第三金属层时，第一和第二金属层可以用作导电共用元件。

公开(公告)号：US20050161804A1

公开(公告)日：2005-07-28

申请号：US11029423

申请日：2005-01-06

申请人： Tomoo Iijima ,  Kimitaka Endo

发明人： Tomoo Iijima ,  Kimitaka Endo

IPC分类号： H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H01L21/44 ,  H01L23/48

CPC分类号： H05K3/4617 ,  H01L2924/0002 ,  H05K3/06 ,  H05K3/108 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/0156 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/063 ,  H05K2203/1189 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/1572 ,  H01L2924/00

摘要： A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.

摘要翻译： 提供布线膜之间的连接部件，其中：作为通用部件的普通铜箔并不昂贵等，可以用作材料; 通过进行一次蚀刻来充分实现凸块的形成; 并且可以一次层叠和压制必要数量的层。 形成为大致锥形的用于连接多层布线基板的布线膜的凸起嵌入在用作层间绝缘膜的第二树脂膜中。

公开(公告)号：US08859420B2

公开(公告)日：2014-10-14

申请号：US13085126

申请日：2011-04-12

申请人： Kimitaka Endo ,  Norihito Masuda ,  Tomokazu Shimada

发明人： Kimitaka Endo ,  Norihito Masuda ,  Tomokazu Shimada

IPC分类号： H01L23/04 ,  H01L23/498 ,  H01L23/538 ,  H05K3/46 ,  H01L21/48 ,  H05K3/20 ,  H05K3/42 ,  H05K3/06

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K3/064 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4647 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/0733 ,  Y10S438/931 ,  Y10T29/49124 ,  H01L2924/00

摘要： A method of fabricating an interconnect element may include fabricating a metal layer that overlies a carrier layer and that includes a plurality of metal traces; providing a dielectric element to overlie the metal layer and the carrier layer; providing a plurality of metal posts; and removing the carrier layer to expose the first major surface of the dielectric element and the outer surfaces of the plurality of metal traces.

摘要翻译： 制造互连元件的方法可以包括制造覆盖载体层并且包括多个金属迹线的金属层; 提供介电元件以覆盖金属层和载体层; 提供多个金属柱; 以及去除载体层以暴露介质元件的第一主表面和多个金属迹线的外表面。

公开(公告)号：US08505199B2

公开(公告)日：2013-08-13

申请号：US12228890

申请日：2008-08-15

申请人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

发明人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

IPC分类号： H01R43/16 ,  H05K1/11

CPC分类号： H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

摘要： An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

摘要翻译： 提供互连元件用于与具有微电子器件或其上的布线中的至少一个的另一元件的导电互连。 互连元件包括具有主表面的电介质元件。 包括多个暴露的金属柱的电镀金属层可以向外突出超过介电元件的主表面。 一些金属柱可以通过电介质元件彼此电绝缘。 互连元件通常包括与金属柱导电连通的多个端子。 端子可以通过电介质元件连接到金属柱。 可以通过将金属镀在芯棒的暴露的共平面表面和心轴中的开口的内表面上来定义柱，然后可以去除心轴。

公开(公告)号：US20100071944A1

公开(公告)日：2010-03-25

申请号：US12519950

申请日：2007-12-17

申请人： Kimitaka Endo

发明人： Kimitaka Endo

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/50 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/243 ,  H05K3/328 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/10636 ,  H05K2203/0369 ,  H05K2203/0384 ,  Y02P70/611 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A multiple wiring layer interconnection element includes capacitors or other electrical components embedded between a first exposed wiring layer and a second exposed wiring layer of the interconnection element. Internal wiring layers and are provided between exposed surfaces of the respective capacitors, the internal wiring layers being electrically insulated from the capacitors by dielectric layers. The internal wiring layers are isolated from each other by an internal dielectric layer. Conductive vias provide conductive interconnection between the two internal wiring layers. A method of fabricating a multiple wiring layer interconnection element is also provided.

摘要翻译： 多个布线层互连元件包括嵌入在互连元件的第一暴露布线层和第二暴露布线层之间的电容器或其它电气元件。 内部布线层设置在各电容器的露出面之间，内部配线层通过电介质层与电容器电绝缘。 内部布线层通过内部电介质层彼此隔离。 导电通孔在两个内部布线层之间提供导电互连。 还提供了制造多重布线层互连元件的方法。

公开(公告)号：US20050224256A1

公开(公告)日：2005-10-13

申请号：US11085108

申请日：2005-03-22

申请人： Kenji Osawa ,  Masayuki Osawa ,  Tomokazu Shimada ,  Kimitaka Endo ,  Tomoo Iijima

发明人： Kenji Osawa ,  Masayuki Osawa ,  Tomokazu Shimada ,  Kimitaka Endo ,  Tomoo Iijima

IPC分类号： H01L21/4763 ,  H01L21/48 ,  H01L21/60 ,  H01L23/50 ,  H05K1/11 ,  H05K1/16 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4614 ,  H01L2924/0002 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1152 ,  H01L2924/00

摘要： To increase the dimensional accuracy of an interlayer member used for producing a multilayer wiring board which is inserted between two wiring layers to establish interlayer insulation and interlayer electrical connection between the wiring layers, to thereby increase a layout density. A mask film is formed on a main surface of a sheet-like carrier layer. A metal column for interlayer connection is formed on the main surface of the carrier layer by plating a copper using the mask film as a mask. The mask film is removed. An interlayer insulating layer and a protective sheet are laminated on the main surface of the carrier layer in such a manner that the metal column for interlayer connection penetrates them. The interlayer insulating layer and the protective sheet are polished until the upper surface of the metal column for interlayer connection is exposed. Then, the carrier layer is removed. Furthermore, the protective sheet is removed.

摘要翻译： 为了提高用于制造插入在两个布线层之间的多层布线板的层间构件的尺寸精度，以​​建立布线层之间的层间绝缘和层间电连接，从而增加布局密度。 在片状载体层的主表面上形成掩模膜。 通过使用掩模膜作为掩模将铜电镀形成在载体层的主表面上的用于层间连接的金属柱。 去除掩模膜。 层间绝缘层和保护片层叠在载体层的主表面上，使得用于层间连接的金属柱穿透它们。 抛光层间绝缘层和保护片，直到露出用于层间连接的金属柱的上表面。 然后，移除载体层。 此外，去除保护片。