公开(公告)号：US20140369014A1

公开(公告)日：2014-12-18

申请号：US14363208

申请日：2012-08-22

Applicant: Yusuke Takagi

Inventor： Yusuke Takagi

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/05

CPC classification number: H05K1/183 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/182 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/09972 ,  H05K2201/10439 ,  H05K2203/0169 ,  H05K2203/0323

Abstract: A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.

Abstract translation: 布线板包括作为金属芯基板的基底基板，并且包括其中将要安装作为电气部件或电子部件的内部部件的开口，以及端子放置部，其内部部件的端子 将要安装的端子放置部分围绕基底基板的开口形成，并且从基底基板的表面向内凹入，使得内部部件的一部分被放置在开口内。

公开(公告)号：US20140355220A1

公开(公告)日：2014-12-04

申请号：US14464006

申请日：2014-08-20

Applicant: Ambianti B.V.

Inventor： Georgios Metaxas

IPC: H05K1/02

CPC classification number: H05K1/0292 ,  G06F3/1446 ,  G09G3/20 ,  G09G3/2085 ,  G09G3/2088 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2310/0278 ,  G09G2310/0281 ,  G09G2330/08 ,  G09G2340/0492 ,  G09G2360/141 ,  G09G2370/18 ,  H05K1/0286 ,  H05K3/0052 ,  H05K2201/09972 ,  H05K2201/10507

Abstract: A panel of rectangular shape comprising a plurality of electric devices spread over the panel, a control unit including a microprocessor and a power supply, drivers for driving the electric devices based on control information received from the control unit and electric wiring connecting the control unit, the drivers and the electric devices, the shape of the panel being adaptable by removing one or more parts of the panel by cutting, sawing, milling, drilling or other suitable methods, wherein the control unit and the drivers are positioned closer to a first side of the panel than to a second side opposite the first side. The drivers and electric devices are partitioned into groups that each comprises one driver that exclusively drives the electric devices in that group.

Abstract translation: 一种矩形形状的面板，包括分布在面板上的多个电气设备，包括微处理器和电源的控制单元，基于从控制单元接收的控制信息和连接控制单元的电线驱动电气设备的驱动器， 驱动器和电气设备，通过切割，锯切，铣削，钻孔或其它合适的方法来移除面板的一个或多个部分来适应面板的形状，其中控制单元和驱动器位于更靠近第一侧 与第一侧相对的第二侧。 驱动器和电气设备被分成组，每个组包括专门驱动该组中的电气设备的一个驱动器。

公开(公告)号：US08897028B2

公开(公告)日：2014-11-25

申请号：US13156496

申请日：2011-06-09

Applicant: Tadaji Takemura

Inventor： Tadaji Takemura

IPC: H05K7/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L25/16 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14 ,  H05K7/18 ,  H05K1/11 ,  H05K1/14 ,  H05K9/00 ,  H01L23/28 ,  H01L25/065 ,  H05K3/28

CPC classification number: H01L23/3121 ,  H01L23/49811 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0216 ,  H05K3/284 ,  H05K9/0039 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.

Abstract translation: 在电路模块中，导电隔板由设置在部件安装表面上的多个导电芯片限定。 部件安装表面由导电隔板分成第一块和第二块。 通过改变导电芯片的位置和导电芯片的数量，可以根据电路板的尺寸和第一块和第二块中的电子部件的布置自由地改变导电隔板的形状。 通过导电隔板防止第一块和第二块之间的电磁干扰。

公开(公告)号：US08876356B2

公开(公告)日：2014-11-04

申请号：US13421110

申请日：2012-03-15

Applicant: Koichi Yamamoto

Inventor： Koichi Yamamoto

IPC: F21V23/06 ,  G02F1/1335 ,  F21V23/00 ,  F21V8/00 ,  H05K1/02 ,  H05K3/00

CPC classification number: G02B6/0083 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/009 ,  G02F1/133615 ,  G02F2001/133628 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0296 ,  H05K3/0061 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: An illumination device including: a support member accommodating therein a light guiding plate, and having a board placement space in a region where being along a longitudinal direction of an end surface of the light guiding plate, and extending from the end surface side of the light guiding plate to a back surface side thereof; and a light source circuit unit including a bendable circuit board including first and second regions, the first region including light emitting chips, and the second region being formed with a densely-packed portion of a wiring pattern of the light emitting chips. The light source circuit unit is placed in the board placement space after being bent to allow the light emitting chips to face the end surface of the light guiding plate, and to allow the densely-packed portion of the wiring pattern to come on the back surface side of the light guiding plate.

Abstract translation: 一种照明装置，包括：支撑部件，其容纳有导光板，并且在沿着所述导光板的端面的长度方向的区域中具有基板放置空间，并且从所述光的端面侧延伸 引导板到其背面侧; 以及光源电路单元，其包括具有第一和第二区域的可弯曲电路板，所述第一区域包括发光芯片，并且所述第二区域形成有所述发光芯片的布线图案的密集部分。 光源电路单元弯曲后放置在板放置空间中，以使发光芯片面对导光板的端面，并且允许布线图案的密集部分进入背面 一侧的导光板。

公开(公告)号：US08823174B2

公开(公告)日：2014-09-02

申请号：US14108960

申请日：2013-12-17

Applicant: Renesas Electronics Corporation

Inventor： Yoichiro Kurita ,  Masaya Kawano ,  Koji Soejima

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498 ,  H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L21/4763

CPC classification number: H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/02 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2221/68372 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/02333 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/16137 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/18161 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/0058 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09972 ,  H05K2203/016 ,  H05K2203/0733 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

公开(公告)号：US08811029B2

公开(公告)日：2014-08-19

申请号：US13326332

申请日：2011-12-15

Applicant: Keng-Yi Lee ,  Shih-Yao Lin

Inventor： Keng-Yi Lee ,  Shih-Yao Lin

IPC: H05K7/00 ,  H05K1/16 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/16 ,  H05K1/0243 ,  H05K1/147 ,  H05K2201/09972

Abstract: An integrated circuit board includes a substrate, a plurality of electronic components and at least one antenna. The substrate has a central area and two edge areas, wherein the central area is between the two edge areas. The electronic components are disposed on the central area. The antenna is disposed on at least one of the two edge areas, wherein there is predetermined distance between the antenna and the electronic components.

Abstract translation: 集成电路板包括基板，多个电子部件和至少一个天线。 基板具有中心区域和两个边缘区域，其中中心区域在两个边缘区域之间。 电子部件设置在中央区域。 天线设置在两个边缘区域中的至少一个上，其中在天线和电子部件之间存在预定的距离。

公开(公告)号：US08717766B2

公开(公告)日：2014-05-06

申请号：US13326531

申请日：2011-12-15

Applicant: Fumiaki Arimai ,  Hiroyoshi Nishizaki ,  Shozo Kanzaki

Inventor： Fumiaki Arimai ,  Hiroyoshi Nishizaki ,  Shozo Kanzaki

IPC: H05K7/20

CPC classification number: H01L25/165 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49531 ,  H01L23/49575 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/09972 ,  H05K2201/10924 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A resin-sealed electronic controller obtained by bonding and fixing a circuit board to a thermally-conductive base plate, and integrating circuit components with a molding resin so as to reduce the size. A base plate includes a first exposed portion, a second exposed portion, and an adjacent flat portion adjacent to a central window hole. First circuit components which are low-heat-generating components with large height are located in the central window hole. Second circuit components which are high-heat-generating components with small height are provided on an area corresponding to the adjacent flat portion. A height dimension of the first circuit components at least partially overlaps a thickness dimension of the base plate, to reduce a total thickness dimension. The high-heat-generating components and the low-heat-generating components being provided separately from each other permits increased mounting density of low-heat-generating components, reducing an area of the circuit board.

Abstract translation: 一种树脂密封电子控制器，其通过将电路板接合并固定到导热基板，并将电路部件与模制树脂集成以减小尺寸而获得。 基板包括第一暴露部分，第二暴露部分和与中心窗孔相邻的相邻平坦部分。 作为具有高高度的低发热部件的第一电路部件位于中心窗孔中。 在与相邻的平坦部分对应的区域上设置有具有小高度的高发热部件的第二电路部件。 第一电路部件的高度尺寸至少部分地与基板的厚度尺寸重叠，以减小总厚度尺寸。 彼此分开设置的高发热部件和低发热部件允许增加低发热部件的安装密度，减小电路板的面积。

公开(公告)号：US20140117565A1

公开(公告)日：2014-05-01

申请号：US14150795

申请日：2014-01-09

Applicant: Infineon Technologies AG

Inventor： Henrik Ewe ,  Joachim Mahler ,  Anton Prueckl ,  Stefan Landau

IPC: H01L23/48

CPC classification number: H01L23/481 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/18 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/0557 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/05 ,  H05K1/185 ,  H05K1/188 ,  H05K3/4644 ,  H05K2201/09745 ,  H05K2201/09972 ,  H05K2203/0353 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.

Abstract translation: 公开了一种制造层压电子装置的方法。 一个实施例提供载体，载体限定第一主表面和与第一主表面相对的第二主表面。 载体具有形成在第一主表面中的凹陷图案。 第一半导体芯片附接在第一和第二主表面之一上。 覆盖在其上附着有第一半导体芯片的载体的主表面上的第一绝缘层和形成第一半导体芯片。 然后沿着凹槽图案将载体分离成多个部分。

公开(公告)号：US20140091337A1

公开(公告)日：2014-04-03

申请号：US14096570

申请日：2013-12-04

Applicant: NITTO DENKO CORPORATION

Inventor： Yasunari OOYABU ,  Yoshihiko KITAYAMA ,  Munehisa MITANI

IPC: H01L33/52 ,  H01L27/15

CPC classification number: H01L33/52 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/09709 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2203/1311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device assembly includes a substrate, an optical semiconductor element mounted on the surface of the substrate, an encapsulating layer formed on the substrate surface to encapsulate the optical semiconductor element, and an electrode formed on the substrate surface to be electrically connected to the optical semiconductor element. On the substrate, only an encapsulating region and an electrode region are formed, the encapsulating region including the optical semiconductor element and being defined by the encapsulating layer, and the electrode region being defined by the electrode exposed from the encapsulating layer.

Abstract translation: 发光装置组件包括基板，安装在基板的表面上的光半导体元件，形成在基板表面上以封装光半导体元件的封装层，以及形成在基板表面上以电连接到 光半导体元件。 在基板上仅形成封装区域和电极区域，该封装区域包括光学半导体元件并由封装层限定，并且电极区域由从封装层露出的电极限定。

公开(公告)号：US20140085834A1

公开(公告)日：2014-03-27

申请号：US14092054

申请日：2013-11-27

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Keishi KATO ,  Osamu TABATA ,  Yoshio OKAYAMA ,  Ryosuke USUI

IPC: H05K1/05

CPC classification number: H05K1/053 ,  H01L23/13 ,  H01L23/142 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1435 ,  H01L2924/1438 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/0216 ,  H05K2201/09972 ,  H05K2201/10166 ,  H05K2203/0315 ,  H05K2203/0323 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In the upper surface of a metallic substrate, a region near the central part of the metallic substrate is surrounded by a rectangle having dotted sides electrically separate the interior and exterior of the rectangle. Each dot of the sides is formed of a pillared insulating resin that penetrates from the upper surface to the lower surface of the metallic substrate. Oxide films are so formed as to fill in the spaces between adjacent cylinders of insulating resins and the surrounding of the cylinders. That is, a separation layer is formed of the pillared insulating resins and the oxide films that fill up the spaces between the pillared insulating resins as well as their vicinities.

Abstract translation: 在金属基板的上表面，靠近金属基板的中心部分的区域由具有虚线的矩形围绕，矩形的内部和外部电气分离。 侧面的每个点由从金属基板的上表面到下表面贯穿的柱状绝缘树脂形成。 氧化膜被形成为填充绝缘树脂的相邻气缸和气缸周围之间的空间。 也就是说，分离层由柱状绝缘树脂和填充柱状绝缘树脂之间的空间及其附近的氧化物膜形成。