Patent search ap:("FormFactor. Inc.") AND inv:"Benjamin N. Eldridge" Page 5

41.

发明申请
Fan out of interconnect elements attached to semiconductor wafer 失效
Title translation: 扇出连接到半导体晶圆的互连元件

公开(公告)号：US20030082890A1

公开(公告)日：2003-05-01

申请号：US10001437

申请日：2001-10-31

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge , Igor Y. Khandros

IPC: H01L021/301 , H01L021/46 , H01L021/78

CPC classification number: H01L21/6836 , H01L21/304 , H01L21/78 , H01L23/4822 , H01L24/11 , H01L24/14 , H01L2221/68327 , H01L2224/02335 , H01L2224/056 , H01L2224/1134 , H01L2224/13008 , H01L2224/13016 , H01L2224/131 , H01L2224/1403 , H01L2224/1415 , H01L2224/4554 , H01L2224/48095 , H01L2224/49171 , H01L2224/854 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01039 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2224/13099 , H01L2924/00 , H01L2224/45099

Abstract: An unsingulated semiconductor wafer is provided. Electrical interconnect elements are formed on the unsingulated wafer such that the interconnect elements are electrically connected to terminals of the semiconductor dice composing the wafer. At least a portion of the interconnect elements extend beyond the boundaries of the dice into the scribe streets separating the individual dice. Thereafter, the wafer is singulated into individual dice.

Abstract translation: 提供了一种无引脚半导体晶片。电气互连元件形成在未胶化的晶片上，使得互连元件电连接到构成晶片的半导体晶片的端子。互连元件的至少一部分延伸超过骰子的边界进入划分各个骰子的划线路。此后，将晶片分割成单独的骰子。

42.

发明申请
Predictive, adaptive power supply for an integrated circuit under test 有权
Title translation: 用于被测集成电路的预测，自适应电源

公开(公告)号：US20020186037A1

公开(公告)日：2002-12-12

申请号：US10206276

申请日：2002-07-25

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge , Charles A. Miller

IPC: G01R031/26

CPC classification number: G06F1/26 , G01R31/2851 , G01R31/31721 , G01R31/31905 , G01R31/31924

Abstract: A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT during a test as transistors within the IC switch in response to the clock signal edges. To limit variation (noise) in voltage at the power input terminal, an auxiliary power supply supplies an additional current pulse to the power input terminal to meet the increased demand during each cycle of the clock signal. The magnitude of the current pulse is a function of a predicted increase in current demand during that clock cycle, and of the magnitude of an adaption signal controlled by a feedback circuit provided to limit variation in voltage developed at the DUT's power input terminal.

Abstract translation: 主电源将电流通过路径阻抗提供给被测集成电路器件（DUT）的电源端子。在测试期间，DUT对电源输入端的电流需求暂时增加了在测试期间施加到DUT的时钟信号的随后边缘，作为IC开关中的晶体管响应于时钟信号的边缘。为了限制电源输入端子的电压变化（噪声），辅助电源为电源输入端子提供额外的电流脉冲，以满足在时钟信号的每个周期期间增加的需求。电流脉冲的大小是在该时钟周期期间电流需求的预测增加以及由反馈电路控制的适配信号的大小的函数，以限制在DUT的功率输入端产生的电压变化。

43.

发明申请
Probe card assembly and kit, and methods of making same 失效
Title translation: 探针卡组装和试剂盒，以及制作方法

公开(公告)号：US20020080588A1

公开(公告)日：2002-06-27

申请号：US10034543

申请日：2001-12-27

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu

IPC: H01R009/00 , G01R001/00 , G05F001/00 , G01R031/26 , H01R043/00

CPC classification number: H05K7/1069 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/0675 , G01R1/06761 , G01R1/07342 , G01R1/07378 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/05001 , H01L2224/05023 , H01L2224/05085 , H01L2224/05556 , H01L2224/05568 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49211 , Y10T29/49213 , Y10T29/49222 , H01L2924/00 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20757 , H01L2224/05599

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are nullstacked upnull so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Abstract translation: 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器空间变压器和探针卡之间。空间变换器和插入器“堆叠”，从而可以调节空间变压器的方向，从而可以调节探针元件的尖端的方向，而不改变探针卡的方向。公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调节范围内在空间变压器和探针卡之间保持电连接。使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。