公开(公告)号：US09664764B2

公开(公告)日：2017-05-30

申请号：US14167152

申请日：2014-01-29

Applicant: Samsung Electronics Co., Ltd. ,  The Trustees of the University of Pennsylvania

Inventor： Jin Young Hwang ,  Joon Soo Kim ,  Jae Moon Jo ,  Yang Lim Choi ,  Jongho Lee

IPC: G01R33/56 ,  G01R33/565 ,  G01R33/561

CPC classification number: G01R33/56 ,  G01R33/5602 ,  G01R33/5615 ,  G01R33/56536

Abstract: An MRI system acquires a susceptibility-weighted image by acquiring a first RF echo signal in a first echo time for providing an image exclusive of susceptibility-weighting and acquiring a second RF echo signal in a second echo time longer than the first echo time for providing an image including susceptibility-weighting. A compensation gradient field is applied for compensating for field inhomogeneity and in response, a third RF echo signal is acquired in a third echo time longer than the second echo time. First, second and third images are generated in response to data derived from the first, second and third RF echo signals respectively and data of the first, second and third images is combined to provide image data representing an image compensating for magnetic resonance signal attenuation in the second image.

公开(公告)号：US20140151877A1

公开(公告)日：2014-06-05

申请号：US14175162

申请日：2014-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HWAN-SIK LIM ,  Sunwon Kang ,  Jongho Lee

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L23/3128 ,  H01L23/3192 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/0603 ,  H01L2224/06515 ,  H01L2224/13025 ,  H01L2224/13028 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14515 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a semiconductor chip having a first bump group and a second bump group, and a package substrate having a first pattern for data communication with the semiconductor chip and a second pattern for supplying power to the semiconductor chip or grounding the semiconductor chip, wherein the first bump group is disposed on the first pattern and the second bump group is disposed on the second pattern.

Abstract translation: 半导体封装包括具有第一凸块组和第二凸块组的半导体芯片，以及具有用于与半导体芯片进行数据通信的第一图案的封装基板和用于向半导体芯片供电或将半导体芯片接地的第二图案， 其中所述第一凸块组设置在所述第一图案上，并且所述第二凸块组设置在所述第二图案上。

公开(公告)号：US12132019B2

公开(公告)日：2024-10-29

申请号：US18151622

申请日：2023-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyuekjae Lee ,  Jongho Lee ,  Jihoon Kim ,  Taehun Kim ,  Sangcheon Park ,  Jinkyeong Seol ,  Sanghoon Lee

IPC: H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L24/06 ,  H01L21/561 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/32 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/05025 ,  H01L2224/05073 ,  H01L2224/05562 ,  H01L2224/05564 ,  H01L2224/06182 ,  H01L2224/08121 ,  H01L2224/08145 ,  H01L2224/08148 ,  H01L2224/08225 ,  H01L2224/13024 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/80895 ,  H01L2224/83099 ,  H01L2224/8389 ,  H01L2224/92142 ,  H01L2225/06541 ,  H01L2225/06548

Abstract: A semiconductor package includes a first connection structure, a first semiconductor chip on an upper surface of the first connection structure, a first molding layer on the upper surface of the first connection structure and surrounding the first semiconductor chip, a first bond pad on the first semiconductor chip, a first bond insulation layer on the first semiconductor chip and the first molding layer and surrounding the first bond pad, a second bond pad directly contacting the first bond pad, a second bond insulation layer surrounding the second bond pad; and a second semiconductor chip on the second bond pad and the second bond insulation layer.

公开(公告)号：US12113050B2

公开(公告)日：2024-10-08

申请号：US17552614

申请日：2021-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Sick Park ,  Un-Byoung Kang ,  Jongho Lee ,  Teak Hoon Lee

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/061 ,  H01L2224/06519 ,  H01L2224/16147 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/3841

Abstract: Disclosed is a semiconductor package with increased thermal radiation efficiency, which includes: a first die having signal and dummy regions and including first vias in the signal region, a second die on the first die and including second vias in the signal region, first die pads on a top surface of the first die and coupled to the first vias, first connection terminals on the first die pads which couple the second vias to the first vias, second die pads in the dummy region and on the top surface of the first die, and second connection terminals on the second die pads and electrically insulated from the first vias and the second vias. Each of the second die pads has a rectangular planar shape whose major axis is provided along a direction that leads away from the signal region.

公开(公告)号：US12098493B2

公开(公告)日：2024-09-24

申请号：US17577102

申请日：2022-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngjin Cho ,  Kanghyun Lee ,  Byoungyull Yang ,  Jongho Lee ,  Sanggyu Jung

IPC: B01D29/23 ,  B01D29/58 ,  B01D35/02 ,  B01D35/30 ,  B01D37/04 ,  D06F23/02 ,  D06F39/08 ,  D06F39/10

CPC classification number: D06F39/10 ,  B01D29/23 ,  B01D29/58 ,  B01D35/02 ,  B01D35/30 ,  B01D37/046 ,  D06F23/02 ,  D06F39/08 ,  D06F39/085 ,  B01D2201/0415 ,  B01D2201/167 ,  B01D2201/305 ,  B01D2201/325

Abstract: A filter device includes a case, an external filter disposed inside the case to filter substances introduced into the case and configured to be movable with respect to the case, and an internal filter disposed inside the external filter to filter the substances introduced into the case and configured to be movable with respect to the external filter.

公开(公告)号：US11862603B2

公开(公告)日：2024-01-02

申请号：US17001978

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewook Kim ,  Jongho Lee ,  Jeongjoon Oh ,  Hyeon Hwang

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/532 ,  H01L25/065

CPC classification number: H01L25/0652 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/06589

Abstract: A semiconductor package includes a package substrate; a plurality of lower chip structures on the package substrate; an upper chip structure on the plurality of lower chip structures and covering portions of upper surfaces of the plurality of lower chip structures; a non-conductive adhesive layer on a lower surface of the upper chip structure and receiving upper portions of the plurality of lower chip structures; and a molded member on the plurality of lower chip structures and the upper chip structure.

公开(公告)号：US20230420610A1

公开(公告)日：2023-12-28

申请号：US18213608

申请日：2023-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mingu Ko ,  Seungmi Son ,  Dongmyung Shin ,  Seongseok Yang ,  Jongho Lee

IPC: H01L33/10 ,  H01L33/38 ,  H01L33/40

CPC classification number: H01L33/10 ,  H01L33/405 ,  H01L33/385

Abstract: A semiconductor light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer including an upper surface having a first region and a second region surrounding the first region, and active layer, and a second conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer being provided in sequence on the first region, a transparent electrode layer provided on the second conductivity-type semiconductor layer, and a distributed Bragg reflector (DBR) layer provided on the insulating layer, the DBR including a first insulating film having a first refractive index and a second insulating film having a second refractive index different from the first refractive index, where the insulating layer and the DBR layer includes a plurality of holes connected to a contact region of the transparent electrode layer.

公开(公告)号：US20230343560A1

公开(公告)日：2023-10-26

申请号：US18217043

申请日：2023-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung Oh ,  Jaeho Kwak ,  Boeun Jang ,  Seokyeon Hwang ,  Yongseok Seo ,  Sangsoo Kim ,  Seunghwan Kim ,  Jongho Park ,  Yongkwan Lee ,  Jongho Lee ,  Daewook Kim ,  Wonpil Lee ,  Changkyu Choi

IPC: H01J37/32 ,  C23C16/455

CPC classification number: H01J37/32449 ,  C23C16/45504 ,  C23C16/45589 ,  H01J37/32633 ,  H01J37/32357 ,  C23C16/45591 ,  C23C16/45502 ,  C23C16/4583

Abstract: A surface treatment apparatus and a surface treatment system having the same are disclosed. The surface treatment apparatus includes a process chamber in which the surface treatment process is conducted, a plasma generator for generating process radicals as a plasma state for the surface treatment process, the plasma generator being positioned outside of the process chamber and connected to the process chamber by a supply duct, a heat exchanger arranged on the supply duct and cooling down temperature of the process radicals passing through the supply duct and a flow controller controlling the process radicals to flow out of the process chamber. The flow controller is connected to a discharge duct through which the process radicals are discharged outside the process chamber. The plasma surface treatment process is conducted to the package structure having minute mounting gap without the damages to the IC chip and the board.

公开(公告)号：US11639298B2

公开(公告)日：2023-05-02

申请号：US17150089

申请日：2021-01-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungha Park ,  Jongho Lee ,  Yeonwoo Cho ,  Sungpil Choi

IPC: C02F1/44 ,  C02F1/00 ,  C02F9/00 ,  B01D29/52 ,  B01D29/56 ,  B01D29/60

Abstract: A water purifier is provided. The water purifier includes a raw water flow path provided to introduce raw water from an outside, a clean water flow path connected to the raw water flow path, pre-treatment filters arranged in parallel on the clean water flow path to filter the raw water, and a water purifying filter arranged on the clean water flow path to receive clean water discharged from the pre-treatment filters.

公开(公告)号：US20230082384A1

公开(公告)日：2023-03-16

申请号：US17730993

申请日：2022-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho Yoon ,  Yeongbeom Ko ,  Hwayoung Lee ,  Junggeun Shin ,  Hyunsu Sim ,  Kwangyong Lee ,  Jongho Lee

IPC: H01L21/67 ,  H01L21/683 ,  B23K26/53

Abstract: A substrate processing apparatus includes a chuck table including a mounting table having a mounting surface on which a substrate is mounted, wherein the mounting surface is a curved surface; and a laser supply head configured to irradiate the substrate attached to the mounting table with a laser beam.