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公开(公告)号：CN102468249A
公开(公告)日：2012-05-23
申请号：CN201110173436.7
申请日：2011-06-23
申请人： 三星电机株式会社
发明人： 张范植
IPC分类号： H01L23/34 , H01L23/492 , H01L25/07 , H01L21/60 , H01L21/98
CPC分类号： H01L23/142 , H01L23/24 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/072 , H01L2224/291 , H01L2224/32245 , H01L2224/33181 , H01L2224/37 , H01L2224/37011 , H01L2224/371 , H01L2224/40095 , H01L2224/40225 , H01L2224/40227 , H01L2224/40247 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2224/92157 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/16195 , H01L2924/181 , H01L2924/19107 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 在此公开了一种功率封装模块及制造该功率封装模块的方法，包括：基底；多个高功率芯片和多个低功率芯片，该多个高功率芯片和多个低功率芯片电连接到所述基底；以及多个金属导板，该多个金属导板将所述多个高功率芯片和所述多个低功率芯片电连接到所述基底。
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公开(公告)号：CN105264659B
公开(公告)日：2018-05-18
申请号：CN201380076866.4
申请日：2013-07-05
申请人： 瑞萨电子株式会社
IPC分类号： H01L23/50
CPC分类号： H01L23/49513 , H01L21/565 , H01L23/13 , H01L23/16 , H01L23/24 , H01L23/3121 , H01L23/3142 , H01L23/4952 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L23/49582 , H01L23/49805 , H01L23/49844 , H01L23/562 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/77 , H01L2224/05624 , H01L2224/05644 , H01L2224/0603 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/37147 , H01L2224/40091 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/48624 , H01L2224/48644 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/743 , H01L2224/83192 , H01L2224/83439 , H01L2224/8385 , H01L2224/83862 , H01L2224/84205 , H01L2224/84439 , H01L2224/8501 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/92157 , H01L2224/92247 , H01L2924/00014 , H01L2924/1301 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/351 , H01L2924/00 , H01L2924/0665 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： 一种实施方式的半导体装置是用树脂密封了在芯片搭载部上搭载了的半导体芯片的半导体装置，其中，在沿着第1方向的上述半导体芯片的边缘部与上述芯片搭载部的边缘部之间的芯片搭载面侧，固定了第1部件。另外，上述第1部件被上述树脂密封。另外，在俯视时，上述第1方向上的上述芯片搭载部的上述第1部分的长度比上述第1方向上的上述半导体芯片的长度更长。
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公开(公告)号：CN102332445B
公开(公告)日：2015-06-03
申请号：CN201110178141.9
申请日：2011-06-29
申请人： 半导体元件工业有限责任公司
发明人： 漆畑博可
IPC分类号： H01L23/495 , H01L23/00 , H01L21/60
CPC分类号： H01L23/49562 , H01L21/565 , H01L23/3107 , H01L23/49524 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04034 , H01L2224/04042 , H01L2224/05552 , H01L2224/05554 , H01L2224/0603 , H01L2224/06181 , H01L2224/291 , H01L2224/29139 , H01L2224/2919 , H01L2224/32245 , H01L2224/37124 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45014 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48465 , H01L2224/48639 , H01L2224/48664 , H01L2224/73219 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83439 , H01L2224/83464 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/84214 , H01L2224/84464 , H01L2224/85439 , H01L2224/85464 , H01L2224/92157 , H01L2224/92246 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/207
摘要： 本发明公开了一种半导体装置及其制造方法。在对金属带进行超声波接合时，为了防止岛部的浮动，利用接合装置的紧固装置，需要按压岛部的周边区域或者设置在岛部周围的支承引脚。然而，随着装置的小型化，在不能确保足够的岛部周边区域的情况下，或者在未设有支承引脚的情况下，存在不能按压岛部侧的问题。在岛部的与引线相对的一边设有以和引线端部相同的高度向引线侧突出的突出部。通过利用紧固装置同时按压突出部和引线端部，在未设有支承引脚或者岛部周围没有按压区域的情况下，也能够防止岛部的浮动。
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公开(公告)号：CN103503132B
公开(公告)日：2016-06-01
申请号：CN201180070578.9
申请日：2011-06-09
申请人： 三菱电机株式会社
CPC分类号： H01L23/4952 , H01L23/3107 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/115 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/05553 , H01L2224/05567 , H01L2224/06181 , H01L2224/29201 , H01L2224/29347 , H01L2224/29355 , H01L2224/30181 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40179 , H01L2224/40245 , H01L2224/40247 , H01L2224/40249 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48699 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83139 , H01L2224/8314 , H01L2224/83143 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/84143 , H01L2224/84205 , H01L2224/84801 , H01L2224/85205 , H01L2224/92157 , H01L2224/92246 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05552 , H01L2224/83205 , H01L2224/37099
摘要： 本发明的目的在于提供一种半导体装置。该半导体装置中，利用第1焊料（51）将第1引线（11）与MOS-FET（21）的下表面电极（23）进行接合，利用第2焊料（52）将MOS-FET的上表面电极（22）与内部引线（31）进行接合，利用第3焊料（53）将内部引线与第2引线的突起部（61）进行接合，并且第1引线、第2引线、MOS-FET以及内部引线通过密封树脂（41）来一体形成，在第1焊料的内部与第2焊料的内部设置支承构件（54）、（55），并通过自对准使内部引线与MOS-FET的位置稳定。
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公开(公告)号：CN102867804B
公开(公告)日：2016-03-16
申请号：CN201210236310.4
申请日：2012-07-06
申请人： 英飞凌科技股份有限公司
发明人： 拉尔夫·奥特伦巴
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04042 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/06181 , H01L2224/2745 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/32245 , H01L2224/33181 , H01L2224/35831 , H01L2224/37011 , H01L2224/37147 , H01L2224/3716 , H01L2224/4007 , H01L2224/40095 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48666 , H01L2224/48669 , H01L2224/48671 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/48799 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/83986 , H01L2224/84801 , H01L2224/92147 , H01L2224/92157 , H01L2224/92165 , H01L2224/92166 , H01L2224/92246 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2924/01023 , H01L2924/01028 , H01L2224/27 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2224/48227 , H01L2924/00 , H01L2924/01005
摘要： 本发明公开了一种包括具有突出体的接触片的半导体器件及其制造方法。该半导体器件包括：具有晶片焊垫和第一引线的引线框、具有第一电极的半导体芯片、以及具有第一接触区和第二接触区的接触片。半导体芯片置于晶片焊垫之上。第一接触区置于第一引线之上，以及第二接触区置于半导体芯片的第一电极之上。多个突出体从各第一接触区和第二接触区延伸，并且每个突出体具有至少5μm的高度。
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公开(公告)号：CN103531558A
公开(公告)日：2014-01-22
申请号：CN201310273425.5
申请日：2013-07-02
申请人： 英飞凌科技股份有限公司
IPC分类号： H01L23/488 , H01L23/367 , H01L21/48 , H01L21/60
CPC分类号： H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49562 , H01L23/49568 , H01L23/49575 , H01L24/32 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L2224/05552 , H01L2224/05554 , H01L2224/0603 , H01L2224/29078 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/37147 , H01L2224/40095 , H01L2224/40247 , H01L2224/40499 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73221 , H01L2224/73263 , H01L2224/83192 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/92157 , H01L2224/92246 , H01L2924/00014 , H01L2924/01322 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/181 , H01L2924/00 , H01L2924/06 , H01L2924/014 , H01L2224/05599 , H01L2924/00012
摘要： 本发明涉及引线框架封装及其形成方法。根据本发明的实施例，半导体器件其包括：被部署在引线框架上方的半导体芯片和被部署在半导体芯片上方的夹片。半导体芯片的主表面包括接触焊盘和控制接触焊盘。接触焊盘具有沿着控制接触焊盘的第一侧的第一部分和沿着控制接触焊盘的相对的第二侧的第二部分。夹片将第一部分和第二部分与引线框架的第一引线电耦合。线接合将控制接触焊盘与引线框架的第二引线电耦合。
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公开(公告)号：CN102867804A
公开(公告)日：2013-01-09
申请号：CN201210236310.4
申请日：2012-07-06
申请人： 英飞凌科技股份有限公司
发明人： 拉尔夫·奥特伦巴
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04042 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/06181 , H01L2224/2745 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/32245 , H01L2224/33181 , H01L2224/35831 , H01L2224/37011 , H01L2224/37147 , H01L2224/3716 , H01L2224/4007 , H01L2224/40095 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48666 , H01L2224/48669 , H01L2224/48671 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/48799 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/83986 , H01L2224/84801 , H01L2224/92147 , H01L2224/92157 , H01L2224/92165 , H01L2224/92166 , H01L2224/92246 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2924/01023 , H01L2924/01028 , H01L2224/27 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2224/48227 , H01L2924/00 , H01L2924/01005
摘要： 本发明公开了一种包括具有突出体的接触片的半导体器件及其制造方法。该半导体器件包括：具有晶片焊垫和第一引线的引线框、具有第一电极的半导体芯片、以及具有第一接触区和第二接触区的接触片。半导体芯片置于晶片焊垫之上。第一接触区置于第一引线之上，以及第二接触区置于半导体芯片的第一电极之上。多个突出体从各第一接触区和第二接触区延伸，并且每个突出体具有至少5μm的高度。
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公开(公告)号：CN107210289A
公开(公告)日：2017-09-26
申请号：CN201580075351.1
申请日：2015-12-25
申请人： 三菱电机株式会社
CPC分类号： H01L23/49568 , H01L21/565 , H01L23/295 , H01L23/3121 , H01L23/36 , H01L23/4334 , H01L23/48 , H01L23/49513 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L24/29 , H01L24/32 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29339 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/3716 , H01L2224/37639 , H01L2224/37655 , H01L2224/40137 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/85439 , H01L2224/85455 , H01L2224/92157 , H01L2224/92246 , H01L2224/92247 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/01029 , H01L2924/0105 , H01L2924/01032 , H01L2924/014 , H01L2924/013 , H01L2924/01046 , H01L2924/01079 , H01L2924/2076
摘要： 在半导体器件(100)中，散热板(2)被密封于密封树脂(8)内。在密封树脂(8)内以与散热板(2)的一个主表面相接的方式安装有绝缘片(3)。引线框(4)以从密封树脂(8)内到达密封树脂(8)外的方式延伸，并以相接到绝缘片(3)的与散热板(2)相反的一侧的主表面上的方式被载置。半导体元件(1)在密封树脂(8)内被接合到引线框(4)的与绝缘片(3)相反的一侧的主表面的至少一部分。绝缘片(3)的与引线框(4)相接的一侧的表面在绝缘片(3)的包括俯视时的最外端的至少一部分的端部区域中，以从引线框(4)远离的方式具有倾斜地变低。密封树脂(8)在端部区域中进入到引线框(4)与绝缘片(3)之间。引线框(4)至少在密封树脂(8)内是平坦的。
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公开(公告)号：CN105264659A
公开(公告)日：2016-01-20
申请号：CN201380076866.4
申请日：2013-07-05
申请人： 瑞萨电子株式会社
IPC分类号： H01L23/50
CPC分类号： H01L23/49513 , H01L21/565 , H01L23/13 , H01L23/16 , H01L23/24 , H01L23/3121 , H01L23/3142 , H01L23/4952 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L23/49582 , H01L23/49805 , H01L23/49844 , H01L23/562 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/77 , H01L2224/05624 , H01L2224/05644 , H01L2224/0603 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/37147 , H01L2224/40091 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/48624 , H01L2224/48644 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/743 , H01L2224/83192 , H01L2224/83439 , H01L2224/8385 , H01L2224/83862 , H01L2224/84205 , H01L2224/84439 , H01L2224/8501 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/92157 , H01L2224/92247 , H01L2924/00014 , H01L2924/1301 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/351 , H01L2924/00 , H01L2924/0665 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： 一种实施方式的半导体装置是用树脂密封了在芯片搭载部上搭载了的半导体芯片的半导体装置，其中，在沿着第1方向的上述半导体芯片的边缘部与上述芯片搭载部的边缘部之间的芯片搭载面侧，固定了第1部件。另外，上述第1部件被上述树脂密封。另外，在俯视时，上述第1方向上的上述芯片搭载部的上述第1部分的长度比上述第1方向上的上述半导体芯片的长度更长。
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公开(公告)号：CN103503132A
公开(公告)日：2014-01-08
申请号：CN201180070578.9
申请日：2011-06-09
申请人： 三菱电机株式会社
CPC分类号： H01L23/4952 , H01L23/3107 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/115 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/05553 , H01L2224/05567 , H01L2224/06181 , H01L2224/29201 , H01L2224/29347 , H01L2224/29355 , H01L2224/30181 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40179 , H01L2224/40245 , H01L2224/40247 , H01L2224/40249 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48699 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83139 , H01L2224/8314 , H01L2224/83143 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/84143 , H01L2224/84205 , H01L2224/84801 , H01L2224/85205 , H01L2224/92157 , H01L2224/92246 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05552 , H01L2224/83205 , H01L2224/37099
摘要： 本发明的目的在于提供一种半导体装置。该半导体装置中，利用第1焊料（51）将第1引线（11）与MOS-FET（21）的下表面电极（23）进行接合，利用第2焊料（52）将MOS-FET的上表面电极（22）与内部引线（31）进行接合，利用第3焊料（53）将内部引线与第2引线的突起部（61）进行接合，并且第1引线、第2引线、MOS-FET以及内部引线通过密封树脂（41）来一体形成，在第1焊料的内部与第2焊料的内部设置支承构件（54）、（55），并通过自对准使内部引线与MOS-FET的位置稳定。
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