公开(公告)号：US07786001B2

公开(公告)日：2010-08-31

申请号：US11733840

申请日：2007-04-11

申请人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L21/44

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

摘要翻译： 一种电气结构和成型方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US07506794B1

公开(公告)日：2009-03-24

申请号：US12166505

申请日：2008-07-02

申请人： Steven A. Cordes ,  Peter A. Gruber

发明人： Steven A. Cordes ,  Peter A. Gruber

IPC分类号： H05K3/34 ,  H01L21/00 ,  H01L23/488

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/06505 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/14505 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/09781 ,  H05K2201/2036 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2924/00

摘要： A method in forming high-temperature alloy solder standoff in a solder bumping process, such as in injection molded solder molds. The standoffs are formed in an injection molded solder mold, by means of pre-depositing a layer of a metal at select sites, such as some of the cavities which are formed in the surface of the mold, and thereafter, filling the mold cavities with solder, utilizing standard techniques as known in the technology. The particular metal, which is deposited in at least some of the mold cavities, will alloy with the solder during or after transfer, and will result in the formation of a higher temperature alloy solder at select locations in the mold cavities.

摘要翻译： 在焊接凸块工艺中形成高温合金焊料支架的方法，例如在注塑模具中。 通过在选定位置预先沉积金属层，例如形成在模具表面中的一些空腔，然后在模具腔中填充模具腔，在注塑模具中形成支座 焊料，利用技术中已知的标准技术。 沉积在至少一些模腔中的特定金属将在转移期间或转移后与焊料合金，并且将导致在模腔中的选定位置形成更高温度的合金焊料。

公开(公告)号：US20080315409A1

公开(公告)日：2008-12-25

申请号：US11765055

申请日：2007-06-19

申请人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： H01L23/48

CPC分类号： H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06183 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16137 ,  H01L2224/16238 ,  H01L2224/17183 ,  H01L2224/81005 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/81

摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

公开(公告)号：US20080272177A1

公开(公告)日：2008-11-06

申请号：US12173346

申请日：2008-07-15

申请人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： B23K37/06

CPC分类号： H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

摘要： A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.

摘要翻译： 系统将焊料提供到电路支撑衬底中的空腔中。 该系统使填充头与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 焊料被迫从填充头朝向电路支撑基板。 焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。 系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。

公开(公告)号：US20080245847A1

公开(公告)日：2008-10-09

申请号：US11696753

申请日：2007-04-05

申请人： Russell A. Budd ,  Evan G. Colgan ,  Peter A. Gruber ,  Gareth G. Hougham ,  John P. Karidis

发明人： Russell A. Budd ,  Evan G. Colgan ,  Peter A. Gruber ,  Gareth G. Hougham ,  John P. Karidis

IPC分类号： B23K1/00

CPC分类号： B23K3/0607 ,  B23K2101/40

摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.

摘要翻译： 模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。 分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。 顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化 界面部分和模板。

公开(公告)号：US07410090B2

公开(公告)日：2008-08-12

申请号：US11409244

申请日：2006-04-21

申请人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： B23K31/02

CPC分类号： H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

摘要： A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.

摘要翻译： 公开了一种在电路支撑衬底中的多个空腔中提供导电接合材料的系统，方法和装置。 该方法包括将填充头放置成与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 导电接合材料被迫从填充头朝向电路支撑基板排出。 所述导电接合材料被提供到与所述至少一个空腔同时的至少一个空腔中，所述至少一个空腔在所述填充头附近。

公开(公告)号：US20080179035A1

公开(公告)日：2008-07-31

申请号：US11626986

申请日：2007-01-25

申请人： Peter A. Gruber ,  John U. Knickerbocker

发明人： Peter A. Gruber ,  John U. Knickerbocker

IPC分类号： B22D17/00 ,  B22D41/00

CPC分类号： B22D17/2023 ,  B22D17/30 ,  B22D18/04 ,  B23K3/0623 ,  B23K3/0638 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

摘要： A flexible nozzle for injection molded solder and a method of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.

摘要翻译： 一种用于注塑焊料的柔性喷嘴和一种利用柔性喷嘴进行注射成型焊料应用的方法。 为了能够有效地执行注射成型的焊接工艺，采用柔性或柔性的焊料分配喷嘴结构，其特别有利地适于与圆形或圆形模具一起使用。 在这方面，提供用于排出焊料的喷嘴的尖端提供一系列小孔或孔，用于在至少一个焊料储存器的压力下挤出焊料。 在一个实施例中，可以使用单个焊料储存器，其中连通多个排出孔或孔，用于挤出焊料，以填充形成在用于注射成型焊料的模具的相对表面中的合适的空腔或凹部。 或者，而不是通过多个孔或排放孔从单个储存器分配或挤出焊料，每个相应的孔或一组孔可以分别连接到经受压力的多个储存器的单独的焊料储存器 有助于将焊料挤出到模具表面上。

公开(公告)号：US20080176055A1

公开(公告)日：2008-07-24

申请号：US11624830

申请日：2007-01-19

申请人： Peter A. Gruber ,  Philip Charles Danby Hobbs

发明人： Peter A. Gruber ,  Philip Charles Danby Hobbs

IPC分类号： B32B3/18 ,  B23K31/02 ,  B23K1/00

CPC分类号： B32B7/045 ,  B23K3/0623 ,  B23K2101/40 ,  B32B7/14 ,  B32B15/01 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  Y10T428/12347 ,  Y10T428/24562 ,  Y10T428/24826 ,  Y10T428/249921 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。

公开(公告)号：US07401637B2

公开(公告)日：2008-07-22

申请号：US11495966

申请日：2006-07-28

申请人： Glen N. Biggs ,  John J. Garant ,  Peter A. Gruber ,  Bouwe W. Leenstra ,  Christopher L. Tessler ,  Thomas Weiss

发明人： Glen N. Biggs ,  John J. Garant ,  Peter A. Gruber ,  Bouwe W. Leenstra ,  Christopher L. Tessler ,  Thomas Weiss

IPC分类号： B22D18/00

CPC分类号： B23K3/0638

摘要： A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.

摘要翻译： 提供了一种新的仅压力熔融金属阀装置和方法。 这种控制液体流动的新方法消除了对活动的，移动的阀部件的需要。 使用液体的天然表面张力特性，当克服阈值或者将液体保持在头部时，气体压力也可以激活液体流动，即使在抬起时也是如此。

公开(公告)号：US20080164609A1

公开(公告)日：2008-07-10

申请号：US11620900

申请日：2007-01-08

申请人： Peter A. Gruber ,  Barry A. Hochlowski ,  David T. Naugle

发明人： Peter A. Gruber ,  Barry A. Hochlowski ,  David T. Naugle

IPC分类号： H01L21/768 ,  H01L23/492

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/013

摘要： Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.

摘要翻译： 公开了可用于凸起半导体晶片的制造焊球的方法。 还公开了用焊球冲击半导体晶片的方法。 焊球可以使用注射成型焊接（IMS）工艺制成。