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公开(公告)号:CN104821304A
公开(公告)日:2015-08-05
申请号:CN201410305217.3
申请日:2014-06-30
申请人: 株式会社东芝
发明人: 福井刚
IPC分类号: H01L23/495 , H01L23/31 , H01L21/60 , H01L21/56
CPC分类号: H01L23/49513 , H01L21/56 , H01L23/3107 , H01L23/4334 , H01L23/49541 , H01L23/49568 , H01L23/49586 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L2224/29147 , H01L2224/2929 , H01L2224/29339 , H01L2224/32058 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37565 , H01L2224/37639 , H01L2224/37644 , H01L2224/37655 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/73263 , H01L2224/83192 , H01L2224/83801 , H01L2224/83815 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/8485 , H01L2924/01013 , H01L2924/01028 , H01L2924/01047 , H01L2924/01079 , H01L2924/053 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/18301 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/07811
摘要: 本发明提供一种具有高散热性和优秀的低导通电阻性的半导体装置。本实施方式的半导体装置具备半导体芯片、金属制的引线框、树脂制的密封部以及金属制的连接器。半导体芯片具有表面电极。引线框具有在表面搭载着半导体芯片的底座部、与底座部分离而设置的接线柱部。密封部以覆盖半导体芯片的方式形成。连接器具有与半导体芯片的表面接合的芯片接合部、与引线框的接线柱部的表面接合的接线柱接合部以及将芯片接合部与接线柱接合部之间连结的连结部。芯片接合部形成得比接线柱接合部以及连结部厚,且芯片接合部的至少一部分从密封部的表面露出。
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公开(公告)号:CN103178030A
公开(公告)日:2013-06-26
申请号:CN201210568793.8
申请日:2012-12-24
申请人: 英飞凌科技股份有限公司
CPC分类号: H01L23/48 , H01L23/24 , H01L23/3107 , H01L23/3135 , H01L23/3735 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49811 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37639 , H01L2224/37647 , H01L2224/37655 , H01L2224/3766 , H01L2224/4005 , H01L2224/40095 , H01L2224/40137 , H01L2224/40227 , H01L2224/40247 , H01L2224/4103 , H01L2224/41051 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48464 , H01L2224/4847 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/8482 , H01L2224/8485 , H01L2224/85447 , H01L2224/92247 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/141 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/01028 , H01L2924/01015 , H01L2924/20759
摘要: 本发明涉及一种包括安装在DCB衬底上的分立器件的模块及用于制造该模块的方法,该模块包括DCB衬底以及安装在DCB衬底上的分立器件,其中,分立器件包括:引线框架;安装在引线框架上的半导体芯片;以及覆盖半导体芯片的封装材料。
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公开(公告)号:CN106170856A
公开(公告)日:2016-11-30
申请号:CN201580014541.2
申请日:2015-03-26
申请人: 贺利氏德国有限及两合公司
IPC分类号: H01L23/495 , H01L21/60
CPC分类号: H01L23/49513 , H01L21/4821 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L2224/27318 , H01L2224/2732 , H01L2224/27418 , H01L2224/27505 , H01L2224/27848 , H01L2224/29294 , H01L2224/29295 , H01L2224/29339 , H01L2224/2939 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/371 , H01L2224/37639 , H01L2224/4005 , H01L2224/40095 , H01L2224/40245 , H01L2224/40499 , H01L2224/73263 , H01L2224/83192 , H01L2224/83439 , H01L2224/8384 , H01L2224/8385 , H01L2224/8484 , H01L2224/8485 , H01L2224/9221 , H01L2924/181 , H01L2924/00014 , H01L2924/01047 , H01L2224/83 , H01L2224/84 , H01L2924/00012
摘要: 本发明涉及用于至少一个半导体元件的支架(如引线架)和夹子,该支架和夹子具有至少一个用于联接至该半导体元件的功能表面(10)和多个端子(11)。本发明的特征在于,该支架或该夹子的材料包含金属和用固化(干燥的)烧结糊料(尤其包含银和/或银化合物的烧结糊料)制成的层(12),并且该层被安排在功能表面(10)上,其中,该支架或该夹子与用烧结糊料制成的层(12)形成可以连接至半导体元件的中间产品。通过利用固化烧结糊料的烧结在一个工作步骤中连接至该夹子,该支架和夹子被用于生产具有引线架的封装物(引线架封装件)。
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公开(公告)号:CN102403278A
公开(公告)日:2012-04-04
申请号:CN201110187462.5
申请日:2011-07-06
申请人: 半导体元件工业有限责任公司
IPC分类号: H01L23/00 , H01L23/48 , H01L23/367 , H01L21/48
CPC分类号: H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84
摘要: 一种连接器组件以及用于制造连接器组件的方法。根据实施例,连接器组件包括具有第一和第二表面以及第一和第二端部的电连接器。一层电绝缘材料由在第一端部的第一表面的一部分形成或者被形成于该部分之上。可选地,一层电绝缘材料能够由第二表面形成或者被形成第二表面之上。
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公开(公告)号:CN103247545A
公开(公告)日:2013-08-14
申请号:CN201310049181.2
申请日:2013-02-07
申请人: 英飞凌科技股份有限公司
IPC分类号: H01L21/60 , H01L23/488 , H01L23/495
CPC分类号: H01L23/49562 , H01L23/49524 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/95 , H01L2224/04026 , H01L2224/05553 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/0603 , H01L2224/2732 , H01L2224/2745 , H01L2224/27462 , H01L2224/29109 , H01L2224/29111 , H01L2224/32058 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/33181 , H01L2224/3512 , H01L2224/352 , H01L2224/37099 , H01L2224/37111 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37164 , H01L2224/37169 , H01L2224/37572 , H01L2224/376 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/37655 , H01L2224/37664 , H01L2224/37669 , H01L2224/40095 , H01L2224/40101 , H01L2224/40175 , H01L2224/40245 , H01L2224/40247 , H01L2224/40491 , H01L2224/73253 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/83469 , H01L2224/83801 , H01L2224/83825 , H01L2224/84439 , H01L2224/84444 , H01L2224/84447 , H01L2224/84455 , H01L2224/84464 , H01L2224/84469 , H01L2224/84801 , H01L2224/84825 , H01L2224/9221 , H01L2224/92246 , H01L2224/95 , H01L2924/00014 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/0105 , H01L2924/01047 , H01L2924/01079 , H01L2224/83 , H01L2224/84 , H01L2924/00012 , H01L2224/37599
摘要: 本发明涉及半导体装置及其方法。该方法包括提供具有第一主表面和第二主表面的半导体芯片。以半导体芯片的第一主表面面向承载件的形式,将半导体芯片放置在承载件上。在第一主表面和承载件之间设置焊料材料的第一层。以第一接触区域面向半导体芯片的第二主表面的方式,将包括第一接触区域的接触夹放置在半导体芯片上。在第一接触区域和第二主表面之间设置焊料材料的第二层。其后,将热量施加于焊料材料的第一层和第二层,从而在承载件、半导体芯片和接触片之间形成扩散焊料结合。
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公开(公告)号:CN101138083A
公开(公告)日:2008-03-05
申请号:CN200680008057.X
申请日:2006-04-21
申请人: 国际整流器公司
发明人: M·施坦丁
CPC分类号: H01L24/40 , H01L23/04 , H01L23/06 , H01L23/13 , H01L23/14 , H01L23/492 , H01L23/4924 , H01L23/49548 , H01L23/49558 , H01L23/49582 , H01L23/4985 , H01L24/24 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/82 , H01L24/83 , H01L24/84 , H01L25/165 , H01L2224/24227 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/37639 , H01L2224/37644 , H01L2224/40225 , H01L2224/73153 , H01L2224/73253 , H01L2224/76155 , H01L2224/82102 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/05432 , H01L2924/0635 , H01L2924/0665 , H01L2924/07025 , H01L2924/0715 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49155 , Y10T29/49174 , H01L2924/00 , H01L2924/00014
摘要: 一种半导体封装,该封装包括导电容器、电连接并且机械连接于所述容器的内表面的功率半导体器件、以及在所述容器内部与所述功率半导体器件共同封装的IC半导体器件。
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公开(公告)号:CN101073151A
公开(公告)日:2007-11-14
申请号:CN200480044528.3
申请日:2004-12-20
申请人: 半导体元件工业有限责任公司
发明人: 弗朗西斯·J·卡尔尼 , 迈克尔·J·瑟登
IPC分类号: H01L23/495 , H01L23/31
CPC分类号: H01L23/49562 , H01L23/3107 , H01L23/49524 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05624 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37164 , H01L2224/37639 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48624 , H01L2224/48724 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: 在一实施例中,一具有增强散热性的封装的半导体装置包括一引线框架和一半导体芯片,所述半导体芯片包括一主载流电极或发热电极。所述半导体芯片的所述主载流电极面对所述封装的顶面或远离下一级装配。所述封装的半导体装置进一步包括一不平的、阶跃形的或脉冲形的连接结构,所述连接结构将所述载流电极连接到所述引线框架上。高热导率的成型材料的使用和薄的封装外形进一步增强了散热性。
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公开(公告)号:CN102403278B
公开(公告)日:2016-03-16
申请号:CN201110187462.5
申请日:2011-07-06
申请人: 半导体元件工业有限责任公司
IPC分类号: H01L23/00 , H01L23/48 , H01L23/367 , H01L21/48
CPC分类号: H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84
摘要: 一种连接器组件以及用于制造连接器组件的方法。根据实施例,连接器组件包括具有第一和第二表面以及第一和第二端部的电连接器。一层电绝缘材料由在第一端部的第一表面的一部分形成或者被形成于该部分之上。可选地,一层电绝缘材料能够由第二表面形成或者被形成第二表面之上。
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公开(公告)号:CN103081104A
公开(公告)日:2013-05-01
申请号:CN201180041186.X
申请日:2011-09-05
申请人: 日立汽车系统株式会社
CPC分类号: H01L23/34 , H01L21/4825 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/492 , H01L23/49524 , H01L23/49575 , H01L24/29 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L25/072 , H01L25/18 , H01L2224/29111 , H01L2224/32245 , H01L2224/32503 , H01L2224/33 , H01L2224/33181 , H01L2224/3521 , H01L2224/37013 , H01L2224/37124 , H01L2224/37147 , H01L2224/37639 , H01L2224/37644 , H01L2224/37655 , H01L2224/40137 , H01L2224/48091 , H01L2224/4847 , H01L2224/48472 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/1306 , H01L2924/1305 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/01047 , H01L2924/01029
摘要: 本发明提供一种功率半导体模块,具备:在一个主面上形成有多个控制电极的功率半导体元件;与功率半导体元件的一个主面介由第一焊锡材料接合的第一导体板;和与功率半导体元件的另一个主面介由第二焊锡材料接合的第二导体板。在第一导体板形成有从该第一导体板的基部突出且在上表面具有第一突出面的第一突出部。在第一导体板的第一突出面形成有具有与功率半导体元件的一个主面相对的第二突出面的第二突出部。第一焊锡材料设置在功率半导体元件和第一导体板之间,且避开多个控制电极。在从功率半导体元件的一个主面的垂直方向投影时,第二突出部以第二突出面的规定边的投影部与形成于第一导体板的基部和第一突出部间的台阶部的投影部重叠的方式形成。功率半导体元件的多个控制电极沿着第二突出面的规定边形成。
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公开(公告)号:CN101073151B
公开(公告)日:2010-05-12
申请号:CN200480044528.3
申请日:2004-12-20
申请人: 半导体元件工业有限责任公司
发明人: 弗朗西斯·J·卡尔尼 , 迈克尔·J·瑟登
IPC分类号: H01L23/495 , H01L23/31
CPC分类号: H01L23/49562 , H01L23/3107 , H01L23/49524 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05624 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37164 , H01L2224/37639 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/4103 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48624 , H01L2224/48724 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: 具有增强散热性的半导体封装结构。在一实施例中,一具有增强散热性的封装的半导体装置包括一引线框架和一半导体芯片,所述半导体芯片包括一主载流电极或发热电极。所述半导体芯片的所述主载流电极面对所述封装的顶面或远离下一级装配。所述封装的半导体装置进一步包括一不平的、阶跃形的或波动形的连接结构,所述连接结构将所述载流电极连接到所述引线框架上。高热导率的成型材料的使用和薄的封装外形进一步增强了散热性。
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