公开(公告)号：US10541941B2

公开(公告)日：2020-01-21

申请号：US15947028

申请日：2018-04-06

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Hugh Wilkinson ,  Amit Y. Kumar

IPC: H04L12/933 ,  H05K7/14 ,  H04B1/40 ,  H04L12/931 ,  H04L29/08

Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.

公开(公告)号：US10374726B2

公开(公告)日：2019-08-06

申请号：US15874499

申请日：2018-01-18

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Hugh Wilkinson ,  Amit Y. Kumar

IPC: H04B10/80 ,  H01P3/10 ,  H01P5/00 ,  H04B10/40 ,  H01P5/02 ,  H04B1/40 ,  H04B10/90 ,  H04L12/931 ,  H04Q11/00 ,  H04B3/52 ,  H04B5/00

Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links. The communication links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.

公开(公告)号：US10348327B2

公开(公告)日：2019-07-09

申请号：US15396652

申请日：2016-12-31

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H05K7/14 ,  H03M7/30 ,  H03M7/40 ,  G06F3/06 ,  G11C7/10 ,  G06F1/18 ,  G06F13/40 ,  H05K5/02 ,  G08C17/02 ,  H04L12/24 ,  H04L29/08 ,  H04L12/26 ,  H04L12/851 ,  H04Q11/00 ,  G06F9/50 ,  G06F12/109 ,  H04L29/06 ,  G11C14/00 ,  G11C5/02 ,  G11C11/56 ,  G02B6/44 ,  G06F8/65 ,  G06F12/14 ,  G06F13/16 ,  H04B10/25 ,  G06F9/4401 ,  G02B6/38 ,  G02B6/42 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L12/931 ,  H04L12/939 ,  H04W4/02 ,  H04L12/751 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L12/927 ,  H05K1/02 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  G06F17/30 ,  H04L12/919 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L29/12 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/911 ,  H04L12/811 ,  H04W4/80 ,  H04L12/781 ,  G06Q10/08 ,  G06Q10/00 ,  G06Q50/04 ,  H04L12/933 ,  H04L12/947

Abstract: A rack for supporting sleds includes a pair of elongated support posts and pairs of elongated support arms that extend from the elongated support posts. Each pair of the elongated support arms defines a sled slot to receive a corresponding sled. A power supply is attached to an elongated support arm of each pair of elongated support arms to provide power to a corresponding sled. The power supply may include a chassis-less circuit board substrate that is removable from a power supply housing coupled to the corresponding elongated support arm.

公开(公告)号：US09961018B2

公开(公告)日：2018-05-01

申请号：US15262276

申请日：2016-09-12

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Hugh Wilkinson ,  Amit Y. Kumar

IPC: H04L12/933 ,  H04B1/40 ,  H04L12/931 ,  H04L29/08 ,  H05K7/14

CPC classification number: H04L49/10 ,  H04B1/40 ,  H04L49/35 ,  H04L67/10 ,  H05K7/1492

Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.

公开(公告)号：US09936613B2

公开(公告)日：2018-04-03

申请号：US15396647

申请日：2016-12-31

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Michael T. Crocker ,  Myles Wilde

IPC: H05K7/14 ,  H05K7/20 ,  G02B6/38 ,  G02B6/44

CPC classification number: H04Q11/0005 ,  B25J15/0014 ,  B65G1/0492 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G05D23/1921 ,  G05D23/2039 ,  G06F1/183 ,  G06F3/061 ,  G06F3/0611 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0625 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/064 ,  G06F3/0647 ,  G06F3/0653 ,  G06F3/0658 ,  G06F3/0659 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/067 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/4401 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/505 ,  G06F9/5072 ,  G06F9/5077 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/161 ,  G06F13/1668 ,  G06F13/1694 ,  G06F13/4022 ,  G06F13/4068 ,  G06F13/409 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F17/30949 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C17/02 ,  G08C2200/00 ,  G11C5/02 ,  G11C5/06 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/30 ,  H03M7/3084 ,  H03M7/3086 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/4056 ,  H03M7/4081 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04B10/2504 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L29/12009 ,  H04L41/024 ,  H04L41/046 ,  H04L41/0813 ,  H04L41/082 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/145 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/08 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/15 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L49/555 ,  H04L67/02 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/16 ,  H04L67/306 ,  H04L67/34 ,  H04L69/04 ,  H04L69/329 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0003 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y10S901/01

Abstract: A rack for supporting a sleds includes a pair of elongated support posts and pairs of elongated support arms that extend from the elongated support posts. Each pair of the elongated support arms defines a sled slot to receive a corresponding sled. To do so, each elongated support arm includes a circuit board guide to receive a chassis-less circuit board substrate of the corresponding sled. The rack may include a cross-member arm associated with each sled slot and an optical connector mounted to each cross-member arm. Additional elongated support posts may be used to provide additional sled slots.

公开(公告)号：US20180027687A1

公开(公告)日：2018-01-25

申请号：US15396646

申请日：2016-12-31

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H05K7/14 ,  H05K7/20 ,  H05K1/18

CPC classification number: H04Q11/0005 ,  B25J15/0014 ,  B65G1/0492 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G05D23/1921 ,  G05D23/2039 ,  G06F1/183 ,  G06F3/061 ,  G06F3/0611 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0625 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/064 ,  G06F3/0647 ,  G06F3/0653 ,  G06F3/0658 ,  G06F3/0659 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/067 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/4401 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/505 ,  G06F9/5072 ,  G06F9/5077 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/161 ,  G06F13/1668 ,  G06F13/1694 ,  G06F13/4022 ,  G06F13/4068 ,  G06F13/409 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F17/30949 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C17/02 ,  G08C2200/00 ,  G11C5/02 ,  G11C5/06 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/30 ,  H03M7/3084 ,  H03M7/3086 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/4056 ,  H03M7/4081 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04B10/2504 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L29/12009 ,  H04L41/024 ,  H04L41/046 ,  H04L41/0813 ,  H04L41/082 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/145 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/08 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/15 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L49/555 ,  H04L67/02 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/16 ,  H04L67/306 ,  H04L67/34 ,  H04L69/04 ,  H04L69/329 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0003 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y10S901/01

Abstract: A sled for operation in a corresponding rack of a data center includes a chassis-less circuit board substrate having one or more physical resources coupled to a top side of the chassis-less circuit board and one or more memory devices coupled to a bottom side of the chassis-less circuit board. The sled does not include a housing or chassis and is opened to the local environment. In the illustrative embodiments, the sled may be embodied as a compute sled, an accelerator sled, or a storage sled.

公开(公告)号：US09830285B2

公开(公告)日：2017-11-28

申请号：US14882867

申请日：2015-10-14

Applicant: Intel Corporation

Inventor： Gilbert Wolrich ,  Debra Bernstein ,  Daniel Cutter ,  Christopher Dolan ,  Matthew J. Adiletta

IPC: G06F13/20 ,  G06F12/0806 ,  G06F12/06 ,  G06F12/02 ,  G06F3/06 ,  G06F13/28 ,  G06F13/40 ,  G06F15/76 ,  G06F15/173 ,  G11C7/10 ,  G06F12/10 ,  G06F12/109

CPC classification number: G06F13/20 ,  G06F3/0622 ,  G06F3/0661 ,  G06F3/0679 ,  G06F12/0223 ,  G06F12/0284 ,  G06F12/06 ,  G06F12/0806 ,  G06F12/10 ,  G06F12/109 ,  G06F13/28 ,  G06F13/4027 ,  G06F15/17318 ,  G06F15/76 ,  G06F2212/1041 ,  G06F2212/206 ,  G06F2212/251 ,  G11C7/1033 ,  G11C7/1072

Abstract: The disclosure includes, in general, among other aspects, an apparatus having multiple programmable units integrated within a processor. The apparatus has circuitry to map addresses in a single address space to resources within the multiple programmable units where the single address space includes addresses for different ones of the resources in different ones of the multiple programmable units and where there is a one-to-one correspondence between respective addresses in the single address space and resources within the multiple programmable units.

公开(公告)号：US09824038B2

公开(公告)日：2017-11-21

申请号：US14882897

申请日：2015-10-14

Applicant: Intel Corporation

Inventor： Gilbert Wolrich ,  Debra Bernstein ,  Daniel Cutter ,  Christopher Dolan ,  Matthew J. Adiletta

IPC: G06F13/20 ,  G06F12/0806 ,  G06F12/06 ,  G06F12/02 ,  G06F3/06 ,  G06F13/28 ,  G06F13/40 ,  G06F15/76 ,  G06F15/173 ,  G11C7/10 ,  G06F12/10 ,  G06F12/109

CPC classification number: G06F13/20 ,  G06F3/0622 ,  G06F3/0661 ,  G06F3/0679 ,  G06F12/0223 ,  G06F12/0284 ,  G06F12/06 ,  G06F12/0806 ,  G06F12/10 ,  G06F12/109 ,  G06F13/28 ,  G06F13/4027 ,  G06F15/17318 ,  G06F15/76 ,  G06F2212/1041 ,  G06F2212/206 ,  G06F2212/251 ,  G11C7/1033 ,  G11C7/1072

Abstract: The disclosure includes, in general, among other aspects, an apparatus having multiple programmable units integrated within a processor. The apparatus has circuitry to map addresses in a single address space to resources within the multiple programmable units where the single address space includes addresses for different ones of the resources in different ones of the multiple programmable units and where there is a one-to-one correspondence between respective addresses in the single address space and resources within the multiple programmable units.

公开(公告)号：US09450635B2

公开(公告)日：2016-09-20

申请号：US14244475

申请日：2014-04-03

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Hugh Wilkinson ,  Amit Y. Kumar

IPC: H04B1/38 ,  H04B1/40 ,  H04L12/933 ,  H04L12/931 ,  H04L29/08

CPC classification number: H04L49/10 ,  H04B1/40 ,  H04L49/35 ,  H04L67/10 ,  H05K7/1492

Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.

Abstract translation: 用于无线连接机箱内部和分离机箱之间的部件的装置和方法。 支持非常短长度的毫米波无线通信链路的极高频（EHF）收发器芯片配置成通过单独的机箱和/或框架中的一个或多个金属层中的孔传递射频信号，使单独机架中的组件能够 通信而不需要机箱之间的电缆。 公开了各种配置，包括服务器机箱，存储机箱和阵列以及网络/交换机机箱的多种配置。 基于EHF的无线链路支持高达每秒6吉比特的链路带宽，并且可以聚合以便于多车道链路。

公开(公告)号：US09128818B2

公开(公告)日：2015-09-08

申请号：US14286055

申请日：2014-05-23

Applicant: Intel Corporation

Inventor： Gilbert Wolrich ,  Debra Bernstein ,  Daniel Cutter ,  Christopher Dolan ,  Matthew J. Adiletta

IPC: G06F12/00 ,  G06F12/02 ,  G06F12/10

CPC classification number: G06F13/20 ,  G06F3/0622 ,  G06F3/0661 ,  G06F3/0679 ,  G06F12/0223 ,  G06F12/0284 ,  G06F12/06 ,  G06F12/0806 ,  G06F12/10 ,  G06F12/109 ,  G06F13/28 ,  G06F13/4027 ,  G06F15/17318 ,  G06F15/76 ,  G06F2212/1041 ,  G06F2212/206 ,  G06F2212/251 ,  G11C7/1033 ,  G11C7/1072

Abstract: The disclosure includes, in general, among other aspects, an apparatus having multiple programmable units integrated within a processor. The apparatus has circuitry to map addresses in a single address space to resources within the multiple programmable units where the single address space includes addresses for different ones of the resources in different ones of the multiple programmable units and where there is a one-to-one correspondence between respective addresses in the single address space and resources within the multiple programmable units.

Abstract translation: 一般来说，本公开包括具有集成在处理器内的多个可编程单元的装置。 该装置具有将单个地址空间中的地址映射到多个可编程单元内的资源的电路，其中单个地址空间包括针对多个可编程单元中的不同可编程单元中的不同资源的地址，并且其中存在一对一 单个地址空间中的各个地址与多个可编程单元内的资源之间的对应关系。