公开(公告)号：US09113571B2

公开(公告)日：2015-08-18

申请号：US13920375

申请日：2013-06-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hideo Nakagoshi ,  Yoichi Takagi ,  Nobuaki Ogawa ,  Hidekiyo Takaoka ,  Kosuke Nakano

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/36 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/284 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10477 ,  H01L2924/00

Abstract: In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more.

Abstract translation: 在导电性接地部和连接端子部件之间的接合部分中，至少具有Cu-Sn系，M-Sn系（M表示Ni和/或Mn）以及Cu 制造的M-Sn系金属间化合物被配置成存在于连接端子部件侧。 在该金属间化合物的制造区域中，当将接合部分的横截面在长度方向和横向方向等同地限定为10个盒子以总共限定100个盒子时，每个盒子的至少两个 具有不同组成元素的金属间化合物的类型存在于除了盒中除了仅存在Sn基金属成分之外的盒子总数的约70％以上。

公开(公告)号：US20150034701A1

公开(公告)日：2015-02-05

申请号：US14477957

申请日：2014-09-05

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Hidekiyo Takaoka ,  Kosuke Nakano ,  Yutaka Ota ,  Kenichi Kawasaki

IPC: H01G2/10 ,  H01G4/008 ,  B23K1/00 ,  H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H01G4/012

CPC classification number: H01G2/106 ,  B23K1/0016 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30

Abstract: An electronic part including an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and an antioxidant film formed on the outer side of the alloy layer. The antioxidant film is one of a Sn-containing film, a noble metal film, and an organic substance film.

Abstract translation: 一种电子部件，包括电子部件主体和电子部件主体的表面上的外部电极。 外部电极包括选自Cu-Ni合金层和Cu-Mn合金层中的至少一种合金层，以及形成在合金层的外侧的抗氧化膜。 抗氧化膜是含Sn的膜，贵金属膜和有机物质膜之一。

公开(公告)号：US10413992B2

公开(公告)日：2019-09-17

申请号：US15183105

申请日：2016-06-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi Ishino ,  Yoshihiro Kawaguchi ,  Kosuke Nakano ,  Hidekiyo Takaoka ,  Wataru Yanase

IPC: B23K31/02 ,  B23K20/02 ,  B23K1/00 ,  B23K20/00 ,  B23K35/30 ,  B23K35/36 ,  C21D9/50

Abstract: A first structural material is bonded to a second structural material with a joining material provided with a mixed layer of a raw-material component for forming an intermetallic compound layer and a resin component that softens and flows during heat treatment interposed therebetween to form bonded structural materials. When the bonded structural materials are heat-treated, the first structural material is joined to the second structural material with an intermetallic compound layer, and the resin component exudes and covers the lateral circumferential (exposed) portion of the intermetallic compound layer with a resin film.

公开(公告)号：US20180369951A1

公开(公告)日：2018-12-27

申请号：US16120522

申请日：2018-09-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi Ishino ,  Yoshihiro Kawaguchi ,  Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K20/02 ,  C22C1/04 ,  B22F1/00 ,  B22F7/06 ,  B23P6/00 ,  B23K35/30 ,  B23K35/02 ,  B23K35/00 ,  B23K20/233 ,  B23K20/227 ,  B23K20/16 ,  B23K3/06 ,  B23K1/00 ,  B23K103/04 ,  B23K101/06 ,  B23K101/10 ,  B23K101/18

Abstract: A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally joined with a layer of an intermetallic compound and an alloy having a melting point higher than a melting point of either of the first metal or the second metal.

公开(公告)号：US09691546B2

公开(公告)日：2017-06-27

申请号：US14477957

申请日：2014-09-05

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Hidekiyo Takaoka ,  Kosuke Nakano ,  Yutaka Ota ,  Kenichi Kawasaki

IPC: H01G4/228 ,  H01G4/30 ,  H01G2/10 ,  H01G4/232 ,  B23K1/00 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248

CPC classification number: H01G2/106 ,  B23K1/0016 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30

Abstract: An electronic part including an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and an antioxidant film formed on the outer side of the alloy layer. The antioxidant film is one of a Sn-containing film, a noble metal film, and an organic substance film.

公开(公告)号：US09614295B2

公开(公告)日：2017-04-04

申请号：US14918648

申请日：2015-10-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K101/36 ,  H01R4/02 ,  B23K35/02 ,  B23K35/26 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34 ,  B23K1/00 ,  H01R4/58

CPC classification number: H01R4/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/42 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01R4/58 ,  H05K3/3463 ,  H05K2201/0272 ,  Y10T403/479

Abstract: A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a Cu3Sn layer nor a Cu6Sn5 layer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member.

公开(公告)号：US20160288245A1

公开(公告)日：2016-10-06

申请号：US15183025

申请日：2016-06-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi lshino ,  Yoshihiro Kawaguchi ,  Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K20/02 ,  B23K1/00 ,  B23K35/00 ,  B23K35/02 ,  C22C1/04 ,  B23K20/227 ,  B23K20/233 ,  B23K20/16 ,  B22F1/00 ,  B22F7/06 ,  B23P6/00 ,  B23K35/30

CPC classification number: B23K20/026 ,  B22F1/0003 ,  B22F1/0059 ,  B22F7/062 ,  B23K1/0008 ,  B23K3/0623 ,  B23K20/16 ,  B23K20/227 ,  B23K20/233 ,  B23K35/007 ,  B23K35/0238 ,  B23K35/302 ,  B23K2101/06 ,  B23K2101/10 ,  B23K2101/18 ,  B23K2103/05 ,  B23P6/00 ,  C22C1/0483 ,  C22C1/0491

Abstract: A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally joined with a layer of an intermetallic compound and an alloy having a melting point higher than a melting point of either of the first metal or the second metal.

Abstract translation: 一种修复方法，其包括用修补材料覆盖要修复的构件的损坏部分，并将修补材料加热到预定温度以形成合金层。 至少要修复的构件的表面是诸如Cu的第一金属。 修补材料包括诸如Sn的第二金属。 通过加热，要修复的构件的表面与熔融点高于第一金属或第二金属的熔点的金属间化合物和合金层整体连接。

公开(公告)号：US09409247B2

公开(公告)日：2016-08-09

申请号：US14460519

申请日：2014-08-15

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K31/02 ,  B23K1/00 ,  B23K1/19 ,  B23K35/26 ,  C22C9/00 ,  C22C9/01 ,  C22C13/00 ,  C22C13/02 ,  H01L21/52 ,  C22C9/04 ,  B23K35/02 ,  B23K1/008 ,  H01R4/02 ,  H05K13/04 ,  B23K35/30 ,  B23K35/22 ,  H01L23/00 ,  H05K3/34

CPC classification number: B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K35/0216 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0266 ,  B23K35/222 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/42 ,  C22C9/00 ,  C22C9/01 ,  C22C9/04 ,  C22C13/00 ,  C22C13/02 ,  H01L21/52 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05647 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32507 ,  H01L2224/83101 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2224/8382 ,  H01L2924/01322 ,  H01R4/02 ,  H05K3/3436 ,  H05K3/3463 ,  H05K13/0465 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member.

Abstract translation: 在将由第一金属组成的第一金属构件连接到由第二金属构成的第二金属构件之间插入有接合材料的情况下，所述接合材料包括熔点比第一金属低的熔点低熔点金属和/ 构成接合材料的低熔点金属是Sn或含有Sn的合金，第一金属和第二金属中的至少一种是金属或合金，其与形成金属间化合物的低熔点金属构成， 在第一金属构件和第二金属构件之间的接合材料的定位状态下，在低熔点金属熔融的温度下进行热处理。

公开(公告)号：US20150239069A1

公开(公告)日：2015-08-27

申请号：US14697717

申请日：2015-04-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K35/02 ,  B23K1/00 ,  B23K35/362 ,  B23K35/26 ,  B23K35/36

CPC classification number: B23K35/025 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  B23K2101/40 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83211 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  Y10T403/479 ,  Y10T428/31678 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, the second metal is one of (1) a Cu—Mn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight and (2) a Cu—Ni alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, and a ratio of the second metal to the metal component is 36.9% by volume or greater.

Abstract translation: 包括由第一金属粉末和熔点高于第一金属的第二金属粉末组成的金属成分的焊膏和焊剂成分。 第一金属为Sn或含有Sn的合金，第二金属为（1）Mn与第二金属的比例为5〜30重量％的Cu-Mn合金，（2）Cu-Ni Ni与第二金属的比例为5〜20重量％的合金，第二金属与金属成分的比例为36.9体积％以上。

公开(公告)号：US09105987B2

公开(公告)日：2015-08-11

申请号：US13917706

申请日：2013-06-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H05K1/09 ,  H01R4/02 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  C22C9/02 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C19/03 ,  C22C22/00 ,  H05K3/34 ,  C22C1/04

CPC classification number: H01R4/02 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/36 ,  C22C1/0425 ,  C22C9/02 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C19/03 ,  C22C22/00 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0272 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A connection structure that includes a region where at least a Cu—Sn intermetallic compound, a M-Sn intermetallic compound and a Cu-M-Sn intermetallic compound (where M is Ni and/or Mn) exist in a cross-section of a connecting part when the cross-section of the connecting part is analyzed with a WDX. Further, the connection structure is configured so that when the cross-section of the connecting part is evenly divided into ten sections in a vertical direction and a lateral direction, respectively, to form 100 segmentalized squares in total, a ratio of the number of squares in which two or more kinds of intermetallic compounds having different constituent elements exist to the number of all the squares, except for squares in which only a Sn-based metal component exists, is 70% or more.

Abstract translation: 一种连接结构，其包括至少Cu-Sn金属间化合物，M-Sn金属间化合物和Cu-M-Sn金属间化合物（其中M为Ni和/或Mn）的区域存在于 用WDX分析连接部分的横截面时的连接部分。 此外，连接结构被构造成使得当连接部分的横截面分别在垂直方向和横向方向上被均匀地分成十个部分以形成总共100个分段平方时，平方的比例 除了存在仅Sn基金属成分的正方形以外，所有正方形的数量存在两种以上具有不同构成元素的金属间化合物的比例为70％以上。