公开(公告)号：US09693461B2

公开(公告)日：2017-06-27

申请号：US14684256

申请日：2015-04-10

Applicant: BROADCOM CORPORATION

Inventor： Sam Ziqun Zhao ,  Edward Law ,  Sampath Komarapalayam Karikalan ,  Neal Andrew Kistler ,  Rezaur Rahman Khan ,  Pieter Vorenkamp

IPC: H01F5/00 ,  H05K1/18 ,  H01F17/00 ,  H01F41/04 ,  H01F27/28 ,  H01F17/04 ,  H01F38/14

CPC classification number: H05K1/181 ,  H01F17/0013 ,  H01F17/045 ,  H01F38/14 ,  H01F41/046 ,  H01F2017/0053 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L2224/16225

Abstract: A 3-dimensional (3-D) magnetic core device includes a substrate, a first magnetic shell formed on the substrate, and a first group of conductive traces embedded in a first insulator layer formed on the first magnetic shell. A magnetic core plane is formed on the first insulator layer, and a second group of conductive traces are embedded in a second insulator layer formed on the magnetic core plane. A second magnetic shell is formed on the second insulator layer, and the first and second group of conductive traces are conductively coupled by using conductive vias.

公开(公告)号：US09459921B2

公开(公告)日：2016-10-04

申请号：US14615866

申请日：2015-02-06

Applicant: Broadcom Corporation

Inventor： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Sam Ziqun Zhao

IPC: H04W4/00 ,  G06F9/50 ,  H04B7/10 ,  H04B5/00 ,  H04W84/18 ,  H04B7/26

CPC classification number: G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

Abstract translation: 这里公开了用于创建无线组件（WEC）的系统的系统，设备和方法。 这样的系统包括服务器和多个无线使能分量（WEC）。 每个WEC包括功能资源（例如，处理资源和/或存储器资源），并且被配置用于与服务器和一个或多个其他WEC的无线通信。 第一WEC被配置为向服务器无线地上传第一WEC的功能资源的可用性。 第一WEC还被配置为从服务器无线地下载链接资源，用于与多个WEC中的一个或多个相关联。 多个WEC可以位于单个芯片上，在单个设备的多个芯片上，或者位于多个设备的多个芯片上。

公开(公告)号：US20160190057A1

公开(公告)日：2016-06-30

申请号：US15061747

申请日：2016-03-04

Applicant: BROADCOM CORPORATION

Inventor： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/32 ,  H01L25/16

CPC classification number: H01L23/49833 ,  H01L23/3142 ,  H01L23/32 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/186 ,  H05K3/4046 ,  H05K3/4688 ,  H05K2201/0218 ,  H05K2201/09609 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/041 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2924/00012

Abstract: Various examples are provided for interconnection structures for molded IC packages. In one example, among others, an IC package includes a substrate and an interposer. A plurality of conductive elements provide physical and electrical contact between a surface of the substrate and a surface of the interposer. A standoff element disposed between the surfaces of the substrate and interposer provides a minimum spacing between the surfaces of the substrate and interposer. In some implementations, a standoff element is disposed between an IC die disposed on the surface of the substrate and the surface of the interposer. In another example, a method includes coupling conductive elements to a surface of an interposer, attaching a standoff element, coupling the conductive elements to a surface of a substrate, and forming an embedded layer between the interposer and substrate. The standoff element defines a minimum gap between the interposer and the substrate.

Abstract translation: 为模制IC封装的互连结构提供了各种实例。 在一个示例中，其中，IC封装包括基板和插入件。 多个导电元件在基板的表面和插入件的表面之间提供物理和电接触。 设置在基板和插入件的表面之间的间隔元件在基板和插入件的表面之间提供最小的间隔。 在一些实施方案中，支架元件设置在设置在基板的表面上的IC管芯和插入件的表面之间。 在另一示例中，一种方法包括将导电元件耦合到插入件的表面，附接支座元件，将导电元件连接到基板的表面，以及在插入器和基板之间形成嵌入层。 支座元件限定了插入件和基板之间的最小间隙。

公开(公告)号：US09230875B2

公开(公告)日：2016-01-05

申请号：US14260872

申请日：2014-04-24

Applicant: Broadcom Corporation

Inventor： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC: H04B1/40 ,  H01L23/34 ,  H01L23/552 ,  H01L23/36 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/31 ,  H04B5/00 ,  H04B7/06

CPC classification number: H01L23/34 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/50 ,  H01L23/552 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H04B1/40 ,  H04B5/0037 ,  H04B5/0068 ,  H04B7/0617 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments of provide an integrated circuit (IC) device. The IC device can include a substrate having first and second opposing surfaces, an IC die electrically coupled to the first surface of the substrate, a plurality of contact members coupled to the first surface of the substrate, and an interposer. The interposer can include a plurality of contact elements located on a first surface thereof, each conductive element being coupled to a respective one of the plurality of contact members, and an antenna formed using a conductive layer of the interposer, the antenna being electrically coupled to the IC die through at least one of the plurality of contact elements and at least one of the plurality of contact members.

Abstract translation: 提供集成电路（IC）装置的实施例。 IC器件可以包括具有第一和第二相对表面的衬底，电连接到衬底的第一表面的IC管芯，耦合到衬底的第一表面的多个接触构件和插入器。 插入器可以包括位于其第一表面上的多个接触元件，每个导电元件耦合到所述多个接触构件中的相应一个，以及使用所述插入器的导电层形成的天线，所述天线电耦合到 所述IC通过所述多个接触元件中的至少一个和所述多个接触构件中的至少一个接合。

公开(公告)号：US09129980B2

公开(公告)日：2015-09-08

申请号：US13929240

申请日：2013-06-27

Applicant: Broadcom Corporation

Inventor： Rezaur Rahman Khan ,  Sam Ziqun Zhao

IPC: H01L21/44 ,  H01L21/56 ,  H01L23/552 ,  H01L25/10 ,  H01L23/538 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L21/565 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of manufacturing an integrated circuit (IC) package is provided. The method includes mounting a fast plurality of contact members on a surface of a package member, and coupling a second plurality of contact members located on a first surface of an interposer substrate to corresponding ones of the first plurality of contact members. The interposer substrate is configured such that a circuit member mounted to a second surface of the interposer substrate is electrically coupled to the first plurality of contact members.

Abstract translation: 提供一种制造集成电路（IC）封装的方法。 该方法包括将快速多个接触构件安装在封装构件的表面上，以及将位于中介层基板的第一表面上的第二多个接触构件与第一多个接触构件中的相应接触构件连接。 插入器基板被配置为使得安装到插入器基板的第二表面的电路构件电耦合到第一多个接触构件。

公开(公告)号：US08829656B2

公开(公告)日：2014-09-09

申请号：US14079571

申请日：2013-11-13

Applicant: Broadcom Corporation

Inventor： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC: H01L29/40 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L23/495 ,  H01L25/10 ,  H01L23/498 ,  H01L23/538 ,  H01L23/14 ,  H01L25/00

CPC classification number: H01L23/481 ,  H01L21/4857 ,  H01L23/14 ,  H01L23/145 ,  H01L23/147 ,  H01L23/49506 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5226 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/97 ,  H01L25/00 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/14183 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/30183 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present application discloses various implementations of a semiconductor package including an organic substrate and one or more interposers having through-semiconductor vias (TSVs). Such a semiconductor package may include a contiguous organic substrate having a lower substrate segment including first and second pluralities of lower interconnect pads, the second plurality of lower interconnect pads being disposed in an opening of the lower substrate segment. The contiguous organic substrate may also include an upper substrate segment having an upper width and including first and second pluralities of upper interconnect pads. In addition, the semiconductor package may include at least one interposer having TSVs for electrically connecting the first and second pluralities of lower interconnect pads to the first and second pluralities of upper interconnect pads. The interposer has an interposer width less than the upper width of the upper substrate segment.

Abstract translation: 本申请公开了包括有机衬底和具有贯通半导体通孔（TSV）的一个或多个中介层的半导体封装的各种实施方式。 这种半导体封装可以包括具有包括第一和第二多个下部互连焊盘的下部衬底区段的连续有机衬底，第二多个下部互连焊盘设置在下部衬底段的开口中。 连续的有机衬底还可以包括具有上部宽度并包括第一和第二多个上部互连焊盘的上部衬底区段。 此外，半导体封装可以包括具有TSV的至少一个插入器，用于将第一和第二多个下部互连焊盘电连接到第一和第二多个上部互连焊盘。 插入器具有小于上基板段的上宽度的插入器宽度。

公开(公告)号：US20140210083A1

公开(公告)日：2014-07-31

申请号：US14229215

申请日：2014-03-28

Applicant: Broadcom Corporation

Inventor： Sam Ziqun Zhao ,  Reza-ur Rahman Khan ,  Edward Law ,  Marc Papageorge

IPC: H01L23/00 ,  H01L23/12

CPC classification number: H01L24/48 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In one embodiment, a device package is provided. The device package can include a substrate having first and second opposing surfaces, an opening being formed through the first and second surfaces of the substrate; a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate.

Abstract translation: 在一个实施例中，提供了一种设备包。 器件封装可以包括具有第一和第二相对表面的衬底，通过衬底的第一和第二表面形成的开口; 加强件，其耦合到所述基板的所述第一表面，所述加强件具有延伸到所述基板的开口中的延伸部分; 以及耦合到所述加强件的所述延伸部分的集成电路（IC）管芯，所述IC管芯电耦合到所述衬底。

公开(公告)号：US20140103505A1

公开(公告)日：2014-04-17

申请号：US13653330

申请日：2012-10-16

Applicant: BROADCOM CORPORATION

Inventor： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC: H01L23/495 ,  H01L23/34 ,  H01L21/78

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49551 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Methods, systems, and apparatuses for integrated circuit packages are provided. An integrated circuit package, such as a quad flat no-lead (QFN) package, includes a plurality of peripherally positioned leads, a heat spreader, an integrated circuit die, and an encapsulating material. The peripherally positioned leads are attached to a first surface of the heat spreader, and the die is attached to the first surface of the heat spreader within a ring formed by the leads. The encapsulating material encapsulates the die on the heat spreader, encapsulates bond wires, and fills a space between the leads. A second surface of the heat spreader is exposed from the package. End portions of the leads have surfaces that are flush with a surface of the package opposite the second surface of the heat spreader, and that are used as lands for the package.

Abstract translation: 提供了集成电路封装的方法，系统和装置。 诸如四方扁平无引线（QFN）封装的集成电路封装包括多个外围定位的引线，散热器，集成电路管芯和封装材料。 外围定位的引线附接到散热器的第一表面，并且模具附接到由引线形成的环内的散热器的第一表面。 封装材料将模具封装在散热器上，封装接合线，并填充引线之间的空间。 散热器的第二表面从包装中暴露出来。 引线的端部具有与封套的与散热器的第二表面相对的表面齐平的表面，并且用作封装的焊盘。

公开(公告)号：US20140061886A1

公开(公告)日：2014-03-06

申请号：US14078799

申请日：2013-11-13

Applicant: Broadcom Corporation

Inventor： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC: H01L23/495

CPC classification number: H01L23/481 ,  H01L21/4857 ,  H01L23/14 ,  H01L23/145 ,  H01L23/147 ,  H01L23/49506 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5226 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/97 ,  H01L25/00 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/14183 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/30183 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present application discloses various implementations of a semiconductor package including an organic substrate and one or more interposers having through-semiconductor vias (TSVs). Such a semiconductor package may include a contiguous organic substrate having a lower substrate segment including first and second pluralities of lower interconnect pads, the second plurality of lower interconnect pads being disposed in an opening of the lower substrate segment. The contiguous organic substrate may also include an upper substrate segment having an upper width and including first and second pluralities of upper interconnect pads. In addition, the semiconductor package may include at least one interposer having TSVs for electrically connecting the first and second pluralities of lower interconnect pads to the first and second pluralities of upper interconnect pads. The interposer has an interposer width less than the upper width of the upper substrate segment.

Abstract translation: 本申请公开了包括有机衬底和具有贯通半导体通孔（TSV）的一个或多个中介层的半导体封装的各种实施方式。 这种半导体封装可以包括具有包括第一和第二多个下部互连焊盘的下部衬底区段的连续有机衬底，第二多个下部互连焊盘设置在下部衬底段的开口中。 连续的有机衬底还可以包括具有上部宽度并包括第一和第二多个上部互连焊盘的上部衬底区段。 此外，半导体封装可以包括具有TSV的至少一个插入器，用于将第一和第二多个下部互连焊盘电连接到第一和第二多个上部互连焊盘。 插入器具有小于上基板段的上宽度的插入器宽度。

公开(公告)号：US20140027903A1

公开(公告)日：2014-01-30

申请号：US13935164

申请日：2013-07-03

Applicant: Broadcom Corporation

Inventor： Michael Boers ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L23/5222 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/81815 ,  H01L2225/06531 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01P1/182 ,  H01P3/023 ,  H01P3/12 ,  H01P3/121 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract translation: 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。