公开(公告)号：US08592995B2

公开(公告)日：2013-11-26

申请号：US12825822

申请日：2010-06-29

Applicant: Jing-Cheng Lin ,  Chen-Hua Yu

Inventor： Jing-Cheng Lin ,  Chen-Hua Yu

IPC: H01L23/50

CPC classification number: H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13084 ,  H01L2224/13147 ,  H01L2224/13583 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T428/24612 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/01015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/1146

Abstract: A method and structure for good adhesion of Intermetallic Compounds (IMC) on Cu pillar bumps are provided. The method includes depositing Cu to form a Cu pillar layer, depositing a diffusion barrier layer on top of the Cu pillar layer, and depositing a Cu cap layer on top of the diffusion barrier layer, where an intermetallic compound (IMC) is formed among the diffusion barrier layer, the Cu cap layer, and a solder layer placed on top of the Cu cap layer. The IMC has good adhesion on the Cu pillar structure, the thickness of the IMC is controllable by the thickness of the Cu cap layer, and the diffusion barrier layer limits diffusion of Cu from the Cu pillar layer to the solder layer. The method can further include depositing a thin layer for wettability on top of the diffusion barrier layer prior to depositing the Cu cap layer.

Abstract translation: 提供了一种用于金属间化合物（IMC）对Cu柱凸块的良好粘附的方法和结构。 该方法包括沉积Cu以形成Cu柱层，在Cu柱层的顶部上沉积扩散阻挡层，并在扩散阻挡层的顶部上沉积Cu覆盖层，其中形成金属间化合物（IMC） 扩散阻挡层，Cu覆盖层和位于Cu覆盖层顶部的焊料层。 IMC对Cu柱结构具有良好的粘附性，IMC的厚度可由Cu覆盖层的厚度控制，扩散阻挡层限制Cu从Cu柱层到焊料层的扩散。 该方法可以进一步包括在沉积Cu覆盖层之前在扩散阻挡层的顶部沉积薄层以获得润湿性。

公开(公告)号：US08580683B2

公开(公告)日：2013-11-12

申请号：US13246556

申请日：2011-09-27

Applicant: Chung Yu Wang ,  Chih-Wei Wu ,  Szu Wei Lu ,  Jing-Cheng Lin

Inventor： Chung Yu Wang ,  Chih-Wei Wu ,  Szu Wei Lu ,  Jing-Cheng Lin

IPC: H01L23/28

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/13111 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: Methods and apparatus for performing molding on die on wafer interposers. A method includes receiving an interposer assembly having a die side and an opposite side including two or more integrated circuit dies mounted on the die side of the interposer, the interposer assembly having spaces formed on the die side of the interposer between the two or more integrated circuit dies; mounting at least one stress relief feature on the die side of the interposer assembly in one of the spaces between the two or more integrated circuit dies; and molding the integrated circuit dies using a mold compound, the mold compound surrounding the two or more integrated circuit dies and the at least one stress relief feature. An apparatus is disclosed having integrated circuits mounted on a die side of an interposer, stress relief features between the integrated circuits and mold compound over the integrated circuits.

Abstract translation: 用于在晶片插入件上的模具上进行模制的方法和装置。 一种方法包括接收具有管芯侧面和相对侧的插入件组件，所述插入件组件包括安装在所述插入件的裸片侧上的两个或多个集成电路管芯，所述插入器组件具有形成在所述插入件的裸片侧上的两个或更多个集成 电路模具; 在所述两个或更多个集成电路管芯之间的空间之一中在所述插入器组件的管芯侧上安装至少一个应力释放特征; 以及使用模具化合物模制所述集成电路模具，围绕所述两个或更多个集成电路管芯的所述模具化合物以及所述至少一个应力释放特征。 公开了一种装置，其集成电路安装在插入件的裸片侧，集成电路之间的应力消除特征和集成电路上的模具化合物。

公开(公告)号：US20130249532A1

公开(公告)日：2013-09-26

申请号：US13429054

申请日：2012-03-23

Applicant: Jing-Cheng Lin ,  Szu Wei Lu

Inventor： Jing-Cheng Lin ,  Szu Wei Lu

IPC: G01R1/06 ,  H01L23/48

CPC classification number: H01L25/0655 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/3157 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/11 ,  H01L2224/11002 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/83 ,  H01L2224/83104 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06596 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A method includes bonding a first package component on a first surface of a second package component, and probing the first package component and the second package component from a second surface of the second package component. The step of probing is performed by probing through connectors on the second surface of the second package component. The connectors are coupled to the first package component. After the step of probing, a third package component is bonded on the first surface of the second package component.

公开(公告)号：US08540416B2

公开(公告)日：2013-09-24

申请号：US12278620

申请日：2007-02-06

Applicant: Xiaosheng Guan ,  Min Guo ,  Cheng Zhou ,  Yuming Hu ,  Jing Cheng

Inventor： Xiaosheng Guan ,  Min Guo ,  Cheng Zhou ,  Yuming Hu ,  Jing Cheng

IPC: G05D7/00 ,  B01F5/04 ,  F15C3/00

CPC classification number: G01N27/44704 ,  B01F5/04 ,  B01F13/0059 ,  B01L3/502715 ,  B01L3/502723 ,  B01L3/502738 ,  B01L3/502746 ,  B01L2200/0621 ,  B01L2200/143 ,  B01L2300/0816 ,  B01L2300/0867 ,  B01L2400/0487 ,  B33Y80/00 ,  Y10T137/0329 ,  Y10T137/2076 ,  Y10T137/8766

Abstract: The present invention provides a device for handling fluids, and more particularly a merging apparatus for fluidic and microfluidic devices utilizing passive valving in conjunction with a single sensor to uniformly blend contributory working fluid streams. Symmetric and non symmetric embodiments with and without branch channels are described. The present invention also provides methods for merging liquids using the device of the invention.

Abstract translation: 本发明提供了一种用于处理流体的装置，更具体地说，一种用于流体和微流体装置的合并装置，其利用与单个传感器结合的无源阀来均匀地混合贡献的工作流体流。 描述了具有和不具有分支信道的对称和非对称实施例。 本发明还提供了使用本发明的装置来合并液体的方法。

公开(公告)号：US20130244378A1

公开(公告)日：2013-09-19

申请号：US13418868

申请日：2012-03-13

Applicant: Chin-Fu KAO ,  Jing-Cheng LIN ,  Jui-Pin HUNG ,  Szu Wei LU

Inventor： Chin-Fu KAO ,  Jing-Cheng LIN ,  Jui-Pin HUNG ,  Szu Wei LU

IPC: H01L21/50

CPC classification number: H01L21/563 ,  H01L21/568 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method includes bonding a carrier over a top die. The method further includes curing an underfill disposed between a substrate and the top die. The method further includes applying a force over the carrier during the curing. The method further includes removing the carrier from the top die.

Abstract translation: 一种方法包括将载体粘合在顶模上。 该方法还包括固化设置在基底和顶模之间的底部填充物。 该方法还包括在固化期间在载体上施加力。 该方法还包括从顶模移除载体。

公开(公告)号：US20130223014A1

公开(公告)日：2013-08-29

申请号：US13403511

申请日：2012-02-23

Applicant: Jing-Cheng LIN ,  Po-Hao TSAI

Inventor： Jing-Cheng LIN ,  Po-Hao TSAI

IPC: H05K7/00 ,  B23K31/02

CPC classification number: H01L24/11 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2924/01047 ,  H01L2224/05552 ,  H01L2924/00

Abstract: The mechanisms for forming bumps on packaged dies and package substrates reduce variation of bump heights across the packaged dies and packaged substrates. Bumps are designed to have different widths to counter the higher plating current near edge(s) of dies or substrates. Bump sizes can be divided into different zones depending on the bump patterns and densities across the packaged die and/or substrates. Smaller bumps near edges reduce the thickness of plated film(s), which would have been thicker due to being near the edges. As a result, the bump heights across the packaged dies and/or substrates can be kept significantly constant and chip package can be properly formed.

Abstract translation: 用于在封装的芯片和封装衬底上形成凸点的机制减少了封装的裸片和封装的衬底上的凸起高度的变化。 冲击波被设计成具有不同的宽度以抵抗在模具或基底的边缘附近的较高电镀电流。 凸起尺寸可以分为不同的区域，这取决于包装模具和/或基底上的凸起图案和密度。 边缘附近的较小的凸起减小了镀膜的厚度，这将由于靠近边缘而变厚。 结果，穿过封装的管芯和/或衬底的突起高度可以保持显着恒定，并且可以适当地形成芯片封装。

公开(公告)号：US20130217584A1

公开(公告)日：2013-08-22

申请号：US13814213

申请日：2010-08-06

Applicant: Guanbin Zhang ,  Guangxin Xiang ,  Wanli Xing ,  Jing Cheng

Inventor： Guanbin Zhang ,  Guangxin Xiang ,  Wanli Xing ,  Jing Cheng

IPC: C12Q1/68

CPC classification number: C12Q1/6837 ,  C12Q2563/143 ,  C12Q2563/149 ,  C12Q2563/155

Abstract: A microarray-based assay is provided, which is used for analyzing molecular interactions, including polynucleotides, polypeptides, antibodies, small molecule compounds, peptides and carbohydrates. Such method comprises coupling a target molecule to a particle and then binding to a probe molecule on microarray. In particular, multiplexed genetic analysis of nucleic acid fragments can be implemented. Specific genes, single nucleotide polymorphisms or gene mutations, such as deletions, insertions, and indels, can be identified. Coupled with microarray, the particles, themselves or further modified, facilitate the detection of results with non-expensive devices or even naked eyes. This technology enables the detection and interpretation of molecular interactions in an efficient and cost effective way.

Abstract translation: 提供基于微阵列的测定法，其用于分析分子相互作用，包括多核苷酸，多肽，抗体，小分子化合物，肽和碳水化合物。 这种方法包括将靶分子偶联到颗粒上，然后与微阵列上的探针分子结合。 特别地，可以实现核酸片段的多重遗传分析。 可以鉴定特异性基因，单核苷酸多态性或基因突变，例如缺失，插入和插入。 与微阵列结合，颗粒本身或进一步修饰，有助于使用非昂贵装置甚至肉眼检测结果。 该技术能够以有效和成本有效的方式检测和解释分子相互作用。

公开(公告)号：US20130210198A1

公开(公告)日：2013-08-15

申请号：US13370477

申请日：2012-02-10

Applicant: Jing-Cheng LIN

Inventor： Jing-Cheng LIN

IPC: H01L21/56

CPC classification number: H01L21/561 ,  H01L21/486 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/18161 ,  H01L2224/83 ,  H01L2224/81

Abstract: A method for forming a semiconductor structure. A semiconductor substrate including a plurality of dies mounted thereon is provided. The substrate includes a first portion proximate to the dies and a second portion distal to the dies. In some embodiments, the first portion may include front side metallization. The second portion of the substrate is thinned and a plurality of conductive through substrate vias (TSVs) is formed in the second portion of the substrate after the thinning operation. Prior to thinning, the second portion may not contain metallization. In one embodiment, the substrate may be a silicon interposer. Further back side metallization may be formed to electrically connect the TSVs to other packaging substrates or printed circuit boards.

Abstract translation: 一种形成半导体结构的方法。 提供了包括安装在其上的多个管芯的半导体基板。 衬底包括靠近模具的第一部分和远离模具的第二部分。 在一些实施例中，第一部分可以包括前侧金属化。 衬底的第二部分变薄，并且在变薄操作之后，在衬底的第二部分中形成多个导电贯通衬底通孔（TSV）。 在变薄之前，第二部分可以不包含金属化。 在一个实施例中，衬底可以是硅插入器。 可以形成另外的背侧金属化以将TSV电连接到其他封装基板或印刷电路板。

公开(公告)号：US20130207306A1

公开(公告)日：2013-08-15

申请号：US13485307

申请日：2012-05-31

Applicant: Chih-Hao Chen ,  Hsien-Wen Liu ,  Yi-Lin Tsai ,  Jui-Pin Hung ,  Jing-Cheng Lin

Inventor： Chih-Hao Chen ,  Hsien-Wen Liu ,  Yi-Lin Tsai ,  Jui-Pin Hung ,  Jing-Cheng Lin

IPC: B29C43/18 ,  H01L21/56

CPC classification number: B29C43/18 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/1531 ,  H01L2924/157 ,  H01L2924/00012 ,  H01L2224/81

Abstract: A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature.

Abstract translation: 一种方法包括将聚合物模塑到包装部件上。 模制步骤包括在第一温度下进行的第一模塑阶段和在与第一温度不同的第二温度下进行的第二模塑阶段。

公开(公告)号：US20130206250A1

公开(公告)日：2013-08-15

申请号：US13805323

申请日：2011-07-01

Applicant: Guohao Zhang ,  Su Guo ,  Can Wang ,  Guoqing Wang ,  Miao Liu ,  Jinxiu Zhang ,  Bei Han ,  Tao Deng ,  Wanli Xing ,  Jing Cheng

Inventor： Guohao Zhang ,  Su Guo ,  Can Wang ,  Guoqing Wang ,  Miao Liu ,  Jinxiu Zhang ,  Bei Han ,  Tao Deng ,  Wanli Xing ,  Jing Cheng

IPC: F04B43/00

CPC classification number: F04B43/00 ,  B01L3/502738 ,  B01L9/527 ,  B01L2200/027 ,  B01L2200/16 ,  B01L2300/1827 ,  B01L2400/0633 ,  B01L2400/0638 ,  B01L2400/0677 ,  B01L2400/0688 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0019 ,  F16K99/0028 ,  F16K99/0034 ,  F16K99/0044 ,  F16K2099/0084 ,  Y10T137/4238

Abstract: Provided are a bubble-based microvalve and a microfluidic chip using the microvalve. Also provided are methods of using the microvalve for manipulating fluid in a microfluidic channel by changing the volume and/or location of the gas in the microvalve.

Abstract translation: 提供了基于气泡的微型阀和使用微型阀的微流控芯片。 还提供了通过改变微型阀中的气体的体积和/或位置来使用微型阀来在微流体通道中操纵流体的方法。