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公开(公告)号：US20110304042A1
公开(公告)日：2011-12-15
申请号：US12846260
申请日：2010-07-29
申请人： Jing-Cheng Lin , Ya-Hsi Hwung , Hsin-Yu Chen , Po-Hao Tsai , Yan-Fu Lin , Cheng-Lin Huang , Fang Wen Tsai , Wen-Chih Chiou
发明人： Jing-Cheng Lin , Ya-Hsi Hwung , Hsin-Yu Chen , Po-Hao Tsai , Yan-Fu Lin , Cheng-Lin Huang , Fang Wen Tsai , Wen-Chih Chiou
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/11 , H01L23/488 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05099 , H01L2224/05571 , H01L2224/05599 , H01L2224/10126 , H01L2224/10145 , H01L2224/1182 , H01L2224/11823 , H01L2224/1191 , H01L2224/13017 , H01L2224/13022 , H01L2224/13083 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13564 , H01L2224/13565 , H01L2224/1357 , H01L2224/13578 , H01L2224/13583 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2224/1369 , H01L2224/16058 , H01L2224/16148 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/81815 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/0002 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/37001 , H01L2924/00 , H01L2224/81 , H01L2224/16225 , H01L2924/00012 , H01L2224/16145 , H01L2924/00014 , H01L2924/01047 , H01L2224/05552 , H01L2224/81805
摘要： A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection layer includes a compound of copper and a polymer, and is a dielectric layer.
摘要翻译： 工件包括具有顶表面和侧壁的铜凸块。 在铜凸块的侧壁而不是顶表面上形成保护层。 保护层包括铜和聚合物的化合物，并且是介电层。
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公开(公告)号：US08922004B2
公开(公告)日：2014-12-30
申请号：US12846260
申请日：2010-07-29
申请人： Jing-Cheng Lin , Ya-Hsi Hwung , Hsin-Yu Chen , Po-Hao Tsai , Yan-Fu Lin , Cheng-Lin Huang , Fang Wen Tsai , Wen-Chih Chiou
发明人： Jing-Cheng Lin , Ya-Hsi Hwung , Hsin-Yu Chen , Po-Hao Tsai , Yan-Fu Lin , Cheng-Lin Huang , Fang Wen Tsai , Wen-Chih Chiou
IPC分类号： H01L23/48 , H01L23/488 , H01L23/00 , H01L25/065
CPC分类号： H01L24/11 , H01L23/488 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05099 , H01L2224/05571 , H01L2224/05599 , H01L2224/10126 , H01L2224/10145 , H01L2224/1182 , H01L2224/11823 , H01L2224/1191 , H01L2224/13017 , H01L2224/13022 , H01L2224/13083 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13564 , H01L2224/13565 , H01L2224/1357 , H01L2224/13578 , H01L2224/13583 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2224/1369 , H01L2224/16058 , H01L2224/16148 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/81815 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/0002 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/37001 , H01L2924/00 , H01L2224/81 , H01L2224/16225 , H01L2924/00012 , H01L2224/16145 , H01L2924/00014 , H01L2924/01047 , H01L2224/05552 , H01L2224/81805
摘要： A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection layer includes a compound of copper and a polymer, and is a dielectric layer.
摘要翻译： 工件包括具有顶表面和侧壁的铜凸块。 在铜凸块的侧壁而不是顶表面上形成保护层。 保护层包括铜和聚合物的化合物，并且是介电层。
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公开(公告)号：US08953336B2
公开(公告)日：2015-02-10
申请号：US13412958
申请日：2012-03-06
申请人： Chin-Fu Kao , Wen-Chih Chiou , Jing-Cheng Lin , Cheng-Lin Huang , Po-Hao Tsai
发明人： Chin-Fu Kao , Wen-Chih Chiou , Jing-Cheng Lin , Cheng-Lin Huang , Po-Hao Tsai
IPC分类号： H05K7/10
CPC分类号： H01L24/14 , H01L22/32 , H01L23/3192 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05647 , H01L2224/05655 , H01L2224/1146 , H01L2224/11849 , H01L2224/131 , H01L2224/13147 , H01L2224/1403 , H01L2224/141 , H01L2224/14515 , H01L2224/81191 , H01L2224/81192 , H01L2924/00012 , H01L2924/00014 , H01L2924/04941 , H01L2924/04953 , H01L2924/014
摘要： A surface metal wiring structure for a substrate includes one or more functional μbumps formed of a first metal and an electrical test pad formed of a second metal for receiving an electrical test probe and electrically connected to the one or more functional μbumps. The surface metal wiring structure also includes a plurality of sacrificial μbumps formed of the first metal that are electrically connected to the electrical test pads, where the sacrificial μbumps are positioned closer to the electrical test pad than the one or more functional μbumps.
摘要翻译： 用于基板的表面金属布线结构包括由第一金属形成的一个或多个功能性μ凸块和由用于接收电测试探针并电连接到所述一个或多个功能性μ凸起的第二金属形成的电测试垫。 表面金属布线结构还包括由第一金属形成的多个牺牲μ凸块，其电连接到电测试焊盘，其中牺牲μ凸块位于比一个或多个功能性μ凸块更靠近电测试垫的位置。
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公开(公告)号：US20130233601A1
公开(公告)日：2013-09-12
申请号：US13412958
申请日：2012-03-06
申请人： Chin-Fu KAO , Wen-Chih Chiou , Jing-Cheng Lin , Cheng-Lin Huang , Po-Hao Tsai
发明人： Chin-Fu KAO , Wen-Chih Chiou , Jing-Cheng Lin , Cheng-Lin Huang , Po-Hao Tsai
CPC分类号： H01L24/14 , H01L22/32 , H01L23/3192 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05647 , H01L2224/05655 , H01L2224/1146 , H01L2224/11849 , H01L2224/131 , H01L2224/13147 , H01L2224/1403 , H01L2224/141 , H01L2224/14515 , H01L2224/81191 , H01L2224/81192 , H01L2924/00012 , H01L2924/00014 , H01L2924/04941 , H01L2924/04953 , H01L2924/014
摘要： A surface metal wiring structure for a substrate includes one or more functional μbumps formed of a first metal and an electrical test pad formed of a second metal for receiving an electrical test probe and electrically connected to the one or more functional μbumps. The surface metal wiring structure also includes a plurality of sacrificial μbumps formed of the first metal that are electrically connected to the electrical test pads, where the sacrificial μbumps are positioned closer to the electrical test pad than the one or more functional μbumps.
摘要翻译： 用于基板的表面金属布线结构包括由第一金属形成的一个或多个功能性微片和由用于接收电测试探针的第二金属形成的电测试焊盘，并电连接到所述一个或多个功能性微波。 表面金属布线结构还包括多个由第一金属形成的牺牲片，其电连接到电测试焊盘，其中牺牲微片比一个或多个功能性微片更靠近电测试垫定位。
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公开(公告)号：US08816498B2
公开(公告)日：2014-08-26
申请号：US13189127
申请日：2011-07-22
申请人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
发明人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
IPC分类号： H01L23/485 , H01L21/768
摘要： A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.
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公开(公告)号：US09024438B2
公开(公告)日：2015-05-05
申请号：US13192756
申请日：2011-07-28
申请人： Cheng-Lin Huang , I-Ting Chen , Ying Ching Shih , Po-Hao Tsai , Szu Wei Lu , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu
发明人： Cheng-Lin Huang , I-Ting Chen , Ying Ching Shih , Po-Hao Tsai , Szu Wei Lu , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu
IPC分类号： H01L23/498 , H01L21/60 , H01L23/00
CPC分类号： H01L24/14 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/17 , H01L24/81 , H01L2224/0346 , H01L2224/03912 , H01L2224/0401 , H01L2224/1146 , H01L2224/11462 , H01L2224/11472 , H01L2224/1161 , H01L2224/11622 , H01L2224/13011 , H01L2224/13014 , H01L2224/13078 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1403 , H01L2224/1405 , H01L2224/14051 , H01L2224/145 , H01L2224/16238 , H01L2224/17107 , H01L2224/81141 , H01L2224/81193 , H01L2224/81815 , H01L2224/81897 , H01L2924/1305 , H01L2924/1306 , H01L2924/00014 , H01L2924/01047 , H01L2924/01082 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/01053 , H01L2924/01079 , H01L2924/01051 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A conductive bump structure of a semiconductor device comprises a substrate comprising a major surface and conductive bumps distributed over the major surface of the substrate. Each of a first subset of the conductive bumps comprises a regular body, and each of a second subset of the conductive bumps comprises a ring-shaped body.
摘要翻译： 半导体器件的导电凸块结构包括包括主表面的衬底和分布在衬底的主表面上的导电凸块。 导电凸块的第一子集中的每一个包括规则体，并且导电凸块的第二子集中的每一个包括环形体。
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公开(公告)号：US20130020698A1
公开(公告)日：2013-01-24
申请号：US13189127
申请日：2011-07-22
申请人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
发明人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
IPC分类号： H01L23/485 , H01L21/768
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/1132 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11474 , H01L2224/1148 , H01L2224/11616 , H01L2224/11825 , H01L2224/11849 , H01L2224/1191 , H01L2224/13013 , H01L2224/13015 , H01L2224/13018 , H01L2224/13019 , H01L2224/13022 , H01L2224/13023 , H01L2224/13025 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1362 , H01L2224/13655 , H01L2224/13671 , H01L2224/13672 , H01L2224/16056 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/81121 , H01L2224/81143 , H01L2224/81193 , H01L2224/81815 , H01L2225/06513 , H01L2225/06555 , H01L2225/06565 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/0105 , H01L2924/01079 , H01L2924/12 , H01L2924/14 , H01L2924/3512 , H01L2924/35121 , H01L2924/384 , H01L2924/3841 , H01L2924/00014
摘要： A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.
摘要翻译： 提供了一种用于导电柱的系统和方法。 一个实施例包括具有位于其外边缘周围的沟槽的导电柱。 当在导电柱上形成导电凸块时，沟槽用于引导诸如焊料的导电材料。 导电柱然后可以通过导电材料电连接到另一接触件。
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公开(公告)号：US20120306080A1
公开(公告)日：2012-12-06
申请号：US13298046
申请日：2011-11-16
申请人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
发明人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
IPC分类号： H01L23/52
CPC分类号： H01L24/11 , H01L23/147 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/04 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05073 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05666 , H01L2224/05681 , H01L2224/05686 , H01L2224/10145 , H01L2224/10156 , H01L2224/1146 , H01L2224/1147 , H01L2224/1182 , H01L2224/11831 , H01L2224/13017 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/13578 , H01L2224/13686 , H01L2224/16058 , H01L2224/16145 , H01L2224/81193 , H01L2224/81815 , H01L2924/01322 , H01L2924/01327 , H01L2924/3651 , H01L2924/3841 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/01047 , H01L2924/049 , H01L2924/053 , H01L2924/00
摘要： A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.
摘要翻译： 封装组件不含其中的有源器件。 封装部件包括衬底，衬底中的通孔，衬底上的顶部电介质层和在顶部电介质层的顶表面上方具有顶表面的金属柱。 金属柱电连接到通孔。 扩散阻挡层在金属支柱的上表面之上。 焊料帽设置在扩散阻挡层上。
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公开(公告)号：US08664760B2
公开(公告)日：2014-03-04
申请号：US13343582
申请日：2012-01-04
申请人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Cheng-Chieh Hsieh , Kuo-Ching Hsu , Ying-Ching Shih , Po-Hao Tsai , Chin-Fu Kao , Cheng-Lin Huang , Jing-Cheng Lin
发明人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Cheng-Chieh Hsieh , Kuo-Ching Hsu , Ying-Ching Shih , Po-Hao Tsai , Chin-Fu Kao , Cheng-Lin Huang , Jing-Cheng Lin
CPC分类号： H01L24/11 , H01L23/147 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/04 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05073 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05666 , H01L2224/05681 , H01L2224/05686 , H01L2224/10145 , H01L2224/10156 , H01L2224/1146 , H01L2224/1147 , H01L2224/1182 , H01L2224/11831 , H01L2224/13017 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/13578 , H01L2224/13686 , H01L2224/16058 , H01L2224/16145 , H01L2224/81193 , H01L2224/81815 , H01L2924/01322 , H01L2924/01327 , H01L2924/3651 , H01L2924/3841 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/01047 , H01L2924/049 , H01L2924/053 , H01L2924/00
摘要： A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar.
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公开(公告)号：US08610285B2
公开(公告)日：2013-12-17
申请号：US13298046
申请日：2011-11-16
申请人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
发明人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
IPC分类号： H01L23/498 , H01L21/768 , H01L23/48 , H01L29/40
CPC分类号： H01L24/11 , H01L23/147 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/04 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05073 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05666 , H01L2224/05681 , H01L2224/05686 , H01L2224/10145 , H01L2224/10156 , H01L2224/1146 , H01L2224/1147 , H01L2224/1182 , H01L2224/11831 , H01L2224/13017 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/13578 , H01L2224/13686 , H01L2224/16058 , H01L2224/16145 , H01L2224/81193 , H01L2224/81815 , H01L2924/01322 , H01L2924/01327 , H01L2924/3651 , H01L2924/3841 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/01047 , H01L2924/049 , H01L2924/053 , H01L2924/00
摘要： A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.
摘要翻译： 封装组件不含其中的有源器件。 封装部件包括衬底，衬底中的通孔，衬底上的顶部电介质层，以及在顶部电介质层的顶表面上方具有顶表面的金属柱。 金属柱电连接到通孔。 扩散阻挡层在金属支柱的上表面之上。 焊料帽设置在扩散阻挡层上。
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