公开(公告)号：US07498610B2

公开(公告)日：2009-03-03

申请号：US11325322

申请日：2006-01-05

申请人： Chang Wook Kim ,  Seon Goo Lee

发明人： Chang Wook Kim ,  Seon Goo Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014

摘要： An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

摘要翻译： LED壳体，其中导热部分具有芯片安装区域，与芯片安装区域相对的热连接区域和它们之间的颈部。 固定部件具有与颈部接合的第一端。 电连接部分具有与芯片安装区域相邻放置的导线连接区域和连接到电线连接区域的外部电源连接区域。 成型材料的壳体整体地保持导热部分，固定部分和电连接部分，同时将电连接部分与导热部分隔离。 LED壳体在两侧固定导热部件的颈部，从而将导热部件稳定地连接到壳体主体。 固定部件可以将热量从热传导部分扩散到LED壳体的横向区域，从而更有效地散热。

公开(公告)号：US20070181899A1

公开(公告)日：2007-08-09

申请号：US11646424

申请日：2006-12-28

申请人： Min Sang Lee ,  Byung Man Kim ,  Seon Goo Lee ,  Dong Yeoul Lee ,  Alex Chae ,  Je Myung Park

发明人： Min Sang Lee ,  Byung Man Kim ,  Seon Goo Lee ,  Dong Yeoul Lee ,  Alex Chae ,  Je Myung Park

IPC分类号： H01L33/00

CPC分类号： H01L33/647 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014

摘要： Provided an LED package comprising a first package composed of a first region serving as a first electrode and a second region which is formed so as to overlap a portion of the first region, the second region defining a molding material filling cavity; one or more LED chips mounted on the first region of the first package; a second package formed under the second region of the first package, the second package being insulated by the first region and an insulating member so as to serve as a second electrode; conductive wire for electrically connecting the LED chips and the second package; and a molding material filled inside the second region of the first package so as to protect the LED chips and the conductive wire. The first and second packages are formed of aluminum.

摘要翻译： 提供一种LED封装，其包括由用作第一电极的第一区域和与所述第一区域的一部分重叠形成的第二区域构成的第一封装，所述第二区域限定模制材料填充腔; 安装在第一包装的第一区域上的一个或多个LED芯片; 形成在所述第一封装的第二区域下方的第二封装，所述第二封装由所述第一区域和绝缘构件绝缘，以用作第二电极; 用于电连接LED芯片和第二封装的导线; 以及填充在第一封装的第二区域内的成型材料，以保护LED芯片和导线。 第一和第二包装由铝形成。

公开(公告)号：US06469258B1

公开(公告)日：2002-10-22

申请号：US09648946

申请日：2000-08-23

申请人： Choon Heung Lee ,  Won Dai Shin ,  Chang Hoon Ko ,  Won Sun Shin ,  Seon Goo Lee ,  Won Kyun Lee ,  Tae Hoan Jang ,  Jun Young Yang

发明人： Choon Heung Lee ,  Won Dai Shin ,  Chang Hoon Ko ,  Won Sun Shin ,  Seon Goo Lee ,  Won Kyun Lee ,  Tae Hoan Jang ,  Jun Young Yang

IPC分类号： H01R1204

CPC分类号： H05K1/0259 ,  H01L23/60 ,  H01L2924/0002 ,  H05K1/0215 ,  H05K3/0052 ,  H05K3/28 ,  H05K2201/09354 ,  H01L2924/00

摘要： A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby preventing a breakdown of the circuit board or semiconductor chip caused by electrostatic charges. The printed circuit board for semiconductor package includes: a resinous substrate; a chip mounting region formed on the top surface of the resinous substrate for mounting a semiconductor chip thereon; a plurality of fine circuit patterns radially disposed in the circumference of the chip mounting region and extending to the edge of the chip mounting region; a plurality of ball lands formed in an array on the bottom surface of the resinous substrate, to be fused to conductive balls; a conductive via hole connecting the circuit patterns on the top surface of the resinous substrate to the ball lands on the bottom surface of the resinous substrate; a cover coat applied to the top and bottom surfaces of the resinous substrate to protect the circuit patterns from an external environment and make the ball lands open to the exterior; and a means for removing electrostatic charges provided at the edge of the substrate and connected to the plural circuit patterns to remove electrostatic charges in the manufacture of semiconductors.

摘要翻译： 用于半导体封装的电路板被设计为在基于电路板的半导体封装的制造中提供与相应设备的完全接地，从而防止由静电电荷引起的电路板或半导体芯片的损坏。 用于半导体封装的印刷电路板包括：树脂基板; 芯片安装区，形成在树脂基板的顶表面上，用于在其上安装半导体芯片; 多个精细电路图案，其径向设置在芯片安装区域的周边并延伸到芯片安装区域的边缘; 在树脂基板的底面上以阵列形成的多个球状接头，与导电球熔合; 导电通孔，其将树脂基材的顶表面上的电路图案连接到树脂基材的底表面上的球接头; 涂覆在树脂基材的顶表面和底表面上的保护层，以保护电路图案免受外部环境的影响，并使球体向外露出; 以及用于去除设置在基板的边缘并连接到多个电路图案以在半导体制造中去除静电电荷的静电电荷的装置。

公开(公告)号：US06982485B1

公开(公告)日：2006-01-03

申请号：US10076701

申请日：2002-02-13

申请人： Seon Goo Lee ,  Young Ho Kim ,  Choon Heung Lee

发明人： Seon Goo Lee ,  Young Ho Kim ,  Choon Heung Lee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/28 ,  H01L29/40

CPC分类号： H01L24/85 ,  H01L23/36 ,  H01L23/49805 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85815 ,  H01L2224/85986 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A semiconductor package and method of producing the same has a substrate having a resin layer with first and second surfaces. A plurality of electrically conductive patterns are formed on the resin layer. An aperture is also formed at the center of the substrate. A first semiconductor chip has first and second surfaces. The second surface of the first semiconductor chip has a plurality of input/output pads formed thereon. The first semiconductor chip is placed in the aperture of the substrate. A plurality of first conductive wires connect the input/output pads of the first semiconductor chip to the electrically conductive patterns formed on the second surface of the resin layer. A second semiconductor chip having first and second surfaces is coupled to the first semiconductor chip. The second surface of the second semiconductor chip has a plurality of input/output pads formed thereon. A plurality of second conductive wires connect the input/output pads of the second semiconductor chip to the electrically conductive patterns formed on the second surface of the resin layer. An encapsulate is used to encapsulate the aperture of the substrate, the first and second semiconductor chips, and the first and second conductive wires. A plurality of conductive balls are coupled to the electrically conductive patterns formed on the second surface of the resin layer of the substrate.

摘要翻译： 半导体封装及其制造方法具有具有第一和第二表面的树脂层的基板。 在树脂层上形成多个导电图案。 在基板的中心处还形成有孔。 第一半导体芯片具有第一和第二表面。 第一半导体芯片的第二表面具有形成在其上的多个输入/输出焊盘。 第一半导体芯片被放置在基板的孔中。 多个第一导线将第一半导体芯片的输入/输出焊盘连接到形成在树脂层的第二表面上的导电图案。 具有第一和第二表面的第二半导体芯片被耦合到第一半导体芯片。 第二半导体芯片的第二表面具有形成在其上的多个输入/输出焊盘。 多个第二导线将第二半导体芯片的输入/输出焊盘连接到形成在树脂层的第二表面上的导电图案。 封装用于封装基板，第一和第二半导体芯片以及第一和第二导线的孔径。 多个导电球耦合到形成在基板的树脂层的第二表面上的导电图案。

公开(公告)号：US20050199884A1

公开(公告)日：2005-09-15

申请号：US10890178

申请日：2004-07-14

申请人： Seon Goo Lee ,  Seung Mo Park ,  Chan Wang Park ,  Jung Kyu Park

发明人： Seon Goo Lee ,  Seung Mo Park ,  Chan Wang Park ,  Jung Kyu Park

IPC分类号： H01L27/15 ,  H01L33/48 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L33/54 ,  H01L24/17 ,  H01L24/73 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high power LED package, in which substantially planar first and second lead frames made of high reflectivity metal are spaced from each other for a predetermined gap. An LED chip is seated on at least one of the lead frames, and having terminals electrically connected to the lead frames, respectively. A package body made of resin seals the LED chip therein while fixedly securing the lead frame in the bottom thereof. The encapsulant preferably fills up the gap between the first and second lead frames. The LED package is structured to raise thermal radiation efficiency thereby reducing the size and thickness thereof.

摘要翻译： 大功率LED封装，其中由高反射率金属制成的大致平面的第一和第二引线框架彼此间隔开预定的间隙。 LED芯片位于至少一个引线框架上，并且具有分别电连接到引线框架的端子。 由树脂制成的包装体将LED芯片密封在其中，同时将引线框固定在其底部。 密封剂优选地填充第一和第二引线框架之间的间隙。 LED封装构造为提高热辐射效率，从而减小其尺寸和厚度。

公开(公告)号：US06936922B1

公开(公告)日：2005-08-30

申请号：US10672886

申请日：2003-09-26

申请人： Sung Soon Park ,  Sang Jae Jang ,  Choon Heung Lee ,  Seon Goo Lee ,  Eun Sook Sohn ,  Sung Su Park

发明人： Sung Soon Park ,  Sang Jae Jang ,  Choon Heung Lee ,  Seon Goo Lee ,  Eun Sook Sohn ,  Sung Su Park

IPC分类号： H01L23/16 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K3/3436 ,  H01L23/16 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09736 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electrical substrate useful for semiconductor packages is disclosed. The electrical substrate includes a core insulative layer. A first surface of the insulative layer has circuit patterns thereon. Some of the circuit patterns are stepped in their heights from the first surface, in that a first subportion of the circuit pattern, including a ball land, extends further from the first surface than a second subportion of the same circuit pattern, and also extends further from the first surface than a ball land of other circuit patterns. Accordingly, solder balls fused to the ball lands of the stepped circuit patterns extend further from the first surface than same-size solder balls fused to the ball lands of the non-stepped circuit patterns, thereby circumventing electrical connectivity problems that may arise from warpage of the electrical substrate.

摘要翻译： 公开了一种可用于半导体封装的电气基板。 电气基板包括芯绝缘层。 绝缘层的第一表面具有电路图案。 电路图案中的一些从第一表面上升到它们的高度，因为电路图形的第一子部分（包括球形区域）比第一表面的第一子部分比相同电路图案的第二子部分进一步延伸，并且还进一步延伸 从第一个表面比其他电路图案的球场。 因此，熔融到阶梯式电路图案的球台的焊球比与非阶梯式电路图案的球面熔合的相同尺寸的焊球相比，从第一表面延伸出来，从而避免了由于翘曲引起的电连接问题 电气基板。

公开(公告)号：US06717248B2

公开(公告)日：2004-04-06

申请号：US10306627

申请日：2002-11-26

申请人： Won Sun Shin ,  Seon Goo Lee ,  Do Sung Chun ,  Tae Hoan Jang ,  Vincent D. DiCaprio

发明人： Won Sun Shin ,  Seon Goo Lee ,  Do Sung Chun ,  Tae Hoan Jang ,  Vincent D. DiCaprio

IPC分类号： H01L2302

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern layer and selectively exposing the plurality of bond fingers and ball lands, the circuit pattern layer being formed on the first face of the resin film, the circuit board having a through hole at the center thereof, the semiconductor chip being placed in the through hole; electrical connection means for electrically connecting the input/output pads of the semiconductor chip to the bond fingers of the circuit board; an encapsulant for encapsulating the semiconductor chip, connection means and a part of the circuit board; and a plurality of conductive balls fused to the circuit board. Accordingly, the semiconductor package becomes very thin and its heat spreading performance is improved.

公开(公告)号：US06515356B1

公开(公告)日：2003-02-04

申请号：US09566069

申请日：2000-05-05

申请人： Won Sun Shin ,  Seon Goo Lee ,  Do Sung Chun ,  Tae Hoan Jang ,  Vincent DiCaprio

发明人： Won Sun Shin ,  Seon Goo Lee ,  Do Sung Chun ,  Tae Hoan Jang ,  Vincent DiCaprio

IPC分类号： H01L2302

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed of a resin film having a first face and a second face, a circuit pattern layer including a plurality of bond fingers and ball lands, and a cover coat covering the circuit pattern layer and selectively exposing the plurality of bond fingers and ball lands, the circuit pattern layer being formed on the first face of the resin film, the circuit board having a through hole at the center the semiconductor chip being placed in the through hole; electrical connection means for electrically connecting the input/output pads of the semiconductor chip to the bond fingers of the circuit board; an encapsulant for encapsulating the semiconductor chip, connection means and a part of the circuit board; and a plurality of conductive balls fused to the circuit board. Accordingly, the semiconductor package becomes very thin and its heat spreading performance is improved.

摘要翻译： 提供了一种半导体封装及其制造方法。 半导体封装的一个实施例包括：具有第一面和第二面的半导体芯片，第一面具有形成在其上的多个输入/输出焊盘; 由具有第一面和第二面的树脂膜构成的电路板，包括多个接合指和球面的电路图案层，以及覆盖电路图案层并且选择性地暴露多个键合指状物和球的覆盖层 所述电路图案层形成在所述树脂膜的第一面上，所述电路板在所述半导体芯片的中心处具有通孔，所述通孔位于所述通孔中; 电连接装置，用于将半导体芯片的输入/输出焊盘电连接到电路板的键合指状物; 用于封装半导体芯片的密封剂，连接装置和电路板的一部分; 以及与电路板熔接的多个导电球。 因此，半导体封装变得非常薄，并且其散热性能得到改善。

公开(公告)号：US5986334A

公开(公告)日：1999-11-16

申请号：US942784

申请日：1997-10-02

申请人： Seon Goo Lee

发明人： Seon Goo Lee

IPC分类号： H01L23/28 ,  H01L23/12 ,  H01L23/13 ,  H01L23/24 ,  H05K3/34 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L23/24 ,  H01L23/13 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3426

摘要： A semiconductor package having a light, thin, simple and compact structure including outer leads having a minimum length and a resin encapsulate having a minimum volume. The semiconductor package includes a package body, a semiconductor chip mounted on a central portion of the body, inner and outer leads bonded to a peripheral portion of an upper surface of the body by an insulating layer in such a manner that the leads are supported on the body, conductive wires or bumps for electrically connecting the inner leads to the semiconductor chip, a resin encapsulate for encapsulating the semiconductor chip, the conductive wires or bumps and the inner leads. Each outer lead has an end positioned at a level higher than an upper surface of the semiconductor chip so that a boundary portion defined between the associated outer and inner leads serves as a barrier for the resin encapsulate. The end of each outer lead is exposed outside the resin encapsulate and extending to a peripheral edge of the body.

摘要翻译： 一种具有轻，薄，简单且紧凑结构的半导体封装，包括具有最小长度的外引线和具有最小体积的树脂封装。 半导体封装包括封装体，安装在主体的中心部分的半导体芯片，内引线和外引线通过绝缘层连接到主体的上表面的周边部分，使得引线被支撑在 用于将内引线电连接到半导体芯片的本体，导线或凸块，用于封装半导体芯片的树脂封装，导线或凸块和内引线。 每个外部引线的端部位于比半导体芯片的上表面高的高度，使得限定在相关联的外引线和内引线之间的边界部分用作树脂封装的阻挡层。 每个外引线的端部暴露在树脂封装外部并延伸到主体的周边边缘。

公开(公告)号：US08105854B2

公开(公告)日：2012-01-31

申请号：US12612334

申请日：2009-11-04

申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/62 ,  F21K9/00 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/021 ,  H05K3/244 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

摘要翻译： 通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。 封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。 本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。 这又提高了光源的发光效率，最终实现了高质量的光源。