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    Wiring substrate
    33.
    发明授权
    Wiring substrate 有权
    接线基板

    公开(公告)号：US09538664B2

    公开(公告)日：2017-01-03

    申请号：US14104282

    申请日：2013-12-12

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Hiroharu Yanagisawa ,  Kentaro Kaneko ,  Kazuhiro Oshima ,  Junichi Nakamura

    IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H05K3/0035 ,  H05K1/0366 ,  H05K3/0038 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/0346

    Abstract: A wiring substrate includes a first wiring layer with a wiring pattern and a metal foil. A first insulating layer includes a first through hole having a first end facing the metal foil and a second end. A second wiring layer includes a first opening having a diameter smaller than the second end. A second insulating layer includes a second through hole having a third end facing the wiring pattern and a fourth end. A third wiring layer includes a second opening having a diameter smaller than the fourth end. A first via is filled in the first opening, the first through hole, and a first recess, in the metal foil, having a diameter greater than the first end. A second via is filled in the second opening, the second through hole, and a second recess, in the wiring pattern, having a diameter greater than the third end.

    Abstract translation: 布线基板包括具有布线图案的第一布线层和金属箔。 第一绝缘层包括具有面向金属箔的第一端和第二端的第一通孔。 第二布线层包括直径小于第二端的第一开口。 第二绝缘层包括具有面向布线图案的第三端和第四端的第二通孔。 第三布线层包括直径小于第四端的第二开口。 第一通孔被填充在金属箔中的第一开口，第一通孔和第一凹部中，其具有大于第一端的直径。 第二通孔填充在布线图案中的第二开口，第二通孔和第二凹槽中，其直径大于第三端。

    Wiring board
    35.
    发明授权
    Wiring board 有权
    接线板

    公开(公告)号：US09478839B2

    公开(公告)日：2016-10-25

    申请号：US14061926

    申请日：2013-10-24

    Applicant: FUJIKURA LTD.

    Inventor： Kohei Matsumaru

    IPC: H01P3/08 ,  H01P3/02 ,  H05K1/02

    CPC classification number: H01P3/026 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/025 ,  H05K1/0271 ,  H05K1/0274 ,  H05K2201/09227 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10121

    Abstract: Provided is a wiring board including: a board; a differential transmission line constituted by two wirings disposed on the board in parallel; an insulation resin layer which is formed on part of a face of the board. A stepped portion constituted by a lateral face of the insulation resin layer is formed at a boundary between the face of the board and a top face of the insulation resin layer. The two wirings extend from the face of the board to the top face of the insulation resin layer so as to traverse the stepped portion. The extending direction of the wirings traversing the stepped portion and the direction of a periphery are perpendicular to each other in a plan view of the board, the periphery being defined by a boundary between the top face of the insulation resin layer and the lateral face of the insulation resin layer.

    Abstract translation: 提供一种布线板，包括：板; 差动传输线，由平行布置在所述板上的两条配线构成; 形成在板的一部分的绝缘树脂层。 由绝缘树脂层的侧面构成的阶梯部分形成在板的表面和绝缘树脂层的顶面之间的边界处。 两个配线从板的表面延伸到绝缘树脂层的顶面，以便横越阶梯部。 穿过阶梯部分的布线的延伸方向和周边的方向在板的平面图中彼此垂直，其周边由绝缘树脂层的顶面和侧面之间的边界限定 绝缘树脂层。

    Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate
    36.
    发明授权
    Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate 有权
    多层布线基板，探针卡，以及多层布线基板的制造方法

    公开(公告)号：US09456494B2

    公开(公告)日：2016-09-27

    申请号：US14231780

    申请日：2014-04-01

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Norio Sakai ,  Yoshihito Otsubo

    IPC: H05K1/09 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02 ,  H01L23/498 ,  H05K3/46

    CPC classification number: H05K1/0298 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/19105 ,  H05K1/115 ,  H05K3/4629 ,  H05K3/4652 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49165

    Abstract: A multilayer wiring substrate includes a substrate main body and a plurality of wiring lines. The substrate main body includes first and second main surfaces. The plurality of wiring lines extend from the first main surface toward the second main surface side in the substrate main body. The substrate main body includes a plurality of insulator layers laminated on each other. The wiring lines each include via conductors separately provided in the plurality of insulator layers. In at least one of the plurality of wiring lines, a diameter of the via conductor provided in a first insulator layer defining the first main surface of the substrate main body is smaller than a diameter of the via conductor provided in at least one of the plurality of insulator layers other than the first insulator layer.

    Abstract translation: 多层布线基板包括基板主体和多条布线。 基板主体包括第一和第二主表面。 多个布线从基板主体的第一主面向第二主面侧延伸。 基板主体包括彼此层叠的多个绝缘体层。 布线各自包括分开设置在多个绝缘体层中的通孔导体。 在多个布线中的至少一个中，设置在限定基板主体的第一主表面的第一绝缘体层中的通孔导体的直径小于设置在多个布线中的至少一个布线中的通孔导体的直径 的除了第一绝缘体层之外的绝缘体层。

    Method for manufacturing multilayer printed wiring board
    37.
    发明授权
    Method for manufacturing multilayer printed wiring board 有权
    多层印刷线路板的制造方法

    公开(公告)号：US09420708B2

    公开(公告)日：2016-08-16

    申请号：US13427231

    申请日：2012-03-22

    Applicant: Toshiaki Hibino ,  Takema Adachi

    Inventor： Toshiaki Hibino ,  Takema Adachi

    IPC: H01K3/10 ,  H05K3/46 ,  H05K3/44 ,  H01L23/498 ,  H01L21/48

    CPC classification number: H05K3/4608 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/445 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49124

    Abstract: A method for manufacturing a printed wiring board includes preparing a core substrate having a metal layer having a first penetrating hole and insulation layers formed on the metal layer such that the metal layer is interposed between the insulation layers, forming in the core substrate a second penetrating hole having a first opening portion aligned with the first penetrating hole on a first-surface side of the core substrate and a second opening portion aligned with the first penetrating hole on a second-surface side of the core substrate, forming a first conductor on a first surface of the core substrate, forming a second conductor on a second surface of the core substrate on the opposite side of the first surface of the core substrate, and filling a conductive material in the second penetrating hole such that a through-hole conductor connecting the first conductor and the second conductor is formed.

    Abstract translation: 一种制造印刷电路板的方法，包括制备具有第一穿透孔的金属层和形成在金属层上的绝缘层的芯基板，使得金属层插入在绝缘层之间，在芯基板中形成第二穿透 在芯基板的第一表面侧具有与第一贯通孔对准的第一开口部和与芯基板的第二表面侧的第一贯通孔对准的第二开口部， 在芯基板的第一表面上，在芯基板的第一表面的相对侧上的芯基板的第二表面上形成第二导体，并且在第二贯穿孔中填充导电材料，使得连接 形成第一导体和第二导体。

    Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate
    38.
    发明授权
    Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate 有权
    在薄玻璃基板中具有聚合物填充或聚合物衬里光学通孔的插入件

    公开(公告)号：US09417415B2

    公开(公告)日：2016-08-16

    申请号：US14288680

    申请日：2014-05-28

    Applicant: Georgia Tech Research Corporation

    Inventor： Rao R. Tummala ,  Chia-Te Chou ,  Venkatesh Sundaram

    IPC: G02B6/43 ,  G02B6/136 ,  H05K1/02

    CPC classification number: G02B6/43 ,  H05K1/0274 ,  H05K2201/09827

    Abstract: An optical interposer that includes a glass substrate having one or more optical vias extending through the glass substrate. A first optical polymer may be bonded to the substrate and to interior surfaces of the one or more optical vias. Implementations include one or more optical via cores comprising a second optical polymer that has a greater refractive index than the first optical polymer. The one or more optical via cores may be at least partially surrounded by the first optical polymer. Embodiments include encapsulated optical waveguides in communication with the optical vias and/or via cores. Example implementations include layers of electrical insulation, electrical traces, and electrical vias. A method of manufacture includes forming the optical vias by laser ablation. Certain embodiments may include chemically etching the inside of the vias to improve surface roughness.

    Abstract translation: 一种光学插入器，其包括具有延伸穿过玻璃基板的一个或多个光学通孔的玻璃基板。 第一光学聚合物可以结合到基底和一个或多个光学通孔的内表面。 实施方案包括一个或多个光学通孔芯，其包含具有比第一光学聚合物更大的折射率的第二光学聚合物。 一个或多个光学通孔芯可以至少部分地被第一光学聚合物包围。 实施例包括与光通孔和/或通孔芯通信的封装光波导。 示例实现包括电绝缘层，电迹线和电气通孔。 一种制造方法包括通过激光烧蚀形成光学通孔。 某些实施例可以包括化学蚀刻通孔内部以改善表面粗糙度。

    OPTO-ELECTRIC HYBRID BOARD AND METHOD OF MANUFACTURING SAME
    39.
    发明申请
    OPTO-ELECTRIC HYBRID BOARD AND METHOD OF MANUFACTURING SAME 有权
    光电混合板及其制造方法

    公开(公告)号：US20160231520A1

    公开(公告)日：2016-08-11

    申请号：US15029016

    申请日：2014-09-11

    Applicant: NITTO DENKO CORPORATION

    Inventor： Naoki Shibata ,  Yuichi Tsujita

    IPC: G02B6/42 ,  H05K1/11

    CPC classification number: G02B6/4245 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4239 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/117 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0358 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/10121 ,  H05K2201/2009 ,  H05K2201/2054

    Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

    Abstract translation: 在根据本发明的光电混合基板中，在基板的第一表面上设置电互连线和光学元件，并且在基板的第二表面上设置光耦合到光学元件的光波导 。 用于加强基板的加强层一体地安装在其上设置有电互连线和光学元件的基板的第一表面上，其间具有粘合剂层。 在其上设置有光波导的基板的第二表面上设置有用于外部电连接电互连线的连接器焊盘部分。 利用这种构造，加强层以高强度安装在基板上，而不会对光学元件和光波导产生不利影响。

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