公开(公告)号：US07608917B2

公开(公告)日：2009-10-27

申请号：US11749211

申请日：2007-05-16

申请人： Ryoichi Kajiwara ,  Kazuhiro Suzuki ,  Toshiaki Ishii ,  Kazutoshi Itou

发明人： Ryoichi Kajiwara ,  Kazuhiro Suzuki ,  Toshiaki Ishii ,  Kazutoshi Itou

IPC分类号： H01L23/02 ,  H01L23/10

CPC分类号： H05K3/284 ,  H01L23/16 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49575 ,  H01L23/49844 ,  H01L23/5385 ,  H01L24/33 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/0058 ,  H05K2201/0715 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor module and an inverter apparatus in which a device or a joining part is not mechanically damaged even when the temperature in use becomes a high temperature in the range of 175 to 250° C., resulting in excellent reliability at high temperature retaining test and thermal cycling test. Low thermal expansion ceramic substrates are disposed above and below the device. A material having a coefficient of thermal expansion of 10 ppm/K or less is disposed between the ceramic substrates. In addition, an inorganic material having a coefficient of thermal expansion in the range of 2 to 6 ppm/K or less is disposed around the device.

摘要翻译： 功率半导体模块和逆变器装置，即使在使用温度在175〜250℃的范围内的高温下，器件或接合部也不会机械损坏，从而在高温保持试验中具有优异的可靠性 和热循环试验。 低热膨胀陶瓷衬底设置在器件的上方和下方。 在陶瓷基板之间设置具有10ppm / K以下的热膨胀系数的材料。 此外，在该装置的周围设置热膨胀系数为2〜6ppm / K以下的无机材料。

公开(公告)号：US20070267739A1

公开(公告)日：2007-11-22

申请号：US11749211

申请日：2007-05-16

申请人： Ryoichi Kajiwara ,  Kazuhiro Suzuki ,  Toshiaki Ishii ,  Kazutoshi Itou

发明人： Ryoichi Kajiwara ,  Kazuhiro Suzuki ,  Toshiaki Ishii ,  Kazutoshi Itou

IPC分类号： H01L23/34

CPC分类号： H05K3/284 ,  H01L23/16 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49575 ,  H01L23/49844 ,  H01L23/5385 ,  H01L24/33 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/0058 ,  H05K2201/0715 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor module and an inverter apparatus in which a device or a joining part is not mechanically damaged even when the temperature in use becomes a high temperature in the range of 175 to 250° C., resulting in excellent reliability at high temperature retaining test and thermal cycling test. Low thermal expansion ceramic substrates are disposed above and below the device. A material having a coefficient of thermal expansion of 10 ppm/K or less is disposed between the ceramic substrates. In addition, an inorganic material having a coefficient of thermal expansion in the range of 2 to 6 ppm/K or less is disposed around the device.

摘要翻译： 功率半导体模块和逆变器装置，即使在使用温度在175〜250℃的范围内的高温下，器件或接合部也不会机械损坏，从而在高温保持试验中具有优异的可靠性 和热循环试验。 低热膨胀陶瓷衬底设置在器件的上方和下方。 在陶瓷基板之间设置具有10ppm / K以下的热膨胀系数的材料。 此外，在该装置的周围设置热膨胀系数为2〜6ppm / K以下的无机材料。

公开(公告)号：US08314484B2

公开(公告)日：2012-11-20

申请号：US12691175

申请日：2010-01-21

申请人： Ryoichi Kajiwara ,  Shigehisa Motowaki ,  Kazutoshi Ito ,  Toshiaki Ishii ,  Katsuo Arai ,  Takuya Nakajo ,  Hidemasa Kagii

发明人： Ryoichi Kajiwara ,  Shigehisa Motowaki ,  Kazutoshi Ito ,  Toshiaki Ishii ,  Katsuo Arai ,  Takuya Nakajo ,  Hidemasa Kagii

IPC分类号： H01L23/15

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/8392 ,  H01L2224/83951 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85447 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/05432 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/3512 ,  H01L2224/48744

摘要： In a structure of a semiconductor device, a Si chip and a metal leadframe are jointed by metallic bond via a porous joint layer made of high conductive metal, having a three-dimensional network structure and using Ag as a bonding material, and a film containing Zn oxide or Al oxide is formed on a surface of a semiconductor assembly contacting to a polymer resin. In this manner, by the joint with the joint layer having the porous structure mainly made of Ag, thermal stress load of the Si chip can be reduced, and fatigue life of the joint layer itself can be improved. Besides, since adhesion of the polymer resin to the film can be enhanced by the anchor effect, occurrence of cracks in a bonding portion can be prevented, so that a highly-reliable Pb-free semiconductor device can be provided.

摘要翻译： 在半导体器件的结构中，Si芯片和金属引线框通过金属接合，通过具有三维网状结构的高导电性金属的多孔接合层，使用Ag作为接合材料，以及含有 在与聚合物树脂接触的半导体组件的表面上形成氧化锌或氧化铝。 以这种方式，通过与主要由Ag形成的多孔结构的接合层的接合，可以降低Si片的热应力负荷，并且可以提高接合层本身的疲劳寿命。 此外，由于通过锚固效应可以提高聚合物树脂对膜的粘附性，可以防止接合部发生裂纹，从而可以提供高可靠性的无铅半导体器件。

公开(公告)号：US08339795B2

公开(公告)日：2012-12-25

申请号：US12831737

申请日：2010-07-07

申请人： Nobutake Tsuyuno ,  Itaru Tanabe ,  Toshiaki Ishii ,  Hiroshi Kameyama

发明人： Nobutake Tsuyuno ,  Itaru Tanabe ,  Toshiaki Ishii ,  Hiroshi Kameyama

IPC分类号： H05K7/00

CPC分类号： H05K5/0034 ,  H05K3/202 ,  H05K2201/0969 ,  H05K2201/10409 ,  H05K2201/10598 ,  Y10T29/49002

摘要： An object of the present invention is to provide a mechanically and electrically integrated type electronic control apparatus which can be embedded in a compact mechanical part, and has a compact structure while having a high wiring freedom, a high heat dissipation and a high reliability. In a mechanically and electrically integrated type electronic control apparatus provided with a control signal generating part, and an angular wiring member connecting the control signal generating part and a controlled part controlled by a control signal of the control signal generating part, installed within a conductive casing, at least the wiring member has a fixed hole, a surface including the fixed hole is coated in an insulative manner, and the fixed hole is fixed to the conductive casing mechanically while keeping an insulating property.

摘要翻译： 本发明的目的是提供一种可以嵌入在紧凑的机械部件中的机电一体型的电子控制装置，并且具有紧凑的结构，同时具有高布线自由度，高散热和高可靠性。 在具有控制信号生成部件的机电一体化型电子控制装置中，以及连接控制信号生成部和被控制信号生成部的控制信号控制的受控部的角配线部件， 至少布线构件具有固定孔，包括固定孔的表面以绝缘的方式被涂覆，并且固定孔在保持绝缘性的同时机械地固定到导电壳体上。

公开(公告)号：US07955411B2

公开(公告)日：2011-06-07

申请号：US11964827

申请日：2007-12-27

申请人： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

发明人： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC分类号： B32B5/16 ,  B22F1/02

CPC分类号： H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

摘要： A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

摘要翻译： 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US06791182B2

公开(公告)日：2004-09-14

申请号：US10103799

申请日：2002-03-25

申请人： Junpei Kusukawa ,  Ryozo Takeuchi ,  Toshiaki Ishii ,  Hiromichi Suzuki ,  Fujio Ito ,  Takafumi Nishita ,  Akihiko Kameoka ,  Masaru Yamada

发明人： Junpei Kusukawa ,  Ryozo Takeuchi ,  Toshiaki Ishii ,  Hiromichi Suzuki ,  Fujio Ito ,  Takafumi Nishita ,  Akihiko Kameoka ,  Masaru Yamada

IPC分类号： H01L2310

CPC分类号： H01L23/564 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49582 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： At least a part of the inner leads 1a of a lead frame 1 is covered with a plating for a metallic fine wire connection, at least the entire portion where the lead frame 1 joins with the adhesive layer 2 is covered by at least one metal or alloy thereof different from the metallic fine wire connecting use plating. The metal or alloy is selected from the group consisting of gold, platinum, iridium, rhodium, palladium, ruthenium, indium, tin, molybdenum, tungsten, gallium, zinc, chromium, niobium, tantalum, titanium and zirconium. Thereby, generation of defects, such as leakage and shorting, due to ion migration can be prevented.

摘要翻译： 引线框架1的内部引线1a的至少一部分被用金属细线连接的电镀覆盖，至少引线框架1与粘合剂层2连接的整个部分被至少一种金属或 它们与金属细线不同的连接用电镀的合金。 金属或合金选自金，铂，铱，铑，钯，钌，铟，锡，钼，钨，镓，锌，铬，铌，钽，钛和锆。 因此，可以防止由于离子迁移而产生诸如泄漏和短路的缺陷。

公开(公告)号：US06726375B2

公开(公告)日：2004-04-27

申请号：US10219268

申请日：2002-08-16

申请人： Takeshil Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

发明人： Takeshil Kato ,  Koji Yoshida ,  Toshinori Hirataka ,  Toshiaki Ishii ,  Kazuyuki Fukuda ,  Tadaaki Ishikawa ,  Toshimasa Miura ,  Tsutomu Kono ,  Kimio Tatsuno

IPC分类号： G02B642

CPC分类号： G02B6/4204 ,  G02B6/3865 ,  G02B6/3873 ,  G02B6/421 ,  G02B6/4292 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

摘要翻译： 用于光学器件和光纤的光学模块由预成型塑料封装构成。 在形成塑料包装时，成型树脂的主流动方向基本上平行于光纤的光轴。 光学模块通过使用压力注射成型树脂然后使树脂固化而形成。 当通过综合成型形成塑料包装时，树脂的流动方向与要安装在光学模块中的光纤的光轴方向平行。 结果，对于综合成型，施加到光纤的成型压力降低。 通过使用形成的树脂壳体，所得到的包装与树脂的流动方向相比具有高刚性和低热膨胀性，从而减小施加到光纤上的外部应力和热应力。

公开(公告)号：US6097100A

公开(公告)日：2000-08-01

申请号：US915334

申请日：1997-08-20

申请人： Shuji Eguchi ,  Yasuhide Sugawara ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Akira Nagai ,  Ryou Moteki ,  Ogino Masahiko ,  Masanori Segawa ,  Rie Hattori ,  Nobutake Tsuyuno ,  Takumi Ueno ,  Atsushi Nakamura ,  Asao Nishimura

发明人： Shuji Eguchi ,  Yasuhide Sugawara ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Akira Nagai ,  Ryou Moteki ,  Ogino Masahiko ,  Masanori Segawa ,  Rie Hattori ,  Nobutake Tsuyuno ,  Takumi Ueno ,  Atsushi Nakamura ,  Asao Nishimura

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/4951 ,  H01L23/293 ,  H01L23/3128 ,  H01L2224/05624 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181

摘要： A resin encapsulated semiconductor element is encapsulated with resin composition containing an organic compound selected from the group consisting of organobromine compounds, organophosphorus compounds and organonitrogen compounds, an inorganic filler, and a metal borate. The obtained resin encapsulated semiconductor element has the same flame resistance as a conventional semiconductor element which is encapsulated with a resin composition containing a halogen and antimony compound, and furthermore, has remarkably improved reliabilities regarding moisture resistance and storing at a high temperature by effects of the contained metal borate for suppressing generation of or trapping released gas components, such as halogen or phosphorus, and others.

摘要翻译： 树脂封装的半导体元件用含有有机化合物的树脂组合物包封，所述有机化合物选自有机溴化合物，有机磷化合物和有机氮化合物，无机填料和金属硼酸盐。 所获得的树脂封装的半导体元件具有与用含有卤素和锑化合物的树脂组合物封装的常规半导体元件相同的阻燃性，并且还具有显着提高的耐湿性的可靠性和高温下的存储 含有金属硼酸盐，用于抑制诸如卤素或磷的释放气体组分的产生或捕获等。

公开(公告)号：US6062344A

公开(公告)日：2000-05-16

申请号：US255851

申请日：1999-02-23

申请人： Sueo Okabe ,  Toshiaki Ishii

发明人： Sueo Okabe ,  Toshiaki Ishii

IPC分类号： B66B1/18 ,  B66B1/14 ,  B66B1/24 ,  B66B7/00 ,  B66B9/00 ,  B66B9/16

CPC分类号： B66B9/00 ,  B66B11/0095

摘要： In an elevator system, first and second car carrying bases move up and down along first and second segments of a hoistway, respectively. First and second support members are located on the first and second car carrying bases, respectively. A car is moved up and down within the hoistway while being selectively supported by the first or second car carrying base. The first and second car carrying bases are arranged so as not to overlap each other when projected on a horizontal plane. Each car support member can shuttle between a support position and a nonsupport position, the support position being a position at which the car support member supports the car by projecting into a moving path of the car and the nonsupport position being a position at which the car support member is retracted from and is outside of the moving path of the car.

摘要翻译： 在电梯系统中，第一和第二轿厢承载座分别沿井道的第一和第二段上下移动。 第一和第二支撑构件分别位于第一和第二车辆承载基座上。 汽车在井道内上下移动，同时由第一或第二轿厢承载基座选择性地支撑。 第一和第二轿厢承载座被布置成当投影在水平面上时彼此不重叠。 每个轿厢支撑构件可以在支撑位置和非支撑位置之间穿梭，支撑位置是汽车支撑构件通过突出到轿厢的移动路径中而支撑轿厢的位置，并且非支撑位置是轿厢 支撑构件从轿厢的移动路径缩回并且位于轿厢的移动路径的外部。

公开(公告)号：US5547059A

公开(公告)日：1996-08-20

申请号：US358980

申请日：1994-12-19

申请人： Eiki Watanabe ,  Toshiaki Ishii ,  Masamoto Mizuno ,  Kazuhiko Sugita

发明人： Eiki Watanabe ,  Toshiaki Ishii ,  Masamoto Mizuno ,  Kazuhiko Sugita

IPC分类号： B66B5/16 ,  B66B1/24 ,  B66B5/18 ,  B66B9/02 ,  B66B11/04 ,  B66B7/00 ,  B66B11/00

CPC分类号： B66B5/18 ,  B66B11/0407

摘要： A linear motor elevator system comprising a sheave disposed in the upper portion of an elevator hoistway, a length of rope wound around the sheave, a movable member connected to said rope, a primary winding disposed only on a first side of said movable member and a secondary conductor extending within and along the hoistway in association with said primary winding to constitute a linear motor. The system may comprise a brake unit disposed on a second side of said movable member which is opposite to said first side and a guide rail disposed within said hoistway for being engaged by said brake unit.

摘要翻译： 一种线性电动机电梯系统，包括设置在电梯井道的上部的绳轮，缠绕在绳轮上的绳索的长度，连接到所述绳索的可动构件，仅设置在所述可动构件的第一侧上的初级绕组和 二级导体与所述初级绕组相关联地在井道内和沿着井道延伸以构成线性电动机。 该系统可以包括设置在与所述第一侧相对的所述可动构件的第二侧上的制动单元和设置在所述井道内的导轨，用于与所述制动单元接合。