公开(公告)号：US20110318226A1

公开(公告)日：2011-12-29

申请号：US11660469

申请日：2004-11-22

Applicant: Yu Ge ,  Wenjun Yang ,  Shuying Zhao ,  Lianghong Guo ,  Jing Cheng

Inventor： Yu Ge ,  Wenjun Yang ,  Shuying Zhao ,  Lianghong Guo ,  Jing Cheng

IPC: G01N33/00

CPC classification number: G01N21/6452 ,  G01N21/278 ,  Y10T436/255

Abstract: The present invention relates to calibration slides for fluorescence detection instruments and processing method of making them. The aim of this invention is to disclose calibration slides with high photostability and long lifetime for fluorescence detection instruments. The calibration slides are fabricated by patterning calibration spot arrays of modified inorganic phosphors on the glass slide. The process for producing a calibration slide comprises the following procedure: 1) Dispersing the inorganic phosphors of rare-earth doped complex in water; 2) Patterning the affay of the above suspension on the glass slide. The calibration slides in the present invention employ a very stable fluorescing material that is insensitive to photobleaching, has long lifetime and stability under mild storage condition. The calibration slides in the present invention can be used to calibrate and test for some fluorescence instruments, i.e. microarray scanner, fluorescent microscopy, fluorescence spectrometer, fluorescent multiwell-plate reader

Abstract translation: 本发明涉及用于荧光检测仪器的校准载片及其制作方法。 本发明的目的是公开具有高荧光检测仪器的高光稳定性和长寿命的校准载玻片。 通过在玻璃载片上图案化修饰的无机磷光体的校准点阵列来制造校准载玻片。 制备校准载玻片的方法包括以下步骤：1）将稀土掺杂络合物的无机磷光体分散在水中; 2）将上述悬浮液的印刷图案化在玻璃载玻片上。 本发明中的校准载玻片使用对光漂白不敏感的非常稳定的荧光材料，在温和储存条件下具有长寿命和稳定性。 本发明中的校准载玻片可用于校准和测试一些荧光仪器，即微阵列扫描仪，荧光显微镜，荧光光谱仪，荧光多孔板读数器

公开(公告)号：US20110316147A1

公开(公告)日：2011-12-29

申请号：US12823851

申请日：2010-06-25

Applicant: Ying-Ching Shih ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Ying-Ching Shih ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/488

CPC classification number: H01L21/76885 ,  H01L21/486 ,  H01L21/56 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/11002 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/181 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/4007 ,  H05K2203/016 ,  H05K2203/025 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/16145 ,  H01L2924/00012

Abstract: A device includes an interposer, which includes a substrate; and at least one dielectric layer over the substrate. A plurality of through-substrate vias (TSVs) penetrate through the substrate. A first metal bump is in the at least one dielectric layer and electrically coupled to the plurality of TSVs. A second metal bump is over the at least one dielectric layer. A die is embedded in the at least one dielectric layer and bonded to the first metal bump.

Abstract translation: 一种装置包括：插入件，其包括基板; 以及衬底上的至少一个电介质层。 多个穿通基板通孔（TSV）穿透基板。 第一金属凸块在至少一个电介质层中并电耦合到多个TSV。 第二金属凸块在至少一个电介质层的上方。 模具嵌入在至少一个电介质层中并结合到第一金属凸块。

公开(公告)号：US20110304999A1

公开(公告)日：2011-12-15

申请号：US12834943

申请日：2010-07-13

Applicant: Chen-Hua Yu ,  Jing-Cheng Lin

Inventor： Chen-Hua Yu ,  Jing-Cheng Lin

IPC: H05K1/18 ,  H05K3/00 ,  H05K1/11

CPC classification number: H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  Y10T29/49124 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A device includes an interposer including a substrate, and a first through-substrate via (TSV) penetrating through the substrate. A glass substrate is bonded to the interposer through a fusion bonding. The glass substrate includes a second TSV therein and electrically coupled to the first TSV.

Abstract translation: 一种器件包括内插器，其包括衬底和穿透衬底的第一穿透衬底通孔（TSV）。 玻璃基板通过熔接结合到插入件上。 玻璃基板在其中包括第二TSV并且电耦合到第一TSV。

公开(公告)号：US20110304042A1

公开(公告)日：2011-12-15

申请号：US12846260

申请日：2010-07-29

Applicant: Jing-Cheng Lin ,  Ya-Hsi Hwung ,  Hsin-Yu Chen ,  Po-Hao Tsai ,  Yan-Fu Lin ,  Cheng-Lin Huang ,  Fang Wen Tsai ,  Wen-Chih Chiou

Inventor： Jing-Cheng Lin ,  Ya-Hsi Hwung ,  Hsin-Yu Chen ,  Po-Hao Tsai ,  Yan-Fu Lin ,  Cheng-Lin Huang ,  Fang Wen Tsai ,  Wen-Chih Chiou

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L24/11 ,  H01L23/488 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05099 ,  H01L2224/05571 ,  H01L2224/05599 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1182 ,  H01L2224/11823 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13578 ,  H01L2224/13583 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/1369 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/16145 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2224/05552 ,  H01L2224/81805

Abstract: A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection layer includes a compound of copper and a polymer, and is a dielectric layer.

Abstract translation: 工件包括具有顶表面和侧壁的铜凸块。 在铜凸块的侧壁而不是顶表面上形成保护层。 保护层包括铜和聚合物的化合物，并且是介电层。

公开(公告)号：US20110254160A1

公开(公告)日：2011-10-20

申请号：US12762085

申请日：2010-04-16

Applicant: Po-Hao Tsai ,  Jing-Cheng Lin ,  Chen-Hua Yu

Inventor： Po-Hao Tsai ,  Jing-Cheng Lin ,  Chen-Hua Yu

IPC: H01L23/538

CPC classification number: H01L23/3121 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/00 ,  H01L2224/81805

Abstract: A device includes an interposer including a substrate having a top surface and a bottom surface. A plurality of through-substrate vias (TSVs) penetrates through the substrate. The plurality of TSVs includes a first TSV having a first length and a first horizontal dimension, and a second TSV having a second length different from the first length, and a second horizontal dimension different from the first horizontal dimension. An interconnect structure is formed overlying the top surface of the substrate and electrically coupled to the plurality of TSVs.

Abstract translation: 一种器件包括具有顶表面和底表面的衬底的插入器。 多个穿通基板通孔（TSV）穿过基板。 多个TSV包括具有第一长度和第一水平尺寸的第一TSV和具有不同于第一长度的第二长度的第二TSV和与第一水平尺寸不同的第二水平尺寸。 互连结构形成在衬底的顶表面上并电耦合到多个TSV。

公开(公告)号：US07968305B2

公开(公告)日：2011-06-28

申请号：US10104300

申请日：2002-03-22

Applicant: Xiaobo Wang ,  Lei Wu ,  Jun Quan Xu ,  Ming Xiang Huang ,  Weiping Yang ,  Jing Cheng ,  Jia Xu

Inventor： Xiaobo Wang ,  Lei Wu ,  Jun Quan Xu ,  Ming Xiang Huang ,  Weiping Yang ,  Jing Cheng ,  Jia Xu

IPC: G01N33/53

CPC classification number: G01N33/5005 ,  B01L3/50273 ,  B01L3/502761 ,  B01L3/502792 ,  B01L2200/06 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0819 ,  B01L2400/0415 ,  B01L2400/043 ,  B01L2400/0436 ,  B01L2400/0457 ,  B01L2400/049 ,  B03C5/026 ,  B03C5/028 ,  C12Q1/6869 ,  G01N15/1031 ,  G01N33/48728 ,  C12Q2565/629

Abstract: The present invention recognizes that the determination of ion transport function or property using direct detection methods, such as patch-clamps, whole cell recording or single channel recording, are preferable to methods that utilize indirect detection methods, such as FRET based detection system. The present invention provides biochips and methods of use that allow for the direct analysis of ion transport function or property using microfabricated structures that can allow for automated detection of ion transport function or property. These biochips and methods of use thereof are particularly appropriate for automating the detection of ion transport function or property, particularly for screening purposes.

Abstract translation: 本发明认识到，利用间接检测方法（例如基于FRET的检测系统）的方法，优选使用直接检测方法（例如贴片钳，全细胞记录或单通道记录）的离子转运功能或性质的确定。 本发明提供了生物芯片和使用方法，其允许使用可以允许自动检测离子迁移功能或性质的微结构的直接分析离子转运功能或性质。 这些生物芯片及其使用方法特别适用于自动化离子迁移功能或性质的检测，特别是用于筛选目的。

公开(公告)号：US07939035B2

公开(公告)日：2011-05-10

申请号：US11661019

申请日：2004-11-22

Applicant: Renyuan Chen ,  Guoqing Wang ,  Feijun Xian ,  Wanli Xing ,  Xianhua Wang ,  Jing Cheng

Inventor： Renyuan Chen ,  Guoqing Wang ,  Feijun Xian ,  Wanli Xing ,  Xianhua Wang ,  Jing Cheng

IPC: B01D21/00 ,  B01L99/00

CPC classification number: G01N1/40 ,  G01N2001/2866

Abstract: The present invention provides a sample preparation device for extracting drug residue. It comprises a case, in which a water bath, a vortex mixer, and a homogenizer are integrated. The case also has on it an integrated control panel for controlling heating temperature of the water bath and homogenization time of the homogenizer.

Abstract translation: 本发明提供了用于提取药物残留物的样品制备装置。 它包括其中集成了水浴，涡流混合器和均化器的壳体。 该情况还具有用于控制水浴的加热温度和均化器的均化时间的集成控制面板。

公开(公告)号：US07928357B2

公开(公告)日：2011-04-19

申请号：US11795652

申请日：2005-06-02

Applicant: Xianhua Wang ,  Hui Zhu ,  Guoliang Huang ,  Jing Cheng

Inventor： Xianhua Wang ,  Hui Zhu ,  Guoliang Huang ,  Jing Cheng

IPC: H01J3/14 ,  H04N1/04 ,  G01N33/50 ,  F21V9/16

CPC classification number: G01N35/04 ,  G01N35/028

Abstract: The invention provides a scanning platform for high speed scanning of microarrays. The platform uses a novel flexible a metal strip/wheel linear driving system to convert rotary movement of motors into linear movement, thereby drives movement of a stage/microarray in the direction of scanning. The platform of the present invention provides high movement speed, high resolution, and low return deviation. It is also simple in structure and low in manufacturing cost.

Abstract translation: 本发明提供了用于微阵列高速扫描的扫描平台。 该平台使用新颖的柔性金属条/轮线性驱动系统将马达的旋转运动转换为直线运动，从而驱动载物台/微阵列沿扫描方向的移动。 本发明的平台提供高移动速度，高分辨率和低返回偏差。 结构简单，制造成本低。

公开(公告)号：US07875466B2

公开(公告)日：2011-01-25

申请号：US10567535

申请日：2003-08-13

Applicant: Huachang Lu ,  Guangshun Yi ,  Depu Chen ,  Lianghong Guo ,  Jing Cheng

Inventor： Huachang Lu ,  Guangshun Yi ,  Depu Chen ,  Lianghong Guo ,  Jing Cheng

IPC: G01N33/553 ,  G01N1/00

CPC classification number: B82Y15/00 ,  G01N33/54326 ,  G01N33/588 ,  Y10T428/2991

Abstract: This invention provides nanometer-sized fluorescent magnetic particles and processes of making them. The nanoparticle has a core particle comprising a magnetic material and a fluorescent material, and the particle size is less than about 1 micrometer. The nanoparticles can be coated with an inorganic or organic layer and can be surface-modified. The nanoparticles can be used in many biological assays.

Abstract translation: 本发明提供纳米级荧光磁性颗粒及其制备方法。 纳米颗粒具有包含磁性材料和荧光材料的核心颗粒，并且其粒径小于约1微米。 纳米颗粒可以用无机或有机层涂覆并且可以进行表面改性。 纳米颗粒可用于许多生物测定。

公开(公告)号：US07811768B2

公开(公告)日：2010-10-12

申请号：US09924428

申请日：2001-08-07

Applicant: Lei Wu ,  Xiaobo Wang ,  Guoliang Tao ,  Junquan Xu ,  Jing Cheng ,  Mingxiang Huang ,  Baoquan Sun ,  Wei Shao ,  Litian Liu ,  Depu Chen ,  David M. Rothwarf ,  Weiping Yang

Inventor： Lei Wu ,  Xiaobo Wang ,  Guoliang Tao ,  Junquan Xu ,  Jing Cheng ,  Mingxiang Huang ,  Baoquan Sun ,  Wei Shao ,  Litian Liu ,  Depu Chen ,  David M. Rothwarf ,  Weiping Yang

IPC: G01N33/53

CPC classification number: B82Y5/00 ,  B01J19/0046 ,  B01J2219/00457 ,  B01J2219/00468 ,  B01J2219/00497 ,  B01J2219/005 ,  B01J2219/00502 ,  B01J2219/0054 ,  B01J2219/00542 ,  B01J2219/00547 ,  B01J2219/00549 ,  B01J2219/00556 ,  B01J2219/00576 ,  B01J2219/00585 ,  B01J2219/0059 ,  B01J2219/00592 ,  B01J2219/00596 ,  B01J2219/00655 ,  B01J2219/00659 ,  B01J2219/00702 ,  B01J2219/00707 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01J2219/00729 ,  B01J2219/00731 ,  B01J2219/00734 ,  B01J2219/0074 ,  B01J2219/00743 ,  B01L3/5027 ,  B82Y10/00 ,  B82Y30/00 ,  C07B2200/11 ,  C07K1/047 ,  C40B40/06 ,  C40B40/10 ,  C40B40/12 ,  G01N33/54366 ,  G01N33/54386 ,  G06K19/06009 ,  G06K19/06037 ,  G06K19/06046 ,  G06K19/06131 ,  G06K19/06178 ,  G06K19/06196

Abstract: This invention relates generally to the field of moiety or molecule analysis, isolation, detection and manipulation and library synthesis. In particular, the invention provides a microdevice, which microdevice comprises: a) a substrate; and b) a photorecognizable coding pattern on the substrate. Preferably, the microdevice does not comprise an anodized metal surface layer. Methods and kits for isolating, detecting and manipulating moieties, and synthesizing libraries using the microdevices are also provided. The invention further provides two-dimensional optical encoders and uses thereof.

Abstract translation: 本发明一般涉及部分或分子分析，分离，检测和操作以及文库合成领域。 特别地，本发明提供了一种微型器件，该微型器件包括：a）衬底; 和b）在基底上的可识别的编码图案。 优选地，微器件不包括阳极化金属表面层。 还提供了用于分离，检测和操作部分以及使用微器件合成文库的方法和试剂盒。 本发明还提供二维光学编码器及其用途。