公开(公告)号：US06841422B2

公开(公告)日：2005-01-11

申请号：US10371672

申请日：2003-02-21

Applicant: Tongbi Jiang ,  Jerrold L. King

Inventor： Tongbi Jiang ,  Jerrold L. King

IPC: H01L21/48 ,  H01L23/495 ,  H05K3/34 ,  H01L21/44 ,  H01L21/50

CPC classification number: H01L21/4821 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

Abstract translation: 导电塑料引线框及其制造方法，适用于IC封装。 在优选实施例中，引线框架由具有本征导电聚合物涂层的基于塑料或聚合物的引线框架结构构成。 在第二实施例中，引线框架是与本征导电聚合物涂层混合的复合塑料或聚合材料。

公开(公告)号：US06820502B2

公开(公告)日：2004-11-23

申请号：US10366822

申请日：2003-02-14

Applicant: Tongbi Jiang ,  Zhiqiang Wu

Inventor： Tongbi Jiang ,  Zhiqiang Wu

IPC: G01L516

CPC classification number: G01L1/205

Abstract: A high-resolution pressure-sensing device is disclosed. The device includes an insulating flexible matrix having a plurality of filler particles. Application of a force to the matrix causes compression of the matrix. This results in the filler particles occupying a greater amount of space within the matrix relative to when no force is applied. A detector attached to the matrix detects or measures the volume of the filler particles relative to the volume of the matrix, and therefore determines the force applied to the matrix. Preferably, the resistivity of the matrix is inversely proportional to the volume percent of the filler particles, in which case the detector is a resistance-measuring circuit.

Abstract translation: 公开了一种高分辨率压力感测装置。 该装置包括具有多个填料颗粒的绝缘柔性基质。 对矩阵施加力会导致矩阵的压缩。 这导致在没有施加力的情况下，填料颗粒在基质内占据更大量的空间。 连接到基体的检测器检测或测量填料颗粒相对于基体体积的体积，因此确定施加到基质上的力。 优选地，基质的电阻率与填料颗粒的体积百分比成反比，在这种情况下，检测器是电阻测量电路。

公开(公告)号：US06812064B2

公开(公告)日：2004-11-02

申请号：US10008136

申请日：2001-11-07

Applicant: Tongbi Jiang ,  Mike Connell ,  Li Li ,  Curtis Hollingshead

Inventor： Tongbi Jiang ,  Mike Connell ,  Li Li ,  Curtis Hollingshead

IPC: H01L2144

CPC classification number: H01L24/83 ,  H01L21/67132 ,  H01L21/67144 ,  H01L24/32 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods are provided to improve the adhesive bonding of a semiconductor die to a substrate through an adhesive paste by forming a layer of silicon dioxide on the back surface of the semiconductor die prior to applying the adhesive paste. Contacting the semiconductor die with ozone, in a gas mixture or in a mixture with water provides rapid oxidation of the silicon layer at the back of the semiconductor die to a silicon dioxide layer of at least 10 angstroms thick, which is sufficient to greatly improve bonding to the adhesive. The formation of a silicon dioxide surface layer prior to application of the adhesive is particularly beneficial when combined with rapid, snap curing processes, where the adhesive can be reliably cured by heating the semiconductor die for less than about 1 minute.

Abstract translation: 提供了通过在施加粘合剂糊剂之前通过在半导体管芯的背面上形成二氧化硅层来改善通过粘合剂浆料将半导体管芯粘合到基底上的方法。 将半导体管芯与臭氧，气体混合物或与水的混合物接触将半导体管芯背面的硅层快速氧化成至少10埃的二氧化硅层，这足以大大改善粘结 粘合剂。 在施加粘合剂之前形成二氧化硅表面层是特别有利的，当与快速快速固化工艺组合时，其中通过将半导体管芯加热少于约1分钟可以可靠地固化粘合剂。

公开(公告)号：US06791168B1

公开(公告)日：2004-09-14

申请号：US10192736

申请日：2002-07-10

Applicant: Mike Connell ,  Tongbi Jiang

Inventor： Mike Connell ,  Tongbi Jiang

IPC: H01L23495

CPC classification number: H01L24/48 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/4951 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05073 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05155 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45111 ,  H01L2224/45118 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48769 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/4943 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85444 ,  H01L2224/92 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/48824 ,  H01L2224/48869 ,  H01L2224/48744 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/20754 ,  H01L2224/45099 ,  H01L2224/4554

Abstract: A semiconductor package includes a substrate, a die attached and wire bonded to the substrate, and a die encapsulant encapsulating the die. The die includes a circuit side having a pattern of die contacts, planarized wire bonding contacts bonded to the die contacts, and a planarized polymer layer on the circuit side configured as stress defect barrier. A method for fabricating the package includes the steps of forming bumps on the die, encapsulating the bumps in a polymer layer, and then planarizing the polymer layer and the bumps to form the planarized wire bonding contacts. The method also includes the steps of attaching and wire bonding the die to the substrate, and then forming the die encapsulant on the die.

Abstract translation: 半导体封装包括衬底，附接的芯片和引线键合到衬底，以及封装模具的管芯密封剂。 芯片包括具有芯片触点图案的电路侧，与芯片触点接合的平坦化引线接合触点，以及被配置为应力缺陷屏障的电路侧上的平坦化聚合物层。 制造封装的方法包括以下步骤：在芯片上形成凸块，将凸块封装在聚合物层中，然后平坦化聚合物层和凸块以形成平坦化的引线接合触点。 该方法还包括以下步骤：将管芯附着和引线接合到衬底，然后在管芯上形成管芯密封剂。

公开(公告)号：US06777268B2

公开(公告)日：2004-08-17

申请号：US10188436

申请日：2002-07-02

Applicant: Tongbi Jiang

Inventor： Tongbi Jiang

IPC: H01L2148

CPC classification number: H01L24/32 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/4951 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10155 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An apparatus and method for preventing damage to tape attachment semiconductor assemblies due to encapsulation filler particles causing damage to a semiconductor die active surface and/or to a corresponding semiconductor substrate surface by providing an adhesive tape which extends across areas of contact between the semiconductor die active surface and the semiconductor substrate. The present invention also includes extending the adhesive tape beyond the areas of contact between the semiconductor die active surface and the semiconductor substrate to provide a visible surface of visual inspection of proper adhesive tape placement.

Abstract translation: 一种用于防止由于包封填料颗粒导致对半导体管芯有源表面和/或相应的半导体衬底表面的损坏而损坏带附接半导体组件的装置和方法，该粘合带延伸穿过半导体管芯激活的接触区域 表面和半导体衬底。 本发明还包括将粘合带延伸超过半导体管芯有源表面和半导体衬底之间的接触区域，以提供目视检查合适的胶带放置的可视表面。

公开(公告)号：US06770981B2

公开(公告)日：2004-08-03

申请号：US10373261

申请日：2003-02-24

Applicant: Tongbi Jiang ,  Edward Schrock

Inventor： Tongbi Jiang ,  Edward Schrock

IPC: H01L2940

CPC classification number: H01L23/4985 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H01L2924/00

Abstract: An interposer in a BGA or similar package includes a polymide core and a filler of thermally conductive, electrically nonconductive filler. The interposer has a higher thermal conductivity as compared to conventional interposers, thereby increasing the thermal dissipation through the interposer and enabling the device to cool more efficiently. The filler also reduces the coefficient of thermal expansion of the interposer to more closely match the die and reduce stresses. Furthermore, the filler increases the rigidity of the interposer, thereby enabling the interposer to be handled and carried more easily, for example, without a metal frame carrier.

公开(公告)号：US06717259B2

公开(公告)日：2004-04-06

申请号：US10121265

申请日：2002-04-11

Applicant: W. Jeff Reeder ,  Tongbi Jiang

Inventor： W. Jeff Reeder ,  Tongbi Jiang

IPC: H01L2334

CPC classification number: H01L24/83 ,  H01L21/67132 ,  H01L23/3737 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/351 ,  H01R4/04 ,  H05K3/0058 ,  H05K3/305 ,  H05K3/386 ,  H05K2203/0278 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to each other. The pressure-sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the hybrid adhesive material may be heated to cure the thermoset component thereof and to more permanently secure the semiconductor device components to one another. The cure temperature may be lower than about 200° C. and as low as about 120° C. or less. A system for effecting the method of the present invention is also disclosed, as well as semiconductor device assemblies that include the hybrid adhesive material.

Abstract translation: 提供了一种用于将两个或更多个半导体器件组件彼此固定的方法。 使用包括压敏部件和热固性部件的混合粘合材料至少将半导体器件部件彼此暂时固定。 混合粘合剂材料的压敏部件将半导体器件部件彼此临时固定。 当半导体器件部件被正确对准时，可以加热混合粘合剂材料以固化其热固性组分并且将半导体器件部件更加永久地固定到彼此。 固化温度可以低于约200℃，低至约120℃或更低。 还公开了用于实现本发明的方法的系统，以及包括混合粘合剂材料的半导体器件组件。

公开(公告)号：US06709896B1

公开(公告)日：2004-03-23

申请号：US09651217

申请日：2000-08-30

Applicant: Chad A. Cobbley ,  Tongbi Jiang ,  Edward A. Schrock

Inventor： Chad A. Cobbley ,  Tongbi Jiang ,  Edward A. Schrock

IPC: H01L2144

CPC classification number: H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: An adhesive composition and methods incorporating the adhesive composition in semiconductor applications are provided. The adhesive composition is an instant setting adhesive composition that does not require external energy input such as heat or radiation such for application of the adhesive composition on a surface. The instant setting composition possesses sufficient thixotropic characteristics such that applying the instant setting adhesive composition to a surface can be accomplished by a variety of application techniques and in a variety of patterns. Once applied to the surface, the instant setting adhesive composition sets to retain the discrete pattern as applied, in a relatively short period of time, typically from about 0.10 to about 120 seconds at an ambient temperature, typically from 20° C. to 30° C. Advantageously, the instant setting adhesive composition can be screen printed on a semiconductor wafer prior to singulation because streets between the dice are essentially free of the instant setting adhesive composition.

Abstract translation: 提供在半导体应用中粘合组合物的粘合剂组合物和方法。 粘合剂组合物是瞬间固化粘合剂组合物，其不需要诸如热或辐射的外部能量输入，以便将粘合剂组合物施加在表面上。 本发明的凝固组合物具有足够的触变特性，使得将即刻固化粘合剂组合物施加到表面可以通过各种应用技术和各种图案来实现。 一旦施加到表面上，即刻固化粘合剂组合物在相对较短的时间段内保持离散的图案，通常在约0.10至约120秒的环境温度，通常为20℃至30℃ 有利地，即刻固化粘合剂组合物可以在切割之前丝网印刷在半导体晶片上，因为骰子之间的街道基本上不含瞬时固化粘合剂组合物。

公开(公告)号：US06684717B2

公开(公告)日：2004-02-03

申请号：US09922966

申请日：2001-08-06

Applicant: Tongbi Jiang ,  Zhiqiang Wu

Inventor： Tongbi Jiang ,  Zhiqiang Wu

IPC: G01D700

CPC classification number: G01L1/205

Abstract: A high-resolution pressure-sensing device is disclosed. The device includes an insulating flexible matrix having a plurality of filler particles. Application of a force to the matrix causes compression of the matrix. This results in the filler particles occupying a greater amount of space within the matrix relative to when no force is applied. A detector attached to the matrix detects or measures the volume of the filler particles relative to the volume of the matrix, and therefore determines the force applied to the matrix. Preferably, the resistivity of the matrix is inversely proportional to the volume percent of the filler particles, in which case the detector is a resistance-measuring circuit.

公开(公告)号：US06607599B1

公开(公告)日：2003-08-19

申请号：US09514916

申请日：2000-02-28

Applicant: Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

Inventor： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

IPC: B05C1111

CPC classification number: B41C1/14 ,  B41N1/242 ,  H01L2224/4826 ,  H05K3/1225 ,  Y10S438/945

Abstract: A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.