公开(公告)号：US08501583B2

公开(公告)日：2013-08-06

申请号：US12497996

申请日：2009-07-06

申请人： Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

发明人： Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

IPC分类号： H01L21/30 ,  H01L21/4763

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/0695 ,  H01L2924/05432 ,  H01L2924/0001

摘要： A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates.

摘要翻译： 在每个具有多个电极的基板之间的空间中提供含有导电颗粒和气泡发生剂的树脂。 然后将树脂加热以熔化包含在树脂中的导电颗粒，并从气泡发生剂产生气泡。 在至少一个基板上形成台阶部。 在加热树脂的过程中，通过生长的气泡将树脂推开，其结果是，包含在树脂中的导电颗粒被引导到电极之间的空间，并且在空间中形成连接器 。 同时，树脂被引导到形成台阶部分的基板的部分之间的空间，并固化以固定基板之间的距离。

公开(公告)号：US07820021B2

公开(公告)日：2010-10-26

申请号：US12078891

申请日：2008-04-08

申请人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： C25B9/00 ,  C25C7/00 ,  C25D17/00 ,  B22D37/00 ,  B22D39/00 ,  B22D41/00 ,  B22D45/00 ,  H01L21/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83047 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2225/06513 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/087 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board 10 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 21 are disposed in mutually facing relation and a resin 13 containing conductive particles 12 and a gas bubble generating agent is supplied into the space therebetween. In this state, the resin 13 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 13. The resin 13 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof. The resin 13 pushed to the outside is self-assembled in the form of columns between the respective terminals of the circuit board 10 and the semiconductor chip 20. In this state, by pressing the semiconductor chip 20 against the circuit board 10, the conductive particles 12 contained in the resin 13 self-assembled between the facing terminals are brought into contact with each other to provide electrical connection between the terminals.

摘要翻译： 提供了一种适用于下一代LSI的倒装芯片安装并且生产率和可靠性高的倒装芯片安装方法以及用于连接基板的方法。 具有多个连接端子11的电路板10和具有多个电极端子21的半导体芯片20以相互面对的关系设置，并且将含有导电粒子12和气泡发生剂的树脂13供给到它们之间的空间中。 在这种状态下，树脂13被加热，从包含在树脂13中的气泡产生剂产生气泡30.树脂13通过其生长被推向产生的气泡30的外部。 被推到外面的树脂13以电路板10的各个端子和半导体芯片20之间的列的形式自组装。在这种状态下，通过将半导体芯片20压靠在电路板10上，导电颗粒 包含在自组装在相对端子之间的树脂13中的12彼此接触以提供端子之间的电连接。

公开(公告)号：US07714444B2

公开(公告)日：2010-05-11

申请号：US12424867

申请日：2009-04-16

申请人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： H01L23/52

CPC分类号： H05K3/3484 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3613 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/16225

摘要： The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.

摘要翻译： 本发明提供一种导电树脂组合物，用于电连接电极，其中金属颗粒分散在流动介质中，其中流动介质包括与金属颗粒相比具有较高润湿性的第一流动介质和具有相对较高的第二流动介质 与金属颗粒的低润湿性，以及第一流动介质和第二流动介质在彼此不相容的状态下分散。 因此，提供了可以应用于LSI的倒装芯片封装并且具有高生产率和高可靠性的倒装芯片封装方法。

公开(公告)号：US20090229120A1

公开(公告)日：2009-09-17

申请号：US12280907

申请日：2007-02-22

申请人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

发明人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

IPC分类号： H05K3/00 ,  B23P19/00

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83886 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0776 ,  H05K2203/087 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/532 ,  Y10T29/53204 ,  H01L2924/00

摘要： In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

摘要翻译： 在布线基板31的电极32上形成凸块19的方法中，将含有导电粒子16和气泡生成剂的流体14供给到布线基板31上的包含电极32的第一区域17上。然后， 40具有与第一区域17具有相同面积并形成在具有比第一区域17的面积大的面积的基板40的主表面18上的突出表面13，使得突出表面13面向 然后，流体14被加热，从包含在流体14中的气泡发生剂产生气泡30。

公开(公告)号：US07537961B2

公开(公告)日：2009-05-26

申请号：US11683612

申请日：2007-03-08

申请人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： H01L21/00

CPC分类号： H05K3/3484 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3613 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/16225

摘要： The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.

摘要翻译： 本发明提供一种导电树脂组合物，用于电连接电极，其中金属颗粒分散在流动介质中，其中流动介质包括与金属颗粒相比具有较高润湿性的第一流动介质和具有相对较高的第二流动介质 与金属颗粒的低润湿性，以及第一流动介质和第二流动介质在彼此不相容的状态下分散。 因此，提供了可以应用于LSI的倒装芯片封装并且具有高生产率和高可靠性的倒装芯片封装方法。

公开(公告)号：US07531385B1

公开(公告)日：2009-05-12

申请号：US11887331

申请日：2006-03-16

申请人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83047 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2225/06513 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/087 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board 10 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 21 are disposed in mutually facing relation and a resin 13 containing conductive particles 12 and a gas bubble generating agent is supplied into the space therebetween. In this state, the resin 13 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 13. The resin 13 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof. The resin 13 pushed to the outside is self-assembled in the form of columns between the respective terminals of the circuit board 10 and the semiconductor chip 20. In this state, by pressing the semiconductor chip 20 against the circuit board 10, the conductive particles 12 contained in the resin 13 self-assembled between the facing terminals are brought into contact with each other to provide electrical connection between the terminals.

摘要翻译： 提供了一种适用于下一代LSI的倒装芯片安装并且生产率和可靠性高的倒装芯片安装方法以及用于连接基板的方法。 具有多个连接端子11的电路板10和具有多个电极端子21的半导体芯片20以相互面对的关系设置，并且将含有导电粒子12和气泡发生剂的树脂13供给到它们之间的空间中。 在这种状态下，树脂13被加热，从包含在树脂13中的气泡产生剂产生气泡30.树脂13通过其生长被推向产生的气泡30的外部。 被推到外面的树脂13以电路板10的各个端子和半导体芯片20之间的列的形式自组装。在这种状态下，通过将半导体芯片20压靠在电路板10上，导电颗粒 包含在自组装在相对端子之间的树脂13中的12彼此接触以提供端子之间的电连接。

公开(公告)号：US20090117688A1

公开(公告)日：2009-05-07

申请号：US11887332

申请日：2006-03-16

申请人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： H01L21/02

CPC分类号： H05K3/3484 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/16505 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83211 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/301 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0425 ,  H05K2203/087 ,  H05K2203/1178 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/05599

摘要： A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin 14 containing a solder powder 16 and a gas bubble generating agent is supplied to a space between a circuit board 21 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof and self-assembled between the connecting terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 22 are formed between the terminals to complete a flip chip mounting body.

摘要翻译： 提供一种适用于下一代LSI的倒装芯片安装以及高生产率和可靠性以及凸块形成方法的倒装芯片安装方法。 在包含焊料粉末16和气泡生成剂的树脂14被供给到具有多个连接端子11的电路板21和具有多个电极端子12的半导体芯片20之间的空间的情况下，加热树脂14 从包含在树脂14中的气泡发生剂产生气泡30.树脂14通过其生长被推向产生的气泡30的外部，并且在连接端子11和电极端子12之间自组装。 通过进一步加热树脂14并熔化包含在树脂14中的自组装在端子之间的焊料粉末16，在端子之间形成连接器22以完成倒装芯片安装体。

公开(公告)号：US20090102064A1

公开(公告)日：2009-04-23

申请号：US12298464

申请日：2007-04-18

申请人： Susumu Sawada ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

发明人： Susumu Sawada ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

IPC分类号： H01L23/48 ,  H01L21/00 ,  H01L23/52 ,  H01L23/485 ,  H01L23/488

CPC分类号： H05K3/323 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16501 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8192 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/361 ,  H05K3/363 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2924/00015

摘要： A connection structure (package 10) has a first plate body 101 and a second plate body; in the first plate body 101, a wiring pattern having a plurality of connection terminals 102 is formed, and the second plate body has at least two connection terminals (electrode terminals 104) arranged facing the connection terminals of the first plate body 101. The connection terminals of the first and second plate bodies are connection terminals formed as projections on the surfaces of the first and second plate bodies. A conductive substance 108 is accumulated to cover at least a part of each side face of the connection terminals opposed to each other of the first and second plate bodies, and the connection terminals thus opposed are connected to each other via the conductive substance. The package thus formed is ready for a high-pin-count, narrow-pitch configuration of a next-generation semiconductor chip, and exhibits excellent productivity and reliability. The present invention is advantageous for such a package, for a connection structure applicable to the production of the package, and for a method of producing the connection structure.

摘要翻译： 连接结构（封装10）具有第一板体101和第二板体; 在第一板体101中，形成具有多个连接端子102的布线图案，第二板体具有面对第一板体101的连接端子配置的至少两个连接端子（电极端子104）。连接 第一和第二板体的端子是在第一和第二板体的表面上形成为突起的连接端子。 聚集导电物质108以覆盖第一和第二板体彼此相对的连接端子的每个侧面的至少一部分，并且由此相对的连接端子经由导电物质彼此连接。 这样形成的封装准备好用于下一代半导体芯片的高引脚数，窄间距配置，并且表现出优异的生产率和可靠性。 本发明对于这种包装，对于适用于包装的生产的连接结构以及制造连接结构的方法是有利的。

公开(公告)号：US08193526B2

公开(公告)日：2012-06-05

申请号：US12672135

申请日：2008-08-06

申请人： Seiichi Nakatani ,  Yoshihisa Yamashita ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiichi Nakatani ,  Yoshihisa Yamashita ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： H01L51/00

CPC分类号： H01L51/057 ,  H01L27/3274 ,  H01L27/3276 ,  H01L51/0096 ,  Y02E10/549 ,  Y02P70/521

摘要： A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided.A semiconductor device comprising a resin film that has a through hole that penetrates from one surface to the other surface thereof, a source electrode disposed along the inner wall of the through hole, a drain electrode disposed along the inner wall of the through hole, a gate electrode disposed on the other surface of the resin film opposing the through hole, an insulating layer disposed on the gate electrode at the bottom of the through hole and an organic semiconductor disposed in the through hole so as to contact the source electrode and the drain electrode, wherein the organic semiconductor makes contact with at least a part of the insulating layer at the bottom of the through hole so that a channel is formed in the organic semiconductor in the vicinity of the insulating layer that is in contact therewith.

摘要翻译： 提供了具有以更高密度形成的半导体元件的半导体器件。 此外，还提供了使用该半导体器件的图像显示装置。 一种半导体器件，包括具有从一个表面到另一个表面穿透的通孔的树脂膜，沿着通孔的内壁设置的源电极，沿该通孔的内壁设置的漏电极， 设置在与通孔相对的树脂膜的另一个表面上的栅电极，设置在通孔底部的栅电极上的绝缘层和布置在通孔中的有机半导体，以便与源电极和漏极 电极，其中有机半导体与通孔底部的绝缘层的至少一部分接触，使得在与其接触的绝缘层附近的有机半导体中形成沟道。

公开(公告)号：US20080197173A1

公开(公告)日：2008-08-21

申请号：US11579505

申请日：2006-04-25

申请人： Takashi Kitae ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu ,  Yoshihisa Yamashita

发明人： Takashi Kitae ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu ,  Yoshihisa Yamashita

IPC分类号： B23K31/02 ,  B23K1/20

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/09745 ,  H05K2201/10977 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099

摘要： [Problem] To provide a method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device.[Means for Solving Problem] A flat plate 10 or 30 having a plurality of projections 12 or recesses 32 thereon is prepared; the flat plate is aligned to oppose an electronic component 14 or 34 and a resin composition 18 or 19 including a solder powder 22 or 23 is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals 16 or 36, so as to form solder bumps 24 or 38 on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps. Thus, the solder bumps 24 or 38 having pits 24a corresponding to the projections 12 or having projections 38a corresponding to the recesses 32 are formed.

摘要翻译： [问题]提供一种形成用于实现高密度安装的焊料凸块的方法和用于安装半导体器件的高可靠性方法。 [解决问题的手段]准备在其上具有多个突起12或凹部32的平板10或30; 平板对准电子部件14或34，并且包括焊料粉末22或23的树脂组合物18或19被供应到平板和电子部件之间的间隙; 对树脂组合物进行退火，通过使熔融的焊料粉末在端子16或36上自组装，将包含在用于生长焊料粉末的树脂组合物中的焊料粉末熔化至平板表面的高度，从而 在端子上形成焊料凸块24或38; 并且在冷却并固化焊料凸块之后去除平板。 因此，形成具有对应于突起12的凹坑24a或具有对应于凹部32的突起38a的焊料凸块24或38。