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公开(公告)号：US10985587B2
公开(公告)日：2021-04-20
申请号：US16057588
申请日：2018-08-07
Applicant: Intel Corporation
Inventor： Naoki Matsumura , Simon N. Peffers , Steven Lloyd , Michael T. Crocker , Aaron Gorius
IPC: H02J7/00
Abstract: In some examples, a control unit is configured to adjust charge termination voltage of a rechargeable energy storage device. The control unit is adapted to charge the rechargeable energy storage device to a charge termination voltage where the rechargeable energy storage device has capacity to support peak load but comes close to a system shutdown voltage after supporting peak load. The control unit is also adapted to increase the charge termination voltage if a voltage of the rechargeable energy storage device is near a system shutdown voltage after supporting peak load.
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公开(公告)号：US10910746B2
公开(公告)日：2021-02-02
申请号：US16208543
申请日：2018-12-03
Applicant: Intel Corporation
Inventor： Russell Aoki , Aaron Gorius , Michael T. Crocker , Matthew J. Adiletta
Abstract: Sleds for operation in racks of data centers are disclosed herein. A sled includes a circuit board substrate, one or more physical resources, and one or more memory devices. The circuit board substrate has a top side and a bottom side arranged opposite the top side. The one or more physical resources are coupled to the top side of the circuit board substrate. The one or more memory devices are coupled to the bottom side of the circuit board substrate. Additionally, the sled includes a connector to electrically couple the one or more physical resources to the one or more memory devices.
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公开(公告)号：US20190141845A1
公开(公告)日：2019-05-09
申请号：US16220631
申请日：2018-12-14
Applicant: Intel Corporation
Inventor： Mani Prakash , Thomas T. Holden , Aaron Gorius , Michael T. Crocker , Matthew J. Adiletta , Russell Aoki
Abstract: A configurable processor module includes a central processing unit (CPU) package mounted to a CPU substrate, which may be mounted to a circuit board substrate. The CPU substrate may include physical resources usable by the CPU package, which may not be included or duplicated on the circuit board substrate. As such, features of the CPU package that are unavailable on the circuit board substrate may be available on the CPU substrate. Additionally, the CPU substrate and physical resources may be selected and designed so as to provide varying levels of functionality across different compute devices that use the same type of CPU package.
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公开(公告)号：US10085358B2
公开(公告)日：2018-09-25
申请号：US15396646
申请日：2016-12-31
Applicant: Intel Corporation
Inventor： Matthew J. Adiletta , Aaron Gorius , Myles Wilde , Michael T. Crocker
CPC classification number: H04Q11/0005 , B25J15/0014 , B65G1/0492 , G02B6/3882 , G02B6/3893 , G02B6/3897 , G02B6/4292 , G02B6/4452 , G05D23/1921 , G05D23/2039 , G06F1/183 , G06F3/061 , G06F3/0611 , G06F3/0613 , G06F3/0616 , G06F3/0619 , G06F3/0625 , G06F3/0631 , G06F3/0638 , G06F3/064 , G06F3/0647 , G06F3/0653 , G06F3/0655 , G06F3/0658 , G06F3/0659 , G06F3/0664 , G06F3/0665 , G06F3/067 , G06F3/0673 , G06F3/0679 , G06F3/0683 , G06F3/0688 , G06F3/0689 , G06F8/65 , G06F9/30036 , G06F9/3887 , G06F9/4401 , G06F9/5016 , G06F9/5044 , G06F9/505 , G06F9/5072 , G06F9/5077 , G06F9/544 , G06F11/141 , G06F11/3414 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F12/109 , G06F12/1408 , G06F13/161 , G06F13/1668 , G06F13/1694 , G06F13/4022 , G06F13/4068 , G06F13/409 , G06F13/42 , G06F13/4282 , G06F15/8061 , G06F16/9014 , G06F2209/5019 , G06F2209/5022 , G06F2212/1008 , G06F2212/1024 , G06F2212/1041 , G06F2212/1044 , G06F2212/152 , G06F2212/202 , G06F2212/401 , G06F2212/402 , G06F2212/7207 , G06Q10/06 , G06Q10/06314 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/008 , G08C17/02 , G08C2200/00 , G11C5/02 , G11C5/06 , G11C7/1072 , G11C11/56 , G11C14/0009 , H03M7/30 , H03M7/3084 , H03M7/3086 , H03M7/40 , H03M7/4031 , H03M7/4056 , H03M7/4081 , H03M7/6005 , H03M7/6023 , H04B10/25 , H04B10/2504 , H04L9/0643 , H04L9/14 , H04L9/3247 , H04L9/3263 , H04L12/2809 , H04L29/12009 , H04L41/024 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/145 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/08 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/38 , H04L47/765 , H04L47/782 , H04L47/805 , H04L47/82 , H04L47/823 , H04L49/00 , H04L49/15 , H04L49/25 , H04L49/357 , H04L49/45 , H04L49/555 , H04L67/02 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/16 , H04L67/306 , H04L67/34 , H04L69/04 , H04L69/329 , H04Q1/04 , H04Q11/00 , H04Q11/0003 , H04Q11/0062 , H04Q11/0071 , H04Q2011/0037 , H04Q2011/0041 , H04Q2011/0052 , H04Q2011/0073 , H04Q2011/0079 , H04Q2011/0086 , H04Q2213/13523 , H04Q2213/13527 , H04W4/023 , H04W4/80 , H05K1/0203 , H05K1/181 , H05K5/0204 , H05K7/1418 , H05K7/1421 , H05K7/1422 , H05K7/1442 , H05K7/1447 , H05K7/1461 , H05K7/1485 , H05K7/1487 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/1498 , H05K7/2039 , H05K7/20709 , H05K7/20727 , H05K7/20736 , H05K7/20745 , H05K7/20836 , H05K13/0486 , H05K2201/066 , H05K2201/10121 , H05K2201/10159 , H05K2201/10189 , Y02D10/14 , Y02D10/151 , Y02P90/30 , Y04S10/54 , Y10S901/01
Abstract: A sled for operation in a corresponding rack of a data center includes a chassis-less circuit board substrate having one or more physical resources coupled to a top side of the chassis-less circuit board and one or more memory devices coupled to a bottom side of the chassis-less circuit board. The sled does not include a housing or chassis and is opened to the local environment. In the illustrative embodiments, the sled may be embodied as a compute sled, an accelerator sled, or a storage sled.
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公开(公告)号：US20180027313A1
公开(公告)日：2018-01-25
申请号：US15396035
申请日：2016-12-30
Applicant: Intel Corporation
Inventor： Matthew J. Adiletta , Aaron Gorius , Myles Wilde , Michael T. Crocker
CPC classification number: H04Q11/0005 , B25J15/0014 , B65G1/0492 , G02B6/3882 , G02B6/3893 , G02B6/3897 , G02B6/4292 , G02B6/4452 , G05D23/1921 , G05D23/2039 , G06F1/183 , G06F3/061 , G06F3/0611 , G06F3/0616 , G06F3/0619 , G06F3/0625 , G06F3/0631 , G06F3/0638 , G06F3/064 , G06F3/0647 , G06F3/0653 , G06F3/0658 , G06F3/0659 , G06F3/0664 , G06F3/0665 , G06F3/067 , G06F3/0673 , G06F3/0679 , G06F3/0683 , G06F3/0688 , G06F3/0689 , G06F8/65 , G06F9/4401 , G06F9/5016 , G06F9/5044 , G06F9/505 , G06F9/5072 , G06F9/5077 , G06F11/141 , G06F11/3414 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F12/109 , G06F12/1408 , G06F13/161 , G06F13/1668 , G06F13/1694 , G06F13/4022 , G06F13/4068 , G06F13/409 , G06F13/42 , G06F13/4282 , G06F15/8061 , G06F17/30949 , G06F2209/5019 , G06F2209/5022 , G06F2212/1008 , G06F2212/1024 , G06F2212/1041 , G06F2212/1044 , G06F2212/152 , G06F2212/202 , G06F2212/401 , G06F2212/402 , G06F2212/7207 , G06Q10/06 , G06Q10/06314 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/008 , G08C17/02 , G08C2200/00 , G11C5/02 , G11C5/06 , G11C7/1072 , G11C11/56 , G11C14/0009 , H03M7/30 , H03M7/3084 , H03M7/3086 , H03M7/40 , H03M7/4031 , H03M7/4056 , H03M7/4081 , H03M7/6005 , H03M7/6023 , H04B10/25 , H04B10/2504 , H04L9/0643 , H04L9/14 , H04L9/3247 , H04L9/3263 , H04L12/2809 , H04L29/12009 , H04L41/024 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/145 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/08 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/765 , H04L47/782 , H04L47/805 , H04L47/82 , H04L47/823 , H04L49/15 , H04L49/25 , H04L49/357 , H04L49/45 , H04L49/555 , H04L67/02 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/16 , H04L67/306 , H04L67/34 , H04L69/04 , H04L69/329 , H04Q1/04 , H04Q11/00 , H04Q11/0003 , H04Q11/0062 , H04Q11/0071 , H04Q2011/0037 , H04Q2011/0041 , H04Q2011/0052 , H04Q2011/0073 , H04Q2011/0079 , H04Q2011/0086 , H04Q2213/13523 , H04Q2213/13527 , H04W4/023 , H04W4/80 , H05K1/0203 , H05K1/181 , H05K5/0204 , H05K7/1418 , H05K7/1421 , H05K7/1422 , H05K7/1447 , H05K7/1461 , H05K7/1485 , H05K7/1487 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/1498 , H05K7/2039 , H05K7/20709 , H05K7/20727 , H05K7/20736 , H05K7/20745 , H05K7/20836 , H05K13/0486 , H05K2201/066 , H05K2201/10121 , H05K2201/10159 , H05K2201/10189 , Y10S901/01
Abstract: Technologies for optical communication in a rack cluster in a data center are disclosed. In the illustrative embodiment, a network switch is connected to each of 1,024 sleds by an optical cable that enables communication at a rate of 200 gigabits per second. The optical cable has low loss, allowing for long cable lengths, which in turn allows for connecting to a large number of sleds. The optical cable also has a very high intrinsic bandwidth limit, allowing for the bandwidth to be upgraded without upgrading the optical infrastructure.
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Patent Agency Ranking
公开(公告)号：US20180026851A1
公开(公告)日：2018-01-25
申请号：US15395995
申请日：2016-12-30
Applicant: Intel Corporation
Inventor： Matthew J. Adiletta , Aaron Gorius , Myles Wilde , Michael T. Crocker
CPC classification number: H04Q11/0005 , B25J15/0014 , B65G1/0492 , G02B6/3882 , G02B6/3893 , G02B6/3897 , G02B6/4292 , G02B6/4452 , G05D23/1921 , G05D23/2039 , G06F1/183 , G06F3/061 , G06F3/0611 , G06F3/0613 , G06F3/0616 , G06F3/0619 , G06F3/0625 , G06F3/0631 , G06F3/0638 , G06F3/064 , G06F3/0647 , G06F3/0653 , G06F3/0655 , G06F3/0658 , G06F3/0659 , G06F3/0664 , G06F3/0665 , G06F3/067 , G06F3/0673 , G06F3/0679 , G06F3/0683 , G06F3/0688 , G06F3/0689 , G06F8/65 , G06F9/30036 , G06F9/3887 , G06F9/4401 , G06F9/5016 , G06F9/5044 , G06F9/505 , G06F9/5072 , G06F9/5077 , G06F9/544 , G06F11/141 , G06F11/3414 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F12/109 , G06F12/1408 , G06F13/161 , G06F13/1668 , G06F13/1694 , G06F13/4022 , G06F13/4068 , G06F13/409 , G06F13/42 , G06F13/4282 , G06F15/8061 , G06F16/9014 , G06F2209/5019 , G06F2209/5022 , G06F2212/1008 , G06F2212/1024 , G06F2212/1041 , G06F2212/1044 , G06F2212/152 , G06F2212/202 , G06F2212/401 , G06F2212/402 , G06F2212/7207 , G06Q10/06 , G06Q10/06314 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/008 , G08C17/02 , G08C2200/00 , G11C5/02 , G11C5/06 , G11C7/1072 , G11C11/56 , G11C14/0009 , H03M7/30 , H03M7/3084 , H03M7/3086 , H03M7/40 , H03M7/4031 , H03M7/4056 , H03M7/4081 , H03M7/6005 , H03M7/6023 , H04B10/25 , H04B10/2504 , H04L9/0643 , H04L9/14 , H04L9/3247 , H04L9/3263 , H04L12/2809 , H04L29/12009 , H04L41/024 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/145 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/08 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/38 , H04L47/765 , H04L47/782 , H04L47/805 , H04L47/82 , H04L47/823 , H04L49/00 , H04L49/15 , H04L49/25 , H04L49/357 , H04L49/45 , H04L49/555 , H04L67/02 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/16 , H04L67/306 , H04L67/34 , H04L69/04 , H04L69/329 , H04Q1/04 , H04Q11/00 , H04Q11/0003 , H04Q11/0062 , H04Q11/0071 , H04Q2011/0037 , H04Q2011/0041 , H04Q2011/0052 , H04Q2011/0073 , H04Q2011/0079 , H04Q2011/0086 , H04Q2213/13523 , H04Q2213/13527 , H04W4/023 , H04W4/80 , H05K1/0203 , H05K1/181 , H05K5/0204 , H05K7/1418 , H05K7/1421 , H05K7/1422 , H05K7/1442 , H05K7/1447 , H05K7/1461 , H05K7/1485 , H05K7/1487 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/1498 , H05K7/2039 , H05K7/20709 , H05K7/20727 , H05K7/20736 , H05K7/20745 , H05K7/20836 , H05K13/0486 , H05K2201/066 , H05K2201/10121 , H05K2201/10159 , H05K2201/10189 , Y02D10/14 , Y02D10/151 , Y02P90/30 , Y04S10/54 , Y10S901/01
Abstract: Technologies for connecting data cables in a data center are disclosed. In the illustrative embodiment, racks of the data center are grouped into different zones based on the distance from the racks in a given zone to a network switch. All of the racks in a given zone are connected to the network switch using data cables of the same length. In some embodiments, certain physical resources such as storage may be placed in racks that are in zones closer to the network switch and therefore use shorter data cables with lower latency. An orchestrator server may, in some embodiments, schedule workloads or create virtual servers based on the different zones and corresponding latency of different physical resources.
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公开(公告)号：US09823702B2
公开(公告)日：2017-11-21
申请号：US14129252
申请日：2013-03-29
Applicant: INTEL CORPORATION
Inventor： Ming Zhang , Michael T. Crocker , Xiaofeng Shawn Sheng , Alan W. Tate , Shanjun Deng , Kapil Kane , Minglei Wang , Russell Beauregard
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1632 , G06F1/1643 , G06F1/1654 , H01R31/00
Abstract: An electronic device may be provided that includes a base portion having an input device, a tablet having a display and a docking connector with a plurality of second electrical connectors, and a docking connector to move relative to the base portion. The docking connector may include a first docking pole to extend from the docking connector and to engage with the docking receptacle, and a plurality of first electrical connectors.
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公开(公告)号：US20230180434A1
公开(公告)日：2023-06-08
申请号：US17542907
申请日：2021-12-06
Applicant: Intel Corporation
Inventor： David Shia , Jin Yang , Jimmy Chuang , Mohanraj Prabjugoud , Michael T. Crocker
IPC: H05K7/20
CPC classification number: H05K7/203 , H05K7/20381
Abstract: A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device includes at least one surface and at least one projection extending from the at least one surface, wherein the at least one projection includes at least one sidewall, and wherein the at least one sidewall of the at least one projection includes at least one surface area enhancement structure. Utilizing such a heat dissipation device can boost nucleate boiling, improve boiling performance, reduce superheat required to initiate boiling, boost the critical heat flux during boiling, and can translate to a greater number of integrated circuit devices/packages that can be placed into a single immersion cooling system.
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公开(公告)号：US11233712B2
公开(公告)日：2022-01-25
申请号：US15395995
申请日：2016-12-30
Applicant: Intel Corporation
Inventor： Matthew J. Adiletta , Aaron Gorius , Myles Wilde , Michael T. Crocker
IPC: G02B6/38 , G06F3/06 , G06F13/40 , H04L12/26 , G06F16/901 , H04B10/25 , G02B6/42 , G02B6/44 , G06F1/18 , G06F1/20 , G06F8/65 , G06F9/30 , G06F9/4401 , G06F9/54 , G06F12/109 , G06F12/14 , G06F13/16 , G08C17/02 , G11C5/02 , G11C7/10 , G11C11/56 , G11C14/00 , H03M7/30 , H03M7/40 , H04L12/24 , H04L12/931 , H04L12/947 , H04L29/08 , H04L29/06 , H04Q11/00 , H05K7/14 , G06F15/16 , G06F9/38 , G06F9/50 , H04L12/851 , H04L12/811 , H05K5/02 , H04W4/80 , G06Q10/08 , G06Q10/00 , G06Q50/04 , H04J14/00 , H04L12/911 , B25J15/00 , B65G1/04 , H05K7/20 , H04L12/939 , H04W4/02 , H04L12/751 , G06F13/42 , H05K1/18 , G05D23/19 , G05D23/20 , H04L12/927 , H05K1/02 , H04L12/781 , H04Q1/04 , G06F12/0893 , H05K13/04 , G11C5/06 , G06F11/14 , G06F11/34 , G06F12/0862 , G06F15/80 , H04L12/919 , G06F12/10 , G06Q10/06 , G07C5/00 , H04L12/28 , H04L29/12 , H04L9/06 , H04L9/14 , H04L9/32 , H04L12/933
Abstract: Technologies for connecting data cables in a data center are disclosed. In the illustrative embodiment, racks of the data center are grouped into different zones based on the distance from the racks in a given zone to a network switch. All of the racks in a given zone are connected to the network switch using data cables of the same length. In some embodiments, certain physical resources such as storage may be placed in racks that are in zones closer to the network switch and therefore use shorter data cables with lower latency. An orchestrator server may, in some embodiments, schedule workloads or create virtual servers based on the different zones and corresponding latency of different physical resources.
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公开(公告)号：US20210234377A1
公开(公告)日：2021-07-29
申请号：US17232023
申请日：2021-04-15
Applicant: Intel Corporation
Inventor： Naoki Matsumura , Simon N. Peffers , Steven Lloyd , Michael T. Crocker , Aaron Gorius
IPC: H02J7/00
Abstract: In some examples, a control unit is configured to adjust charge termination voltage of a rechargeable energy storage device. The control unit is adapted to charge the rechargeable energy storage device to a charge termination voltage where the rechargeable energy storage device has capacity to support peak load but comes close to a system shutdown voltage after supporting peak load. The control unit is also adapted to increase the charge termination voltage if a voltage of the rechargeable energy storage device is near a system shutdown voltage after supporting peak load.
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