公开(公告)号：US08963334B2

公开(公告)日：2015-02-24

申请号：US13221447

申请日：2011-08-30

Applicant: Jing-Cheng Lin ,  Szu Wei Lu ,  Ying-Ching Shih ,  Ying-Da Wang ,  Li-Chung Kuo ,  Long Hua Lee ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Jing-Cheng Lin ,  Szu Wei Lu ,  Ying-Ching Shih ,  Ying-Da Wang ,  Li-Chung Kuo ,  Long Hua Lee ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/498 ,  H01L25/065 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L21/768 ,  H01L21/56 ,  H01L23/58

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/06181 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: An embodiment is a structure comprising a substrate, a first die, and a second die. The substrate has a first surface and a second surface opposite the first surface. The substrate has a through substrate via extending from the first surface towards the second surface. The first die is attached to the substrate, and the first die is coupled to the first surface of the substrate. The second die is attached to the substrate, and the second die is coupled to the first surface of the substrate. A first distance is between a first edge of the first die and a first edge of the second die, and the first distance is in a direction parallel to the first surface of the substrate. The first distance is equal to or less than 200 micrometers.

Abstract translation: 实施例是包括基板，第一模具和第二模具的结构。 衬底具有与第一表面相对的第一表面和第二表面。 衬底具有从第一表面延伸到第二表面的通孔衬底。 第一裸片附着在基片上，第一裸片耦合到基片的第一表面。 第二管芯附接到衬底，并且第二管芯耦合到衬底的第一表面。 第一距离在第一管芯的第一边缘和第二管芯的第一边缘之间，并且第一距离在与基板的第一表面平行的方向上。 第一距离等于或小于200微米。

公开(公告)号：US08426961B2

公开(公告)日：2013-04-23

申请号：US12823851

申请日：2010-06-25

Applicant: Ying-Ching Shih ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Ying-Ching Shih ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L21/76885 ,  H01L21/486 ,  H01L21/56 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/11002 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/181 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/4007 ,  H05K2203/016 ,  H05K2203/025 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/16145 ,  H01L2924/00012

Abstract: A device includes an interposer, which includes a substrate; and at least one dielectric layer over the substrate. A plurality of through-substrate vias (TSVs) penetrate through the substrate. A first metal bump is in the at least one dielectric layer and electrically coupled to the plurality of TSVs. A second metal bump is over the at least one dielectric layer. A die is embedded in the at least one dielectric layer and bonded to the first metal bump.

Abstract translation: 一种装置包括：插入件，其包括基板; 以及衬底上的至少一个电介质层。 多个穿通基板通孔（TSV）穿透基板。 第一金属凸块在至少一个电介质层中并电耦合到多个TSV。 第二金属凸块在至少一个电介质层的上方。 模具嵌入在至少一个电介质层中并结合到第一金属凸块。

公开(公告)号：US20130049216A1

公开(公告)日：2013-02-28

申请号：US13221447

申请日：2011-08-30

Applicant: Jing-Cheng Lin ,  Szu Wei Lu ,  Ying-Ching Shih ,  Ying-Da Wang ,  Li-Chung Kuo ,  Long Hua Lee ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Jing-Cheng Lin ,  Szu Wei Lu ,  Ying-Ching Shih ,  Ying-Da Wang ,  Li-Chung Kuo ,  Long Hua Lee ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/498 ,  H01L21/50

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/06181 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: An embodiment is a structure comprising a substrate, a first die, and a second die. The substrate has a first surface and a second surface opposite the first surface. The substrate has a through substrate via extending from the first surface towards the second surface. The first die is attached to the substrate, and the first die is coupled to the first surface of the substrate. The second die is attached to the substrate, and the second die is coupled to the first surface of the substrate. A first distance is between a first edge of the first die and a first edge of the second die, and the first distance is in a direction parallel to the first surface of the substrate. The first distance is equal to or less than 200 micrometers.

公开(公告)号：US08846499B2

公开(公告)日：2014-09-30

申请号：US12858211

申请日：2010-08-17

Applicant: Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L21/30

CPC classification number: G07F17/3213 ,  B32B17/10 ,  B32B37/1207 ,  B32B37/182 ,  B32B37/185 ,  B32B2457/14 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A composite carrier structure for manufacturing semiconductor devices is provided. The composite carrier structure utilizes multiple carrier substrates, e.g., glass or silicon substrates, coupled together by interposed adhesive layers. The composite carrier structure may be attached to a wafer or a die for, e.g., backside processing, such as thinning processes. In an embodiment, the composite carrier structure comprises a first carrier substrate having through-substrate vias formed therethrough. The first substrate is attached to a second substrate using an adhesive such that the adhesive may extend into the through-substrate vias.

Abstract translation: 提供了一种用于制造半导体器件的复合载体结构。 复合载体结构利用多个载体衬底，例如玻璃或硅衬底，通过插入的粘合剂层耦合在一起。 复合载体结构可以附接到晶片或模具，用于例如背面处理，例如变薄处理。 在一个实施例中，复合载体结构包括具有贯穿其中形成的贯通基板通孔的第一载体基板。 使用粘合剂将第一衬底附接到第二衬底，使得粘合剂可以延伸到贯穿衬底通孔中。

公开(公告)号：US20130199577A1

公开(公告)日：2013-08-08

申请号：US13369138

申请日：2012-02-08

Applicant: I-Ting Chen ,  Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

Inventor： I-Ting Chen ,  Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

IPC: B08B7/04 ,  B08B5/00 ,  B08B3/08 ,  B08B3/02 ,  B08B3/12

CPC classification number: H01L21/02041 ,  H01L21/4864 ,  H01L21/67028 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A flux residue cleaning system includes first and second immersion chambers, first and second spray chambers, and a drying chamber. The first immersion chamber softens an outer region of a flux residue formed around microbumps interposed between a wafer and a die when the wafer is immersed in a first chemical. The first spray chamber removes the outer region of the flux residue when the wafer is impinged upon by a first chemical spray in order to expose an inner region of the flux residue. The second immersion chamber softens the inner region of the flux residue when the wafer is immersed in a second chemical. The second spray chamber removes the inner region of the flux residue when the wafer is impinged upon by a second chemical spray in order to clean the wafer to a predetermined standard. The drying chamber dries the wafer.

Abstract translation: 助焊剂残渣清洁系统包括第一和第二浸没室，第一和第二喷雾室以及干燥室。 当晶片浸入第一化学品中时，第一浸入室软化在介于晶片和管芯之间的微胶片周围形成的焊剂残余物的外部区域。 当晶片通过第一化学喷雾冲击以便暴露焊剂残余物的内部区域时，第一喷雾室除去焊剂残余物的外部区域。 当晶片浸入第二种化学品中时，第二浸入室软化助焊剂残余物的内部区域。 当晶片被第二化学喷雾冲击时，第二喷雾室去除焊剂残余物的内部区域，以便将晶​​片清洁至预定的标准。 干燥室干燥晶片。

公开(公告)号：US20130026620A1

公开(公告)日：2013-01-31

申请号：US13192756

申请日：2011-07-28

Applicant: Cheng-Lin HUANG ,  I-Ting CHEN ,  Ying Ching SHIH ,  Po-Hao TSAI ,  Szu Wei LU ,  Jing-Cheng LIN ,  Shin-Puu JENG ,  Chen-Hua YU

Inventor： Cheng-Lin HUANG ,  I-Ting CHEN ,  Ying Ching SHIH ,  Po-Hao TSAI ,  Szu Wei LU ,  Jing-Cheng LIN ,  Shin-Puu JENG ,  Chen-Hua YU

IPC: H01L23/498 ,  H01L21/60

CPC classification number: H01L24/14 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0346 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/13078 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/1405 ,  H01L2224/14051 ,  H01L2224/145 ,  H01L2224/16238 ,  H01L2224/17107 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81897 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01053 ,  H01L2924/01079 ,  H01L2924/01051 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The disclosure relates to a conductive bump structure of a semiconductor device. An exemplary structure for a semiconductor device comprises a substrate comprising a major surface and conductive bumps distributed over the major surface of the substrate. Each of a first subset of the conductive bumps comprise a regular body, and each of a second subset of the conductive bumps comprise a ring-shaped body.

Abstract translation: 本发明涉及半导体器件的导电凸块结构。 半导体器件的示例性结构包括包括主表面的衬底和分布在衬底的主表面上的导电凸块。 导电凸块的第一子集中的每一个包括规则体，并且导电凸块的第二子集中的每一个包括环形体。

公开(公告)号：US20110316147A1

公开(公告)日：2011-12-29

申请号：US12823851

申请日：2010-06-25

Applicant: Ying-Ching Shih ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Ying-Ching Shih ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/488

CPC classification number: H01L21/76885 ,  H01L21/486 ,  H01L21/56 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/11002 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/181 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/4007 ,  H05K2203/016 ,  H05K2203/025 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/16145 ,  H01L2924/00012

Abstract: A device includes an interposer, which includes a substrate; and at least one dielectric layer over the substrate. A plurality of through-substrate vias (TSVs) penetrate through the substrate. A first metal bump is in the at least one dielectric layer and electrically coupled to the plurality of TSVs. A second metal bump is over the at least one dielectric layer. A die is embedded in the at least one dielectric layer and bonded to the first metal bump.

Abstract translation: 一种装置包括：插入件，其包括基板; 以及衬底上的至少一个电介质层。 多个穿通基板通孔（TSV）穿透基板。 第一金属凸块在至少一个电介质层中并电耦合到多个TSV。 第二金属凸块在至少一个电介质层的上方。 模具嵌入在至少一个电介质层中并结合到第一金属凸块。

公开(公告)号：US20060088255A1

公开(公告)日：2006-04-27

申请号：US10971462

申请日：2004-10-22

Applicant: Enboa Wu ,  Ying-Ching Shih

Inventor： Enboa Wu ,  Ying-Ching Shih

IPC: G02B6/42

CPC classification number: G02B6/4215 ,  G02B6/29361 ,  G02B6/2938 ,  G02B6/4204

Abstract: Disclosed is an optical transceiver subassembly module for multiplexing and demultiplexing a plurality of channels of different wavelengths. The optical subassembly module includes a transmitter optical subassembly (TOSA) and a receiver optical subassembly (ROSA). For a TOSA, the optical signals emitted by four laser diodes of different wavelengths are combined into a multiplexed optical signal, through respective thin film filters and lenses, which is then coupled onto an optical fiber after passing through a focusing lens. For a ROSA, the input optical signal on the receiver end of the optical fiber is separated into multiple optical wavelength signals, through respective thin film filters and lenses, which are then registered by respective photo detectors. This optical subassembly module with compact star-shaped optics design, active and passive alignments is able to attain high coupling efficiency between optical signals and the optical fiber.

Abstract translation: 公开了一种用于对多个不同波长的信道进行复用和解复用的光收发器子组件模块。 光学子组件模块包括发射机光学子组件（TOSA）和接收机光学子组件（ROSA）。 对于TOSA，由不同波长的四个激光二极管发射的光信号通过相应的薄膜滤光器和透镜组合成复用光信号，然后通过聚焦透镜耦合到光纤上。 对于ROSA，光纤的接收端上的输入光信号通过相应的薄膜滤光器和透镜分离成多个光波长信号，然后由相应的光电检测器记录。 这种具有紧凑的星形光学设计，有源和无源对准的光学子组件模块能够实现光信号和光纤之间的高耦合效率。

公开(公告)号：US20120306080A1

公开(公告)日：2012-12-06

申请号：US13298046

申请日：2011-11-16

Applicant: Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

Inventor： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

IPC: H01L23/52

CPC classification number: H01L24/11 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/04 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10145 ,  H01L2224/10156 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11831 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13686 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01047 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2924/00

Abstract: A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.

Abstract translation: 封装组件不含其中的有源器件。 封装部件包括衬底，衬底中的通孔，衬底上的顶部电介质层和在顶部电介质层的顶表面上方具有顶表面的金属柱。 金属柱电连接到通孔。 扩散阻挡层在金属支柱的上表面之上。 焊料帽设置在扩散阻挡层上。

公开(公告)号：US20120045611A1

公开(公告)日：2012-02-23

申请号：US12858211

申请日：2010-08-17

Applicant: Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/12 ,  B32B3/24 ,  B32B3/26 ,  B32B38/10 ,  H01L21/50 ,  B32B37/02 ,  B32B37/12 ,  B32B17/06 ,  B32B7/12

CPC classification number: G07F17/3213 ,  B32B17/10 ,  B32B37/1207 ,  B32B37/182 ,  B32B37/185 ,  B32B2457/14 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A composite carrier structure for manufacturing semiconductor devices is provided. The composite carrier structure utilizes multiple carrier substrates, e.g., glass or silicon substrates, coupled together by interposed adhesive layers. The composite carrier structure may be attached to a wafer or a die for, e.g., backside processing, such as thinning processes. In an embodiment, the composite carrier structure comprises a first carrier substrate having through-substrate vias formed therethrough. The first substrate is attached to a second substrate using an adhesive such that the adhesive may extend into the through-substrate vias.

Abstract translation: 提供了一种用于制造半导体器件的复合载体结构。 复合载体结构利用多个载体衬底，例如玻璃或硅衬底，通过插入的粘合剂层耦合在一起。 复合载体结构可以附接到晶片或模具，用于例如背面处理，例如变薄处理。 在一个实施例中，复合载体结构包括具有贯穿其中形成的贯通基板通孔的第一载体基板。 使用粘合剂将第一衬底附接到第二衬底，使得粘合剂可以延伸到贯穿衬底通孔中。