公开(公告)号：US08242612B2

公开(公告)日：2012-08-14

申请号：US12813692

申请日：2010-06-11

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC分类号： H01L23/48 ,  H05K1/00

CPC分类号： H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0227 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09345 ,  H05K2201/09609

摘要： A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.

摘要翻译： 布线基板包括：具有绝缘基体的芯基板; 构造成从所述绝缘基材的第一表面刺穿到所述绝缘基材的第二表面的线状导体; 包括形成在芯基板的第一表面上的第一接地布线的接地布线组和形成在芯基板的第二表面上的带状第二接地布线，并且通过一部分电连接到第一接地布线 线性导体; 以及电源布线组，其包括形成在第一表面上的第一电力供给布线和形成在第二表面上的第二电力供应布线，并且通过多个部分中的一部分电连接到第一电力布线 线性导体。

公开(公告)号：US07536780B2

公开(公告)日：2009-05-26

申请号：US11311568

申请日：2005-12-19

申请人： Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Kiyoshi Oi ,  Akio Rokugawa

发明人： Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Kiyoshi Oi ,  Akio Rokugawa

IPC分类号： H05K3/36

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/025 ,  H05K3/4602 ,  H05K2201/0179 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/09518 ,  H05K2201/09718 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

摘要： The present invention discloses a method of manufacturing a wiring substrate to which a semiconductor chip mounted. The method includes the steps of forming a base, forming a peeling layer on the base, forming a capacitor having a plurality of layers on the peeling layer, and forming a wiring part in the capacitor for connecting the capacitor to the semiconductor chip.

摘要翻译： 本发明公开了一种制造安装有半导体芯片的布线基板的方法。 该方法包括以下步骤：形成基底，在基底上形成剥离层，在剥离层上形成具有多个层的电容器，以及在用于将电容器连接到半导体芯片的电容器中形成布线部分。

公开(公告)号：US07531011B2

公开(公告)日：2009-05-12

申请号：US11272688

申请日：2005-11-15

申请人： Tomoo Yamasaki

发明人： Tomoo Yamasaki

IPC分类号： H01G9/00

CPC分类号： H05K1/162 ,  H01G4/10 ,  H01G4/38 ,  H01L23/49816 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K2201/0191 ,  H05K2201/09509 ,  H05K2203/0315 ,  H05K2203/1476 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435

摘要： In a capacitor device of the present invention includes a substrate, a plurality of lower electrodes formed on the substrate, a plurality of dielectric films formed on a plurality of lower electrodes respectively in a state that the dielectric films are separated mutually, and upper electrodes formed on a plurality of dielectric films respectively, a plurality of capacitors each composed of the lower electrode, the dielectric film, and the upper electrode are arranged on the substrate respectively, and each of the dielectric films in a plurality of capacitors has a different film thickness.

摘要翻译： 在本发明的电容器装置中，包括基板，形成在基板上的多个下电极，分别在电介质膜相互分离的状态下分别形成在多个下电极上的多个电介质膜，形成上电极 在多个电介质膜上分别配置有分别由下部电极，电介质膜和上部电极构成的多个电容器，多个电容器中的各个电介质膜具有不同的膜厚 。

公开(公告)号：US07038904B2

公开(公告)日：2006-05-02

申请号：US10968725

申请日：2004-10-18

申请人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

发明人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

IPC分类号： H01G9/04 ,  H01G4/005 ,  H01G4/06

CPC分类号： H01L23/552 ,  H01G4/228 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/09609 ,  H05K2201/10674 ,  H05K2203/0733

摘要： A capacitor formed of parallel wiring lines and a capacitor dielectric film positioned between adjacent wiring lines and in direct contact with each of said wiring lines. A method of producing such a capacitor is also disclosed.

摘要翻译： 由平行布线形成的电容器和位于相邻布线之间并与每个所述布线直接接触的电容器电介质膜。 还公开了一种制造这种电容器的方法。

公开(公告)号：US20050181573A1

公开(公告)日：2005-08-18

申请号：US11103449

申请日：2005-04-12

申请人： Tomoo Yamasaki ,  Kiyoshi Ooi ,  Akio Rokugawa

发明人： Tomoo Yamasaki ,  Kiyoshi Ooi ,  Akio Rokugawa

IPC分类号： H01G4/33 ,  H01G4/228 ,  H01L21/84 ,  H01L21/86 ,  H01L23/64 ,  H01L23/66 ,  H01L27/13 ,  H01L21/20

CPC分类号： H01G4/228 ,  H01G4/33 ,  H01L21/84 ,  H01L21/86 ,  H01L23/642 ,  H01L23/66 ,  H01L27/13 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19011 ,  H01L2924/3011 ,  H01L2224/0401

摘要： The invention is directed to a thin-film capacitor device that is adapted to be mounted on a printed wiring board together with an LSI device. After forming a plurality of grooves in a core substrate, a first conductive film is formed, and a first conductor is filled into each groove. After forming a metal film on the first conductive film, a dielectric film is generated by selective anodic oxidation of the metal film. A second conductive film is formed on the dielectric film, and an electrode connected to the second conductive film is formed. After removing the back surface of the core substrate until the grooves are exposed therein, an electrode for connection to the first conductor in each groove is formed. A capacitor is formed by the first conductive film and second conductive film sandwiching the dielectric film therebetween.

公开(公告)号：US20050088800A1

公开(公告)日：2005-04-28

申请号：US10968725

申请日：2004-10-18

申请人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

发明人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

IPC分类号： H01G2/06 ,  H01G4/005 ,  H01G4/01 ,  H01G4/228 ,  H01G4/33 ,  H01G13/00 ,  H01L21/822 ,  H01L23/12 ,  H01L23/498 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01L27/04 ,  H05K1/11 ,  H05K1/16

CPC分类号： H01L23/552 ,  H01G4/228 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/09609 ,  H05K2201/10674 ,  H05K2203/0733

摘要： A capacitor formed of parallel wiring lines and a capacitor dielectric film positioned between adjacent wiring lines and in direct contact with each of said wiring lines. A method of producing such a capacitor is also disclosed.

摘要翻译： 由平行布线形成的电容器和位于相邻布线之间并与每个所述布线直接接触的电容器电介质膜。 还公开了一种制造这种电容器的方法。

公开(公告)号：US20050052822A1

公开(公告)日：2005-03-10

申请号：US10918746

申请日：2004-08-16

申请人： Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Kiyoshi Ooi ,  Akio Rokugawa

发明人： Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Kiyoshi Ooi ,  Akio Rokugawa

IPC分类号： H01G2/06 ,  H01G4/005 ,  H01G4/18 ,  H01G4/232 ,  H01G4/252 ,  H01G4/30 ,  H01L21/60 ,  H01L23/12 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01L23/66 ,  H05K1/16 ,  H05K3/46 ,  H01G4/228

CPC分类号： H01G4/232 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/66 ,  H01L24/10 ,  H01L24/13 ,  H01L24/83 ,  H01L2224/13 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09309 ,  H05K2201/09672 ,  H01L2924/00014 ,  H01L2224/29075 ,  H01L2924/00

摘要： A capacitor structure includes a first electrode provided on an insulating basic member, a dielectric member provided on the electrode, a second electrode provided on the dielectric member, and a plurality of electrode terminals aligned in a grid on the electrode. Respective electrode terminals are aligned such that opposite polarities (+,−) are alternately allocated to neighboring electrode terminals, and respective divided partial electrodes of the first and second electrodes are also aligned such that opposite polarities (+,−) are alternately allocated to neighboring electrode terminals. According to this structure, the inductance of the capacitor structure is reduced and thus the decoupling effect can be effectively achieved. This contributes to a stable operation in the high-frequency (GHz band) range.

摘要翻译： 电容器结构包括设置在绝缘基底构件上的第一电极，设置在电极上的电介质构件，设置在电介质构件上的第二电极和在电极上以栅格排列的多个电极端子。 排列相应的电极端子使得相邻的极性（+， - ）被交替地分配给相邻的电极端子，并且第一和第二电极的相应的分开的部分电极也被对准，使得相反的极性（+， - ）被交替地分配给相邻的 电极端子。 根据该结构，电容器结构的电感减小，从而可以有效地实现解耦效果。 这有助于在高频（GHz频带）范围内的稳定运行。

公开(公告)号：US09006586B2

公开(公告)日：2015-04-14

申请号：US13528987

申请日：2012-06-21

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46

CPC分类号： H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/10378 ,  Y10T29/49124 ,  H01L2924/00

摘要： One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump.

摘要翻译： 一个实施例提供一种布线基板，包括：具有绝缘基底构件的芯基板，所述绝缘基底构件具有第一表面和第二表面;多个线状导体，从所述第一表面穿过所述绝缘基底构件到所述第二表面; 连接到所述绝缘基体的第一表面和所述第二表面中的至少一个的无机材料层; 以及穿透无机材料层的穿透线，其中穿透线的一端电连接到线性导体的相应部分，而不会发生凹凸。

公开(公告)号：US20090188806A1

公开(公告)日：2009-07-30

申请号：US12324916

申请日：2008-11-28

申请人： Tomoo Yamasaki ,  Katsuya Fukase

发明人： Tomoo Yamasaki ,  Katsuya Fukase

IPC分类号： C25D5/02

CPC分类号： H05K3/108 ,  H01L2224/16225 ,  H01L2924/15174 ,  H05K1/112 ,  H05K3/062 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2203/025 ,  H05K2203/054 ,  H05K2203/0597

摘要： A manufacturing method of a wiring board includes a sticking layer forming step; a resist film forming step of forming a resist film on an upper surface of the sticking layer, the resist film having an opening exposing the upper surface of the sticking layer; a metal layer forming step of forming a metal layer, so as to cover an upper surface of the resist film and cover a side surface of the resist film and the upper surface of the sticking layer forming the opening for forming the wiring; a plating film forming step of filling with a plating film the opening for forming the wiring; a metal layer and plating film removing step; a resist film removing step; and a sticking layer removing step of removing the sticking layer of an unnecessary part not covered with the metal layer, after the resist film removing step.

摘要翻译： 布线基板的制造方法包括：粘贴层形成工序; 抗蚀剂膜形成步骤，在所述粘贴层的上表面上形成抗蚀剂膜，所述抗蚀膜具有露出所述粘着层的上表面的开口; 形成金属层的金属层形成步骤，以覆盖抗蚀剂膜的上表面并覆盖抗蚀剂膜的侧表面和形成用于形成布线的开口的粘合层的上表面; 电镀薄膜形成步骤，用于向镀膜填充用于形成布线的开口; 金属层和电镀膜去除步骤; 抗蚀剂膜去除步骤; 以及在抗蚀剂膜去除步骤之后去除不被金属层覆盖的不必要部分的粘着层的粘合层去除步骤。

公开(公告)号：US07223652B2

公开(公告)日：2007-05-29

申请号：US11048556

申请日：2005-02-01

申请人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

发明人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC分类号： H01L21/338 ,  H01L51/40 ,  H01L21/8244 ,  H01L21/8242

CPC分类号： H01G4/224 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/642 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/0162 ,  H05K2201/09763 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2224/05166

摘要： A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.

摘要翻译： 电容器包括由夹在一对电极之间的电介质膜和由有机聚硅烷膜形成的支撑体形成的电容器部分。 支撑体设置成在其上支撑电容器部分。