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    System and Method for Forming Uniform Rigid Interconnect Structures
    2.
    发明申请
    System and Method for Forming Uniform Rigid Interconnect Structures 有权
    形成均匀刚性互连结构的系统和方法

    公开(公告)号：US20140004660A1

    公开(公告)日：2014-01-02

    申请号：US13539188

    申请日：2012-06-29

    申请人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsiun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    发明人： Ming-Chung Sung ,  Yung Ching Chen ,  Chien-Hsiun Lee ,  Chen-Hua Yu ,  Mirng-Ji Lii

    IPC分类号： H01L21/50

    CPC分类号： H01L21/4825 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/742 ,  H01L24/78 ,  H01L2224/1134 ,  H01L2224/45144 ,  H01L2224/742 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.

    摘要翻译： 本文公开了一种用于通过形成一个或多个互连件，可选地用引线键合器安装半导体封装以及将互连件安装到目标封装上的安装焊盘来安装半导体封装件的系统和方法。 安装互连可以包括将互连件超声波焊接到安装焊盘，并且互连可以经由互连端部上的安装节点来安装，其中安装节点可以由电火焰熄灭工艺形成。 互连可以被修剪到一个或多个基本均匀的高度，可选地使用激光或接触式修剪系统，并且在修剪期间可以支撑互连的尾部。 顶部封装可以结合在互连件的修剪端上。 在安装期间，可以使用支撑板来支撑封装，并且在互连安装期间可以使用掩模。

    Rigid Interconnect Structures in Package-on-Package Assemblies
    7.
    发明申请
    Rigid Interconnect Structures in Package-on-Package Assemblies 有权
    封装在封装组件中的刚性互连结构

    公开(公告)号：US20130277841A1

    公开(公告)日：2013-10-24

    申请号：US13452589

    申请日：2012-04-20

    申请人： Mirng-Ji Lii ,  Chen-Hua Yu ,  Chien-Hsiun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

    发明人： Mirng-Ji Lii ,  Chen-Hua Yu ,  Chien-Hsiun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

    IPC分类号： H01L25/07 ,  H01L21/60

    CPC分类号： H01L23/49838 ,  H01L23/49811 ,  H01L23/5283 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/24 ,  H01L25/105 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： System and method are disclosed for creating a rigid interconnect between two substrate mounted packages to create a package-on-package assembly. A solid interconnect may have a predetermined length configured to provide a predetermined package separation, may be cylindrical, conical or stepped, may be formed by extrusion, casting, drawing or milling and may have an anti-oxidation coating. The interconnect may be attached to mounting pads on the top and bottom packages via an electrically conductive adhesive, including, but not limited to solder and solder paste. A solder preservative or other anti-oxidation coating may be applied to the mounting pad. A package-on-package assembly with solid interconnects may have a top package configured to accept at least one electronic device, with the solid interconnects mounted between the top package and a bottom package to rigidly hold the package about parallel to each other.

    摘要翻译： 公开了用于在两个基板安装的封装之间创建刚性互连以产生封装封装组件的系统和方法。 固体互连可以具有预定长度，其被配置为提供预定的包装分离，可以是圆柱形，圆锥形或阶梯形，可以通过挤出，浇铸，拉拔或研磨形成，并且可以具有抗氧化涂层。 互连可以经由导电粘合剂附接到顶部和底部封装上的安装焊盘，包括但不限于焊料和焊膏。 可以将焊料防腐剂或其它抗氧化涂层施加到安装垫。 具有固体互连的封装封装组件可以具有被配置为接纳至少一个电子器件的顶部封装，其中固体互连件安装在顶部封装和底部封装之间，以使封装彼此平行地刚性地保持。

    Engine
    10.
    发明授权
    Engine 有权
    发动机

    公开(公告)号：US07337759B1

    公开(公告)日：2008-03-04

    申请号：US11543111

    申请日：2006-10-05

    申请人： Yung-ching Chen ,  Chih-chieh Chen

    发明人： Yung-ching Chen ,  Chih-chieh Chen

    IPC分类号： F02B75/32

    CPC分类号： F01B7/20 ,  F01B9/06 ,  F02B75/30 ,  F02B2075/025 ,  F02B2275/22

    摘要： The invention involves an engine that the cylinder block contains a coupled piston formed by a main piston, an external piston. The external piston is sleeved outside of the main piston and uses the rods on the two sides to connect to the heart-shape groove on the two sides of the crankshaft inside the crankcase at the bottom of the cylinder block. It moves with the main piston in an upward stroke and in a downward stroke. It forms a direct fuel injection device in the cylinder without carburetor. It does not need to add lubricants in the fuels. Besides, the engine has increased compression ratio.

    摘要翻译： 本发明涉及一种发动机，该气缸体包含由主活塞，外部活塞形成的联接活塞。 外部活塞套在主活塞的外侧，并使用两侧的杆连接到气缸体底部曲轴箱内曲轴两侧的心形槽。 它随着主活塞向上冲程和向下冲程而移动。 它在没有化油器的气缸中形成直接燃料喷射装置。 它不需要在燃料中添加润滑剂。 此外，发动机具有增加的压缩比。