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公开(公告)号：US09994743B2
公开(公告)日：2018-06-12
申请号：US14916490
申请日：2014-09-09
IPC分类号： H01L21/12 , C09J133/20 , C09J163/00 , H01L23/00 , H01L33/62 , H01B1/22 , C09J133/06 , C09J9/02 , C08F220/18
CPC分类号： C09J133/20 , C08F220/18 , C08L33/066 , C08L33/068 , C08L2205/22 , C09J9/02 , C09J133/066 , C09J163/00 , H01B1/22 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L33/62 , H01L2224/16227 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29393 , H01L2224/294 , H01L2224/32225 , H01L2224/81424 , H01L2224/81487 , H01L2224/81903 , H01L2224/83424 , H01L2224/83487 , H01L2224/83851 , H01L2224/83862 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H01L2933/0066 , H01L2924/00 , H01L2924/00014 , H01L2924/0665 , H01L2924/0635 , H01L2924/01006 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , C08F2220/1825 , C08F2220/1808 , C08F220/44 , C08F220/06 , C08F220/20 , C08K5/151
摘要： This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.
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2.发明授权Light-reflective anisotropic conductive adhesive agent, and light emitting device 有权光反射各向异性导电粘合剂和发光装置公开(公告)号：US09260634B2
公开(公告)日：2016-02-16
申请号：US14543550
申请日：2014-11-17
IPC分类号： H01L33/62 , C09J9/02 , H01L23/00 , H01L33/60 , C08K3/22 , C09J11/04 , C08K3/08 , H01L33/40 , C08K9/06 , C08K3/24
CPC分类号： C09J9/02 , C08K3/08 , C08K3/22 , C08K3/24 , C08K7/08 , C08K9/06 , C08K2003/0831 , C08K2003/2241 , C08K2003/2296 , C09J11/04 , H01L24/06 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/0401 , H01L2224/13339 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/29339 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/83385 , H01L2224/83855 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01081 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10157 , H01L2924/12041 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.
摘要翻译： 光反射各向异性导电粘合剂用于发光元件与布线板的各向异性导电连接。 粘合剂包括热固性树脂，导电颗粒和光反射针状绝缘颗粒。 导电颗粒包括涂覆有金属颗粒或金属材料的芯颗粒和形成在芯颗粒表面上的光反射层。 光反射层包括从氧化钛颗粒，氧化锌颗粒或氧化铝颗粒中选择的任何一种的无机颗粒，直到整个导电颗粒呈现从白色到灰色范围内的颜色。
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公开(公告)号：US09418958B2
公开(公告)日：2016-08-16
申请号：US14104320
申请日：2013-12-12
CPC分类号： H01L24/29 , C09J9/02 , C09J163/00 , H01B1/22 , H01L24/83 , H01L33/62 , H01L2924/07811 , H01L2924/12041 , H05K3/323 , H01L2924/00
摘要： An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM35, EM55, EM95, and EM150, respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM55-95 and ΔEM95-150, respectively, the following expressions (1) to (5) are satisfied 700 Mpa≦EM35≦3000 MPa (1) EM150
摘要翻译： 各向异性导电粘合剂包括含有环氧化合物和固化剂的环氧粘合剂和分散在环氧粘合剂中的导电颗粒。 在各向异性导电粘合剂的固化物的35℃，55℃，95℃，150℃下的弹性模量分别由EM35，EM55，EM95，EM150表示，变化率 在55℃和95℃之间的弹性模量和95℃和150℃之间的弹性模量分别由ΔEM55-95和ΔEM95-150表示，满足以下表达式（1）至（5） 700Mpa≤EM35≤3000MPa（1）EM150
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公开(公告)号：US10435601B2
公开(公告)日：2019-10-08
申请号：US15301836
申请日：2015-05-22
IPC分类号： C09J163/00 , C09J11/04 , C09J11/06 , C09J133/00 , C09J133/04 , H01R11/01 , H05K3/32 , H05K3/34 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/38
摘要： An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.
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5.发明授权Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive 有权各向异性导电粘合剂，发光装置和各向异性导电粘合剂的制造方法公开(公告)号：US09487678B2
公开(公告)日：2016-11-08
申请号：US14830070
申请日：2015-08-19
IPC分类号： C09J11/00 , H01L33/60 , H01L33/48 , C09J9/02 , H01L33/62 , H01L23/00 , C23C14/02 , C23C14/20 , C23C14/22 , C08K7/16 , C08K9/00
CPC分类号： C09J11/00 , C08K7/16 , C08K9/00 , C09J9/02 , C23C14/025 , C23C14/205 , C23C14/223 , H01L24/29 , H01L24/32 , H01L24/83 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/2939 , H01L2224/29413 , H01L2224/29439 , H01L2224/29455 , H01L2224/73104 , H01L2224/73204 , H01L2224/81192 , H01L2224/81903 , H01L2224/83192 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2924/00014 , H01L2924/07802 , H01L2924/12041 , H01L2924/181 , H01L2924/0665 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/05599
摘要： Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.
摘要翻译： 提供了发光强度高的发光装置。 通过各向异性导电粘合剂将具有至少360nm且至多500nm的波长范围内的发射峰的峰值的蓝色LED芯片粘附到电极基板。 在各向异性导电粘合剂中含有的各导电粒子的表面上由银合金制成的光反射层，对蓝色光具有高反射率。 光反射层通过溅射含有Ag，Bi和Nd的溅射靶而形成，其中Bi的含量比设定为至少0.1重量％（wt％）至多3.0wt％，并且Nd的含量比 相对于100重量％的Ag，Bi和Nd的总重量为至少0.1重量％且至多2.0重量％。 导电颗粒具有高的抗迁移性能。
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公开(公告)号：US09676066B2
公开(公告)日：2017-06-13
申请号：US14423887
申请日：2013-09-17
IPC分类号： H01L23/532 , B23K35/36 , C09J9/02 , H01B1/22 , H01L33/62 , C09J11/00 , B23K1/00 , B23K35/02 , B23K35/24 , H05K3/34 , H05K13/04 , C08K9/02 , H01L23/373 , H01L23/00
CPC分类号： B23K35/36 , B23K1/0016 , B23K35/025 , B23K35/24 , C08K9/02 , C08K2201/001 , C09J9/02 , C09J11/00 , H01B1/22 , H01L23/3737 , H01L23/5328 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L33/62 , H01L2224/0401 , H01L2224/06102 , H01L2224/16238 , H01L2224/1703 , H01L2224/17051 , H01L2224/2919 , H01L2224/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/81193 , H01L2224/81805 , H01L2224/81903 , H01L2224/8385 , H01L2224/83851 , H01L2224/9211 , H01L2924/01322 , H01L2924/07811 , H01L2924/12041 , H01L2924/15787 , H05K3/3484 , H05K13/0465 , H01L2924/00014 , H01L2224/16225 , H01L2924/00 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2924/00015
摘要： An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.
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公开(公告)号：US20150209914A1
公开(公告)日：2015-07-30
申请号：US14423887
申请日：2013-09-17
CPC分类号： B23K35/36 , B23K1/0016 , B23K35/025 , B23K35/24 , C08K9/02 , C08K2201/001 , C09J9/02 , C09J11/00 , H01B1/22 , H01L23/3737 , H01L23/5328 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L33/62 , H01L2224/0401 , H01L2224/06102 , H01L2224/16238 , H01L2224/1703 , H01L2224/17051 , H01L2224/2919 , H01L2224/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/81193 , H01L2224/81805 , H01L2224/81903 , H01L2224/8385 , H01L2224/83851 , H01L2224/9211 , H01L2924/01322 , H01L2924/07811 , H01L2924/12041 , H01L2924/15787 , H05K3/3484 , H05K13/0465 , H01L2924/00014 , H01L2224/16225 , H01L2924/00 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2924/00015
摘要： An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.
摘要翻译： 提供高散热性的各向异性导电粘合剂。 导电颗粒和焊料颗粒分散在粘合剂中。 在使用该各向异性导电粘合剂制造的热压缩LED装置中，LED装置的端子通过颗粒电连接到基板的端子，并且LED装置的端子和基板的端子焊接。
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公开(公告)号：US20150197672A1
公开(公告)日：2015-07-16
申请号：US14430440
申请日：2013-09-17
IPC分类号： C09J163/00 , H01L33/48 , H01L33/62 , C09K5/14 , C08K3/10
CPC分类号： C09J163/00 , C08G59/24 , C08K3/08 , C08K3/10 , C08K9/02 , C08K9/12 , C09J9/02 , C09J11/00 , C09K5/14 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L33/486 , H01L33/62 , H01L33/641 , H01L2224/0401 , H01L2224/06102 , H01L2224/13144 , H01L2224/1403 , H01L2224/16225 , H01L2224/16227 , H01L2224/29144 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29369 , H01L2224/2939 , H01L2224/29418 , H01L2224/29444 , H01L2224/29455 , H01L2224/29487 , H01L2224/2949 , H01L2224/3201 , H01L2224/32225 , H01L2224/32501 , H01L2224/48091 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/81444 , H01L2224/81805 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/01322 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15788 , H01L2924/3841 , H05K3/323 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05341 , H01L2924/0665 , H01L2924/00012 , H01L2224/48 , H01L2924/00015 , H01L2924/0105 , H01L2924/01046 , H01L2924/00
摘要： An anisotropic conductive adhesive includes: a conductive particle including a resin particle and a conductive metal layer that is formed on a surface of the resin particle; a thermally conductive particle that is a metal particle or an insulation coated particle, wherein the metal particle has an average particle size that is smaller than an average particle size of the conductive particle, and the insulation coated particle has an average particle size that is smaller than the average particle size of the conductive particle and includes a metal particle and an insulating layer that is formed on a surface of the metal particle; and an adhesive component in which the conductive particle and the thermally conductive particle are dispersed.
摘要翻译： 各向异性导电粘合剂包括：形成在树脂颗粒的表面上的包含树脂颗粒和导电金属层的导电颗粒; 作为金属粒子或绝缘被覆粒子的导热性粒子，其中，所述金属粒子的平均粒径小于所述导电性粒子的平均粒径，所述绝缘被覆粒子的平均粒径越小 比所述导电性粒子的平均粒径大，并且包含形成在所述金属粒子的表面上的金属粒子和绝缘层; 以及分散有导电性粒子和导热性粒子的粘合剂成分。
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9.发明申请公开(公告)号：US20150069448A1
公开(公告)日：2015-03-12
申请号：US14543550
申请日：2014-11-17
CPC分类号： C09J9/02 , C08K3/08 , C08K3/22 , C08K3/24 , C08K7/08 , C08K9/06 , C08K2003/0831 , C08K2003/2241 , C08K2003/2296 , C09J11/04 , H01L24/06 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/0401 , H01L2224/13339 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/29339 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/83385 , H01L2224/83855 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01081 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10157 , H01L2924/12041 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.
摘要翻译： 光反射各向异性导电粘合剂用于发光元件与布线板的各向异性导电连接。 粘合剂包括热固性树脂，导电颗粒和光反射针状绝缘颗粒。 导电颗粒包括涂覆有金属颗粒或金属材料的芯颗粒和形成在芯颗粒表面上的光反射层。 光反射层包括从氧化钛颗粒，氧化锌颗粒或氧化铝颗粒中选择的任何一种的无机颗粒，直到整个导电颗粒呈现从白色到灰色范围内的颜色。
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公开(公告)号：US09670385B2
公开(公告)日：2017-06-06
申请号：US15116081
申请日：2015-02-13
IPC分类号： H01L33/00 , C09J9/02 , H01L33/62 , C09J11/04 , H01L33/60 , C09J163/00 , C08K9/02 , C08K3/22 , H01L33/64
CPC分类号： C09J9/02 , C08K3/22 , C08K7/16 , C08K9/02 , C08K2003/0806 , C08K2003/2241 , C08K2201/001 , C08K2201/003 , C08K2201/005 , C09J11/04 , C09J163/00 , C09J201/00 , H01B1/22 , H01L24/29 , H01L24/81 , H01L24/83 , H01L33/60 , H01L33/62 , H01L33/641 , H01L33/644 , H01L33/647 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/2939 , H01L2224/29439 , H01L2224/29499 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/81193 , H01L2224/81194 , H01L2224/81203 , H01L2933/0066 , H01L2933/0075 , H05K3/323 , H05K2201/0221 , H05K2201/0272 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2224/16225 , H01L2924/00 , H01L2924/014 , H01L2924/05341 , H01L2924/05432
摘要： Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.
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