-
31.发明申请Multidirectional Semiconductor Device Package Thermal Enhancement Systems and Methods 审中-公开多向半导体器件封装热增强系统和方法公开(公告)号：US20090045503A1
公开(公告)日：2009-02-19
申请号：US11840604
申请日：2007-08-17
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/3675 , H01L23/42 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2224/73253 , H01L2924/00014 , H01L2924/1532 , H01L2924/16152 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention provides thermally-enhanced semiconductor device package systems and associated methods for reducing thermal resistance for improved heat egress. In one disclosed embodiment of the invention, a semiconductor device package system includes a packaged semiconductor device having operable contacts for external electrical coupling. The packaged device has an exposed surface, and a heat spreader is affixed to the exposed device surface. The heat spreader includes a portion extending in a configuration coplanar with the device contacts. In another example of a preferred embodiment of the invention, a semiconductor device package system includes an external heat sink affixed to a heat spreader, the heat spreader having a portion extending in a configuration coplanar with the device contacts. According to exemplary systems and methods of the invention package systems are provided with a heat spreader so configured that the junction-to-board thermal resistance and junction-to-case thermal resistance are both reduced.
摘要翻译： 本发明提供了热增强型半导体器件封装系统和相关方法，用于降低热阻以改善热出口。 在本发明的一个公开的实施例中，半导体器件封装系统包括具有用于外部电耦合的可操作触点的封装半导体器件。 包装的装置具有暴露的表面，并且散热器固定到暴露的装置表面。 散热器包括在与设备触点共面的构型中延伸的部分。 在本发明的优选实施例的另一示例中，半导体器件封装系统包括固定到散热器的外部散热器，散热器具有在与器件触点共面的构型中延伸的部分。 根据本发明的示例性系统和方法，封装系统设置有散热器，其被配置成使得结对板热阻和结到壳的热阻都减小。
-
32.发明授权公开(公告)号：US06789240B2
公开(公告)日：2004-09-07
申请号：US10335837
申请日：2003-01-02
IPC分类号： G06F748
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4845 , H01L2224/48463 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/78301 , H01L2224/85201 , H01L2224/85205 , H01L2224/859 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/01026 , H01L2924/01004 , H01L2924/00 , H01L2924/00015 , H01L2924/013 , H01L2924/00013
摘要： A computerized system and method for inspecting and measuring a ball-shaped wire bond formed by an automated bonder pre-programmed to attach a connecting bond onto a bond pad of an integrated circuit by first obtaining a first image of said bond pad before bond attachment, then determining the coordinates of the center of said pad. Second, the bonder is instructed to attach a ball-shaped wire bond to the center of said pad. Next, a second image of said bond pad is obtained after bond attachment; this second image comprises an image of the ball-shaped portion of the bond and an image of the wire portion of said bond. The coordinates of the center of the ball-shaped portion of the bond are obtained by computer processing of the first and second images. The coordinates of the bond center and the pad center are compared, creating information for quality control of the bonder instruction and the bonding process. Finally, the bond process quality is controlled by inputting new bonder instruction for correcting any identified differences between the center coordinates.
摘要翻译： 一种计算机化系统和方法，用于检查和测量由预编程的自动化接合器形成的球形线接合件，以通过在接合附接之前首先获得所述接合焊盘的第一图像，以将连接接合附接到集成电路的接合焊盘上， 然后确定所述垫的中心的坐标。 其次，指示接合器将球形引线接合到所述垫的中心。 接下来，在粘合附着后获得所述接合焊盘的第二图像; 该第二图像包括接合的球形部分的图像和所述键的线部分的图像。 通过第一和第二图像的计算机处理获得接合的球形部分的中心的坐标。 比较焊接中心和焊盘中心的坐标，创建焊接机指令质量控制和焊接过程的信息。 最后，通过输入新的粘合剂指令来校正中心坐标之间的任何识别的差异来控制粘合过程质量。
-
公开(公告)号：US06768210B2
公开(公告)日：2004-07-27
申请号：US10001302
申请日：2001-11-01
IPC分类号： H01L2348
CPC分类号： H01L24/10 , H01L23/3128 , H01L23/4334 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/05018 , H01L2224/05027 , H01L2224/05559 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/13 , H01L2224/1308 , H01L2224/13082 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13169 , H01L2224/13171 , H01L2224/13172 , H01L2224/13181 , H01L2224/13184 , H01L2224/81208 , H01L2224/81801 , H01L2224/81894 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： A semiconductor chip having a planar active surface including an integrated circuit; the circuit has metallization patterns including a plurality of contact pads. Each of these contact pads has an added conductive layer on the circuit metallization. This added layer has a conformal surface adjacent the chip and a planar outer surface, and this outer surface is suitable to form metallurgical bonds without melting. The chip contact pads may have a distribution such that an area portion of the active chip surface is available for attaching a thermally conductive plate; this plate has a thickness compatible with the thickness of the conductive pad layer.
摘要翻译： 一种具有包括集成电路的平面有源面的半导体芯片; 电路具有包括多个接触焊盘的金属化图案。 这些接触焊盘中的每一个在电路金属化上具有添加的导电层。 该添加层具有与芯片相邻的共形表面和平坦的外表面，并且该外表面适于形成冶金结合而不熔化。 芯片接触焊盘可以具有使得有源芯片表面的区域部分可用于附接导热板的分布; 该板具有与导电焊盘层的厚度相适应的厚度。
-
公开(公告)号：US08816513B2
公开(公告)日：2014-08-26
申请号：US13591719
申请日：2012-08-22
申请人： Matthew David Romig , Lance Cole Wright , Leslie Edward Stark , Frank Stepniak , Sreenivasan K. Koduri
发明人： Matthew David Romig , Lance Cole Wright , Leslie Edward Stark , Frank Stepniak , Sreenivasan K. Koduri
CPC分类号： H01L23/00 , B41M3/06 , H01L23/48 , H01L24/24 , H01L24/25 , H01L24/76 , H01L24/80 , H01L24/82 , H01L25/0657 , H01L2224/24145 , H01L2224/24227 , H01L2224/321 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82102 , H05K1/092 , H05K1/181 , H05K3/125 , H05K3/32 , H05K2201/09272 , H05K2201/10151 , H05K2201/10454 , Y02P70/611
摘要： One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.
摘要翻译： 制造电子组件的一种方法包括将一个电气基板安装在另一个电气基板上，其中一个基板上的表面横向于另一个基板的面表面定向。 该方法还包括在表面上喷墨印刷导电迹线，导电迹线将一个基底上的电接触与另一基底上的电连接器连接。 电子组件可以包括具有大致平坦表面的第一基板，其上具有第一多个电触点; 第二基板，其具有大致平坦的表面，其上具有第二多个电触点，所述第二基板的表面横向于所述第一基板的表面延伸; 以及至少一个连续的导电油墨迹线将所述第一多个电触点中的至少一个与所述第二多个电触点中的至少一个电连接。
-
35.发明申请公开(公告)号：US20130221455A1
公开(公告)日：2013-08-29
申请号：US13405513
申请日：2012-02-27
CPC分类号： B81C1/00246 , B81B7/0067 , B81B2201/0207 , B81C1/00269 , G01J5/045 , G01J5/12 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/24245 , H01L2224/32245 , H01L2224/82039 , H01L2224/92144 , H01L2224/97 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/12042 , H01L2924/1433 , H01L2924/1434 , H01L2924/1461 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film (111) touching the plate surface and a layer (112) of adhesive stacked on the metal film.
摘要翻译： 一种嵌入式微电子机械系统（MEMS）（100），包括嵌入在绝缘板（120）中的半导体芯片（101），所述芯片具有包括辐射传感器MEMS（105）的空腔（102），所述开口 在由芯片感测到的辐射（150）透射的板（110）覆盖的芯片表面处的腔的空腔（104）。 离开空腔的板表面具有裸露的中心区域，以暴露于由空腔内的MEMS感测的辐射，以及由接触板表面的金属膜（111）覆盖的周边区域和覆盖板（112）的层 粘合剂堆叠在金属膜上。
-
公开(公告)号：US20130034936A1
公开(公告)日：2013-02-07
申请号：US13585393
申请日：2012-08-14
CPC分类号： H01L25/074 , H01L23/492 , H01L23/49562 , H01L23/49568 , H01L23/60 , H01L23/645 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L25/16 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05664 , H01L2224/16 , H01L2224/32245 , H01L2224/37147 , H01L2224/73153 , H01L2224/73203 , H01L2224/73253 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/078 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , Y10T29/49117 , Y10T29/49121 , Y10T29/49204 , Y10T83/0443 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： Methods for fabricating a packaged semiconductor device includes providing a metal plate having a single flat first surface and a parallel second surface. The flat first surface ending in four sawed plate sides. The plate having on the second surface at least one mesa of the same metal and a linear array of insular mesas. The at least one mesa is raised from the second surface. A single terminal of a semiconductor chip is attached to the second plate surface.
摘要翻译： 制造封装半导体器件的方法包括提供具有单个平坦第一表面和平行第二表面的金属板。 平坦的第一表面以四个锯片侧面结束。 该板在第二表面上具有相同金属的至少一个台面和岛状台面的线性阵列。 所述至少一个台面从所述第二表面升高。 半导体芯片的单个端子附接到第二板表面。
-
37.发明申请公开(公告)号：US20120126383A1
公开(公告)日：2012-05-24
申请号：US13364980
申请日：2012-02-02
IPC分类号： H01L23/495
CPC分类号： H01L23/49582 , H01L21/4842 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48639 , H01L2224/49171 , H01L2224/73265 , H01L2224/85439 , H01L2924/00015 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/45147
摘要： An apparatus comprising a metallic leadframe including a pad and a plurality of leads. Each having a first and a parallel second surface and sidewalls normal to the surfaces. The pad and each lead having a core of a first metal and layers of a second metal different from the first metal on each surface. The first metal exposed at the sidewalls and at portions of the first surface of the pad. A semiconductor chip is assembled on the leadframe. Portions of the assembled chip and the leadframe are packaged in a polymeric encapsulation compound.
摘要翻译： 一种包括金属引线框架的装置，包括焊盘和多个引线。 每个具有第一和平行的第二表面和垂直于表面的侧壁。 垫和每个引线具有第一金属的芯和不同于每个表面上的第一金属的第二金属的层。 暴露在垫的第一表面的侧壁和部分处的第一金属。 半导体芯片组装在引线框架上。 组装芯片和引线框架的部分被封装在聚合物封装化合物中。
-
38.发明申请公开(公告)号：US20120086112A1
公开(公告)日：2012-04-12
申请号：US12902271
申请日：2010-10-12
IPC分类号： H01L23/495
CPC分类号： H01L23/495 , H01L23/3107 , H01L23/4951 , H01L23/49548 , H01L24/16 , H01L2224/131 , H01L2224/16245 , H01L2924/0001 , H01L2924/14 , H01L2924/1461 , H01L2924/014 , H01L2224/13099 , H01L2924/00
摘要： A pallet (501) supporting a half-etched leadframe with cantilever-type leads (403) without metallic supports during the step of attaching components (510) to the leads in order to assemble an electronic system. After assembly, the pallet is removed before the molding step that encapsulates (601a) the components on the leadframe and mechanically supports (601b) the cantilever leads. The pallet is machined from metal or inert plastic material, tolerates elevated temperatures during soldering, and is reusable for the next assembly batch.
摘要翻译： 在将部件（510）附接到引线的步骤中，以便组装电子系统的托板（501），其支撑具有悬臂式引线（403）的半蚀刻引线框架，而没有金属支撑件。 在组装之后，在模制步骤之前移除托盘（601a），并将构件（601a）封装在引线框架上并机械地支撑（601b）悬臂引线。 托盘由金属或惰性塑料材料加工而成，在焊接过程中可承受高温，并可重复使用下一个装配批次。
-
公开(公告)号：US20100197045A1
公开(公告)日：2010-08-05
申请号：US12759476
申请日：2010-04-13
CPC分类号： H01L23/495 , H01F17/045 , H01F27/027 , H01F27/40 , H01L23/3121 , H01L23/49575 , H01L23/645 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/16 , H01L2224/13099 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48092 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48472 , H01L2224/48599 , H01L2224/49 , H01L2224/73253 , H01L2224/73265 , H01L2224/85 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： An electronic device (100) with one or more semiconductor chips (102) has an inductor (101) assembled on or under the chips. The inductor includes a ferromagnetic body (111) and a wire (104) wrapped around the body to form at least a portion of a loop; the wire ends (104a) are connected to the chips. The assembly is attached to a substrate (103), which may be a leadframe. The device may be encapsulated in molding compound (140) so that the inductor can double as a heat spreader (111c), enhancing the thermal device characteristics.
摘要翻译： 具有一个或多个半导体芯片（102）的电子设备（100）具有组装在芯片上或芯片下方的电感器（101）。 所述电感器包括铁磁体（111）和围绕所述主体缠绕以形成环的至少一部分的线（104）; 电线端部（104a）连接到芯片。 组件附接到可以是引线框架的基板（103）。 该装置可以封装在模制化合物（140）中，使得电感器可以作为散热器（111c）加倍，从而增强热装置特性。
-
40.发明授权公开(公告)号：US06861608B2
公开(公告)日：2005-03-01
申请号：US10161257
申请日：2002-05-31
CPC分类号： H01L21/67271 , H01L21/67132 , H01L21/67144
摘要： Various preferred processes and equipment are described herein that more efficiently handle residual semiconductor parts during packaging. The processes include picking and removing all of the bad parts from a wafer before picking the good parts and picking all of the good parts first without picking any part necessary to align the wafer. The equipment includes several embodiments of a transfer machine that accommodates the efficient transfer of semiconductor parts between tacky film, waffle packs and tape and reel containment systems. Residual good parts are stored in waffle packs and can be subsequently reused in the packaging process.
摘要翻译： 本文描述了各种优选的方法和设备，其在包装期间更有效地处理残余的半导体部件。 这些过程包括在挑选好的部件之前从晶片中挑选和去除所有不良部件，并首先挑选所有的良好部件，而不需要选择任何必要的对准晶片的部分。 该设备包括转移机器的几个实施例，其适应于胶粘膜，华夫饼纸包和带卷收容系统之间的半导体部件的有效转移。 剩余的良好部件储存在华夫饼包中，随后可以在包装过程中重复使用。
-
-
-
-
-
-
-
-
-
搜索结果
59 条记录 (耗时 0.037 秒)
