公开(公告)号：US20080023841A1

公开(公告)日：2008-01-31

申请号：US11830505

申请日：2007-07-30

Applicant: Mayumi Nakasato ,  Hideki Mizuhara ,  Takaya Kusabe ,  Sadamichi Takakusaki

Inventor： Mayumi Nakasato ,  Hideki Mizuhara ,  Takaya Kusabe ,  Sadamichi Takakusaki

IPC: H01L23/48 ,  H01R12/04 ,  H05K3/02

CPC classification number: H05K3/305 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/16227 ,  H05K1/0262 ,  H05K1/056 ,  H05K1/141 ,  H05K1/183 ,  H05K3/107 ,  H05K3/4614 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/09972 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T29/49155

Abstract: To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.

Abstract translation: 为了减少设置在芯基板上的电路基板与要安装在其上的电路之间的连接缺陷，从而提高作为多层器件安装基板的可靠性。 装置安装基板包括：由基板，形成在该基板上的绝缘层和形成在该绝缘层上的第一导电层（包括导电部分）构成的第一电路基板; 以及安装在第一电路基板上的第二电路基板，由基底，形成在基底的底部的第二导电层（包括导电部）和形成在基底的顶部的第三导电层 的基地。 这里，第一和第二电路基板通过压力接合，使得第一和第二导电部件层叠并嵌入到绝缘层中。 第一和第二导电部分形成绝缘层中的连接区域，从而电连接第一和第二电路基板。

公开(公告)号：US20070297154A1

公开(公告)日：2007-12-27

申请号：US11474598

申请日：2006-06-26

Applicant: James Frank Caruba

Inventor： James Frank Caruba

IPC: H05K7/00

CPC classification number: H05K1/0218 ,  H05K1/0227 ,  H05K1/0237 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09972

Abstract: A circuit board which has a high speed digital circuit in close proximity to a sensitive analog structure has a grounded, conductive band interposed between them and a ground plane with two separate, grounded portions, with a first of the portions underlying the digital circuit and a second portion underlying the analog structure. In an exemplary embodiment, the circuit board has a high density of analog-to-digital converter integrated circuits, each with two analog input signals and ten parallel high speed digital output signals corresponding to each input signal. A grounded, conductive band is placed on the board between the inputs and outputs of the integrated circuit, and a ground plane is provide which has separate, interleaved analog and digital areas, with the digital area underlying only portions of the board having digital signals and structures and the analog area underlying only portions of the board having analog signals and structures.

Abstract translation: 具有靠近敏感模拟结构的高速数字电路的电路板具有介于它们之间的接地的导电带和具有两个单独的接地部分的接地平面，数字电路中的第一部分和 模拟结构的第二部分。 在示例性实施例中，电路板具有高密度的模数转换器集成电路，每个具有两个模拟输入信号和对应于每个输入信号的十个并行高速数字输出信号。 接地的导电带被放置在集成电路的输入和输出之间的板上，并且提供接地平面，其具有单独的交错的模拟和数字区域，其中仅具有数字信号的板的部分的数字区域， 结构和仅具有模拟信号和结构的板的部分的模拟区域。

公开(公告)号：US20070278191A1

公开(公告)日：2007-12-06

申请号：US11754254

申请日：2007-05-25

Applicant: Jeffrey Howerton ,  Mehmet Alpay ,  Ling Wen

Inventor： Jeffrey Howerton ,  Mehmet Alpay ,  Ling Wen

IPC: B23K15/00

CPC classification number: B23K26/382 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/50 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0026 ,  H05K2201/09918 ,  H05K2201/09972

Abstract: An apparatus and method performing a sequence of processing steps on a load supported by a processing plate. The load can include a single sheet on which a plurality of applications are performed or can include a plurality of panels on which respective applications are performed. For each application, at least one coarse target and at least one panel target are used to adjust the programmed coordinates for that application. After the first application of the load is processed using the coarse and panel targets, coarse and panel targets are located for the second application. Using the alignment provided by these targets, the second application is processed. Each subsequent application is similarly aligned and processed.

Abstract translation: 一种在由处理板支持的负载上执行处理步骤序列的装置和方法。 负载可以包括在其上执行多个应用的​​单个片材，或者可以包括执行相应应用的多个面板。 对于每个应用程序，使用至少一个粗略目标和至少一个面板目标来调整该应用程序的编程坐标。 在使用粗略和面板目标处理负载的第一次应用之后，为第二个应用定位粗略和面板目标。 使用这些目标提供的对齐方式，处理第二个应用程序。 每个后续应用程序都是类似的对齐和处理。

公开(公告)号：US07302239B2

公开(公告)日：2007-11-27

申请号：US10351384

申请日：2003-01-27

Applicant: Tsutomu Jitsuhara

Inventor： Tsutomu Jitsuhara

IPC: G06F3/033 ,  H04N7/16

CPC classification number: H04B1/40 ,  H04W4/18 ,  H04W84/12 ,  H04W88/02 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/0723 ,  H05K2201/09972

Abstract: A wireless receiving device of the present invention is so arranged that (i) a high-frequency circuit section is provided on a front surface of a printed board and (ii) a digital video signal processing section and a wireless LAN digital signal processing section are provided on a back surface of the printed board. Further, an earth pattern is provided in a middle position between the front and back surfaces of the printed board, so that (i) the high-frequency circuit section and (ii) the digital video signal processing section and the wireless LAN digital signal processing section are shielded from one another using electromagnetic shielding by the earth pattern. Thus, when members that are commonly used for the wireless LAN and for wireless video reception are formed on a single printed board in order to reduce the size of the printed board, it is possible to effectively reduce the lowering of signal quality caused by the noise.

Abstract translation: 本发明的无线接收装置的结构是：（i）高频电路部分设置在印刷电路板的正面上，（ii）数字视频信号处理部分和无线LAN数字信号处理部分 设置在印刷电路板的背面。 此外，在印刷电路板的前表面和后表面之间的中间位置设置接地图案，使得（i）高频电路部分和（ii）数字视频信号处理部分和无线LAN数字信号处理 使用地球图案的电磁屏蔽来屏蔽彼此。 因此，为了减小印刷电路板的尺寸，当通常用于无线LAN和无线视频接收的部件形成在单个印刷电路板上时，可以有效地降低由噪声引起的信号质量的降低 。

公开(公告)号：US07288724B2

公开(公告)日：2007-10-30

申请号：US10403550

申请日：2003-03-31

Applicant: Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

Inventor： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiling substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

Abstract translation: 制造可以以细间距保持导体图案的尺寸稳定性的多层布线基板的方法从材料选择的角度解决了对工艺的限制，并且进一步降低了制造成本，以及多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二卷绕基板仅叠层在第一布线基板上的多层的部分上，从而减少第二布线基板的结构材料的量。

公开(公告)号：US20070222897A1

公开(公告)日：2007-09-27

申请号：US11606959

申请日：2006-12-01

Applicant: Tsutomu Jitsuhara

Inventor： Tsutomu Jitsuhara

IPC: H04N5/46

CPC classification number: H04N5/4401 ,  H04N21/426 ,  H04N21/42607 ,  H04N21/6112 ,  H05K1/0216 ,  H05K1/0237 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09972

Abstract: According to the present invention, in a receiver apparatus that converts a radio-frequency signal received via an antenna into video and audio signals, there are arranged on a circuit board: a tuner circuit portion that converts the radio-frequency signal received via the antenna into an intermediate-frequency signal, which is to be outputted; a digital demodulating portion that converts the intermediate-frequency signal outputted from the tuner circuit portion into a compressed digital signal, which is to be outputted; a digital circuit portion that converts the compressed digital signal outputted from the digital demodulating portion into digital video and audio signals, which are to be outputted; and a video/audio output circuit that converts the digital video and audio signals outputted from the digital circuit portion into analog video and audio signals. This makes it possible to realize a receiver system provided with a video display apparatus having a simple configuration.

Abstract translation: 根据本发明，在将通过天线接收的射频信号转换为视频和音频信号的接收机装置中，布置在电路板上：调谐器电路部分，其经由天线接收的射频信号 转换成要被输出的中频信号; 数字解调部分，将从调谐器电路部分输出的中频信号转换成要输出的压缩数字信号; 数字电路部分，将从数字解调部分输出的压缩数字信号转换成要被输出的数字视频和音频信号; 以及将从数字电路部分输出的数字视频和音频信号转换为模拟视频和音频信号的视频/音频输出电路。 这使得可以实现具有简单配置的视频显示装置的接收机系统。

公开(公告)号：US07221244B2

公开(公告)日：2007-05-22

申请号：US11237056

申请日：2005-09-28

Applicant: John C. Estes ,  Rodolfo Lucero ,  Anthony M. Pavio

Inventor： John C. Estes ,  Rodolfo Lucero ,  Anthony M. Pavio

IPC: H03H11/00

CPC classification number: H03H9/0557 ,  H01P1/203 ,  H03H9/02913 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0243 ,  H05K1/16 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/09618 ,  H05K2201/09972 ,  H05K2201/10371 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: An exemplary system and method for providing differential adjustment of the height of a multilayer substrate in localized areas for improved Q-factor performance of RF devices is disclosed as comprising inter alia: a multilayer substrate (200); an RF component (210) embedded in the substrate (200); a surface mounted component (220); and an RF shield (260) disposed next to the surface mounted component (220), wherein the height of the shield (260) does not extend substantially beyond the height of the surface mounted component (220). Disclosed features and specifications may be variously controlled, configured, adapted or otherwise optionally modified to further improve or otherwise optimize Q, RF performance and/or material characteristics. Exemplary embodiments of the present invention representatively provide for high-performance, high-quality RF devices that may be readily incorporated with existing technologies for the improvement of frequency response, device package form factors, weights and/or other manufacturing, device or material performance metrics.

Abstract translation: 公开了一种用于在局部区域中对多层基板的高度进行差分调整以提高RF器件的Q因子性能的示例性系统和方法，其特别包括：多层衬底（200）; 嵌入在所述基板（200）中的RF部件（210）; 表面安装部件（220）; 以及靠近所述表面安装部件（220）设置的RF屏蔽件（260），其中所述屏蔽件（260）的高度基本上不超过所述表面安装部件（220）的高度。 公开的特征和规范可以被不同地控制，配置，适配或以其他方式任意地修改，以进一步改善或者优化Q，RF性能和/或材料特性。 本发明的示例性实施例代表性地提供了可以容易地与用于改进频率响应，设备包装形状因子，重量和/或其他制造，设备或材料性能度量的现有技术结合的高性能，高质量的RF设备 。

公开(公告)号：US20060268527A1

公开(公告)日：2006-11-30

申请号：US11431097

申请日：2006-05-10

Applicant: Hirokazu Tanaka ,  Hiroyuki Ishibashi

Inventor： Hirokazu Tanaka ,  Hiroyuki Ishibashi

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/0201 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/202 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09972 ,  H05K2201/2036 ,  H05K2203/1316

Abstract: In a lead frame board, while a heat radiation wall member formed by a resin having a relatively high thermal conductivity is provided in a low heat-resistance heat generating component mounting region where a low heat-resistance heat generating component is mounted, heat block wall members formed by resins having relatively low thermal conductivities are provided in a high heat-resistance heat generating component mounting region where a high heat-resistance heat generating component is mounted and in a non-heat generating component mounting region where a non-heat generating component is mounted. Thus, heat block is performed between the low heat-resistance heat generating component mounting region and the high heat-resistance heat generating component mounting region and non-heat generating component mounting region, and a heat radiation function is enhanced in the low heat-resistance heat generating component.

Abstract translation: 在引线框架板中，在安装有低耐热性发热部件的低耐热发热部件安装区域中设置由具有较高导热性的树脂形成的散热壁部件，但是热阻壁 在具有较高耐热发热部件的高耐热发热部件安装区域和非发热部件安装区域中设置具有较低热导率的树脂构成的部件， 被安装。 因此，在低耐热性发热部件安装区域和高耐热发热部件安装区域和非发热部件安装区域之间进行热阻，并且在低耐热性下提高散热功能 发热部件。

公开(公告)号：US07132357B2

公开(公告)日：2006-11-07

申请号：US11238894

申请日：2005-09-29

Applicant: Jeffrey A. Underwood ,  John K. Arledge ,  Thomas J. Swirbel ,  Joaquin Barreto

Inventor： Jeffrey A. Underwood ,  John K. Arledge ,  Thomas J. Swirbel ,  Joaquin Barreto

IPC: H01L21/44

CPC classification number: H05K1/0218 ,  H01L2223/6622 ,  H05K1/0221 ,  H05K1/0222 ,  H05K1/113 ,  H05K3/4644 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/09809 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2201/10553 ,  H05K2201/10969 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method for shielding one or more circuits (21, 21′) of a printed circuit board includes depositing a layer of dielectric material (43) over a printed circuit board substrate (22) and the printed circuits (21, 21′), creating a trench-like opening (44) in the dielectric layer (43) such that the trench-like opening (44) surrounds the one or more circuits (21, 21′) to be shielded, depositing a layer of metal (27) over the layer of dielectric material (43) and within the trench-like openings (44), creating a solder pad (24) at each location where an electrical connection is to be made to the printed circuits (21, 21′) by removing a border of the metal layer (27) surrounding each connection location, and providing a microvia (25) through each solder pad (24) penetrating the dielectric layer (43) and terminating at the metal of the printed circuit (21, 21′).

公开(公告)号：US07129416B1

公开(公告)日：2006-10-31

申请号：US10774053

申请日：2004-02-05

Applicant: Robert Steinfeld ,  Cheung-Wei Lam

Inventor： Robert Steinfeld ,  Cheung-Wei Lam

IPC: H05K1/03

CPC classification number: H05K1/0219 ,  H05K1/0289 ,  H05K1/0298 ,  H05K2201/09236 ,  H05K2201/09972 ,  Y10T29/49117

Abstract: Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.

Abstract translation: 电气安装板及其制造和使用的方法在本文中公开。 特别地，这种安装板实施例利用通过衬底芯互连的混合地线，以形成多层地面网格。 这样的混合接地线包括基本上平行的接地线的组，其被配置为使得接地线组以与形成在同一水平面上的其它接地线组横向布置的方式配置。 这样的实施方式具有许多用途，包括但不限于更有效地路由信号线并连接电路板上的电气部件的能力。