公开(公告)号：US06914198B2

公开(公告)日：2005-07-05

申请号：US10237579

申请日：2002-09-09

Applicant: Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

Inventor： Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

IPC: H01L23/495 ,  H05K1/02 ,  H05K1/09 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

Abstract translation: 公开了一种包括具有有源侧和非有源侧的电路的器件，封装电路的有源侧的封装，并且不包围电路的非有源侧的一部分，以及引线，其具有连接到第一端 经由引线芯片连接到电路的有源侧，并且具有从封装延伸的第二端。 还公开了一种包括由柔性导体形成的电路和引线的器件，其中引线具有连接到电路的第一端。

公开(公告)号：US20050118845A1

公开(公告)日：2005-06-02

申请号：US10496558

申请日：2002-11-21

Applicant: Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

Inventor： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

IPC: C09J7/00 ,  C09J9/02 ,  C09J121/00 ,  C09J183/04 ,  H01B5/16 ,  H01B13/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01R11/01 ,  H05K3/32 ,  H01R4/58

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2483/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

Abstract: An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.

Abstract translation: 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

公开(公告)号：US20050095896A1

公开(公告)日：2005-05-05

申请号：US10702192

申请日：2003-11-05

Applicant: Christopher Tutt

Inventor： Christopher Tutt

IPC: H01R13/24 ,  H01R4/50

CPC classification number: H01R13/2414 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/73 ,  H01R12/735 ,  H05K1/144 ,  H05K2201/0314 ,  H05K2201/042 ,  H05K2201/10378

Abstract: A connector or connector assembly having a signal array having at least one shielded conductor having opposite ends and including an axial conductive element and an outer conductive element surrounding the axial conductive element and a compressible interface element positioned at least one of the opposite ends of the signal array, the interface element including a layer of insulating material having a plurality of conductive elements extending through the insulating material layer. When compressed between the signal array and a signal bearing component, the compressible interface element maintains the geometric arrangement of the axial conductive element and the outer conductive element to the signal bearing component. A connector assembly may include a circuit board including land areas arranged in a shielded configuration, and corresponding to the shielded land areas on the component and a second compressible interface element. The compressible interface element is coupled between the circuit board and the shielded conductor to pass a signal from the shielded conductor to the land area on the second circuit board.

Abstract translation: 一种具有信号阵列的连接器或连接器组件，该信号阵列具有至少一个具有相对端并且包括轴向导电元件的屏蔽导体和围绕该轴向导电元件的外部导电元件和位于信号的相对端中的至少一个的可压缩接口元件的屏蔽导体 阵列，所述界面元件包括具有延伸穿过所述绝缘材料层的多个导电元件的绝缘材料层。 当在信号阵列和信号支承部件之间被压缩时，可压缩接口元件将轴向导电元件和外部导电元件的几何布置保持到信号轴承部件。 连接器组件可以包括电路板，其包括以屏蔽配置布置的对应于组件上的屏蔽接地区域和第二可压缩接口元件的接地区域。 可压缩接口元件耦合在电路板和屏蔽导体之间，以将信号从屏蔽导体传递到第二电路板上的接地区域。

公开(公告)号：US06839965B2

公开(公告)日：2005-01-11

申请号：US10360575

申请日：2003-02-06

Applicant: Scott Patrick Terrell ,  Clifton Jay Seusy ,  Robert Calhoun Cannon ,  Darrell Kent Mason ,  Brandon Chad Bailey ,  Douglas G. Hastings

Inventor： Scott Patrick Terrell ,  Clifton Jay Seusy ,  Robert Calhoun Cannon ,  Darrell Kent Mason ,  Brandon Chad Bailey ,  Douglas G. Hastings

IPC: H01R13/24 ,  H05K1/11 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/32 ,  H05K3/42 ,  H01K3/10

CPC classification number: H01R13/2414 ,  H05K1/113 ,  H05K3/062 ,  H05K3/108 ,  H05K3/243 ,  H05K3/247 ,  H05K3/325 ,  H05K3/326 ,  H05K3/427 ,  H05K2201/0314 ,  H05K2201/035 ,  H05K2201/0969 ,  H05K2201/0979 ,  H05K2201/10378 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method for making electrical interposers which includes the use of a stencil which is thicker than designated lower contact pads and which defines a stencil passage corresponding to each lower contact pad of each interposer. The stencil is attached to a bottom surface of an insulative layer and a conductive elastomeric material is applied to the stencil, so that the stencil passages are filled with said conductive elastomeric material. When this material has been adequately placed within the stencil passages the stencil is removed thus leaving each lower conductive pad with an attached conductive elastomeric pad.

Abstract translation: 一种制造电插入件的方法，其包括使用比指定的下接触焊盘厚的模板，并且限定对应于每个插入件的每个下接触焊盘的模板通道。 模板附接到绝缘层的底表面，并且将导电弹性体材料施加到模板，使得模板通道填充有导电弹性体材料。 当这种材料已经被充分放置在模板通道内时，去除模板，从而使每个下部导电垫具有附着的导电弹性垫。

公开(公告)号：US06785148B1

公开(公告)日：2004-08-31

申请号：US09217401

申请日：1998-12-21

Applicant: Kenzo Ishida ,  Shuji Inoue ,  Kinya Ichikawa ,  Kenji Takahashi

Inventor： Kenzo Ishida ,  Shuji Inoue ,  Kinya Ichikawa ,  Kenji Takahashi

IPC: H05K710

CPC classification number: H05K3/325 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/4069 ,  H05K7/1061 ,  H05K2201/0314 ,  H05K2201/10265 ,  H05K2201/10378

Abstract: A socket for mounting a processor and/or a board has a substrate with a built in socket. The socket has conductive, elastically deformable terminals. The socket may be mounted to a processor and a board without using conventional surface mount technology, instead providing a mechanical contact mechanism between the socket and the board or processor. An adhesive layer may also be used to connect the socket to a processor and/or a board.

Abstract translation: 用于安装处理器和/或板的插座具有带有内置插座的基板。 插座具有导电的，可弹性变形的端子。 插座可以安装到处理器和板上，而不使用传统的表面贴装技术，而是在插座和板或处理器之间提供机械接触机构。 也可以使用粘合剂层将插座连接到处理器和/或板。

公开(公告)号：US20040108133A1

公开(公告)日：2004-06-10

申请号：US10619632

申请日：2003-07-16

Inventor： Takeshi Sano ,  Hirofumi Kobayashi ,  Hideaki Ohkura

IPC: H01L023/48 ,  H05K001/18

CPC classification number: H05K3/325 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13386 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13455 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0314 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/0542 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05147

Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Abstract translation: 电子设备包括电子部件，其包括至少一个第一电极，包括至少一个第二电极的基板和形成在所述至少一个第一电极上的至少一个凸块，并由包括具有橡胶弹性的树脂的弹性导电树脂形成， 以及包括涂覆有金，银，镍和铜之一的表面层的针状导电填料。 所述至少一个第一电极和所述至少一个第二电极通过使所述至少一个凸块与所述至少一个第二电极机械接触而彼此电连接。

公开(公告)号：US20030232524A1

公开(公告)日：2003-12-18

申请号：US10173280

申请日：2002-06-18

Inventor： Robert C. Burdick

IPC: H01R004/58

CPC classification number: H01R13/2414 ,  H01R12/613 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/0314

Abstract: An electrical contact system including an elastomeric conductive material of specified shape and size, said conductive material exhibiting a first plurality of electrical contact locations. An electrical power supply connected to the conductive material and communicable with the first electrical contact locations. A like plurality of second electrical contacts are arranged in abutting and substantially two dimensional contact with respect to the first electrical contact locations, an electrically communicable conduit extends from the second contacts. The two dimensional electrical communication established between the abutting first and second contacts allows for a range of misalignment existing therebetween during low current (typically in a range of 1 mA-1 A) transfer across the electrical contact system.

Abstract translation: 一种电接触系统，包括具有特定形状和尺寸的弹性体导电材料，所述导电材料呈现出第一多个电接触位置。 连接到导电材料并可与第一电接触位置连接的电源。 类似的多个第二电触点相对于第一电接触位置邻接且基本上二维接触地布置，电连接导管从第二触点延伸。 在邻接的第一和第二触点之间建立的二维电通信允许在电接触系统的低电流（通常在1mA-1A）的范围内传输之间存在的一些不对准范围。

公开(公告)号：US20030216068A1

公开(公告)日：2003-11-20

申请号：US10434998

申请日：2003-05-10

Inventor： Roger E. Weiss

IPC: H01R004/58

CPC classification number: H01R13/2414 ,  H01R4/58 ,  H01R12/714 ,  H05K1/0269 ,  H05K3/325 ,  H05K2201/0108 ,  H05K2201/0314 ,  H05K2203/166

Abstract: An optically transparent elastomeric electrical interconnect, the interconnect made from an optically transparent elastomeric material, with a number of conductive elements embedded in the elastomeric material and defining conductive pathways through the material.

Abstract translation: 光学透明的弹性体电互连，由光学透明的弹性体材料制成的互连，其中许多导电元件嵌入在弹性体材料中并且限定穿过该材料的导电路径。

公开(公告)号：US20030146017A1

公开(公告)日：2003-08-07

申请号：US10378141

申请日：2003-03-04

Inventor： Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

IPC: H01B017/26

CPC classification number: H01L23/49827 ,  H01L2924/0002 ,  H01R12/7082 ,  H05K1/112 ,  H05K3/325 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/0314 ,  H05K2201/0394 ,  H05K2201/09845 ,  H05K2201/10378 ,  H01L2924/00

Abstract: The present invention features an interposer that provides a high reliability interface between an LGA connector and a motherboard. The novel interposer overcomes the limitations of prior art interposers by including a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.

Abstract translation: 本发明的特征在于提供LGA连接器和母板之间的高可靠性接口的插入器。 新颖的插入器通过为每个焊料互连包括一个阶梯式间隔器来克服现有技术插入件的局限性，从而防止机械接触力的松弛，同时确保每个焊料互连的完整性。 插入器在第一表面上提供贵金属电镀的接触焊盘，以接收LGA连接器的接触构件，以及用于连接到母板的用于BGA焊接连接的接触焊盘。 还公开了制造插入件的过程的描述。

公开(公告)号：US06465746B1

公开(公告)日：2002-10-15

申请号：US09690664

申请日：2000-10-17

Applicant: Kazutoyo Kajita

Inventor： Kazutoyo Kajita

IPC: H05K116

CPC classification number: H03B1/02 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/325 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/0314 ,  H05K2201/0715 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10969 ,  H05K2201/2036

Abstract: An oscillator attachment structure which prevents interference by a beat signal caused by mixture of a reference oscillation signal from a PLL circuit and an oscillation signal from an oscillator. A plate conductive rubber plate, electrically connected to a ground conductor, is provided on the lower surface of a circuit board, and the conductive rubber plate is disposed on a ground conductive member of a printed circuit board. The ground conductor and the ground conductive member are electrically connected to each other, and the circuit board can be sufficiently grounded to the PLL circuit on the printed circuit board.

Abstract translation: 振荡器附件结构，其防止由来自PLL电路的参考振荡信号和来自振荡器的振荡信号的混合引起的差拍信号的干扰。 在电路板的下表面上设置电连接到接地导体的板状导电橡胶板，并且导电橡胶板设置在印刷电路板的接地导电构件上。 接地导体和接地导电构件彼此电连接，并且电路板可以充分地接地到印刷电路板上的PLL电路。