公开(公告)号：US20040056236A1

公开(公告)日：2004-03-25

申请号：US10246460

申请日：2002-09-19

Applicant: Industrial Technology Research Institute

Inventor： Hsun-Tien Li ,  Shu-Chen Huang ,  Kai-Chi Chen

IPC: H01B001/00

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0224 ,  Y10T428/2995

Abstract: Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.

Abstract translation: 细导电颗粒由金属导电粉末和粉末颗粒上的绝缘有机覆盖层组成。 金属导电粉末具有直径范围为1至20微米的晶粒，并且覆盖层具有50-400nm的厚度，其能够通过热压而流动。 绝缘有机覆盖层由具有反应性官能团的硅烷，含氟硅烷和具有能够与反应性官能团反应的官能团的化合物或树脂制备。

公开(公告)号：US4999460A

公开(公告)日：1991-03-12

申请号：US432135

申请日：1989-11-06

Applicant: Kazuhiro Sugiyama ,  Yoshinori Atsumi

Inventor： Kazuhiro Sugiyama ,  Yoshinori Atsumi

IPC: G02F1/13 ,  G02F1/1339 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R4/04 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681 ,  H05K3/323 ,  H05K3/361

Abstract: A conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

Abstract translation: 公开了一种用于电连接第一和第二电子部件的导电连接结构，每个具有以小间距布置的多个连接端子。 在第一和第二电子部件的多个连接端子之间插入有导电性接合剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电粘合剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时，由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而，平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子的比例增加，相邻的细连接粒子彼此接触，也可以在平面方向上保持绝缘性，而仅在厚度方向上获得传导 。

公开(公告)号：US09273235B2

公开(公告)日：2016-03-01

申请号：US14124509

申请日：2011-06-10

Applicant: Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

Inventor： Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

IPC: B32B5/16 ,  B32B25/02 ,  C09J11/06 ,  C22C5/06 ,  H01L23/00 ,  H05K1/09 ,  B22F1/00

CPC classification number: C09J11/06 ,  B22F1/0018 ,  B22F1/0062 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/24413 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.

Abstract translation: 使用银纳米颗粒的接合材料响应于组成的轻微变化而显着改变涂层材料性质，并且其稳定性对于大量施加而言不足。 使用银纳米颗粒的接合材料满足大量印刷的要求，获得尺寸稳定性，并提供光滑的印刷表面。 接合材料包括至少具有1nm至200nm的平均初级粒径且已经涂覆有碳原子数为8以下的有机物的分散介质和由有机物构成的粘度调节剂的银纳米粒子， 并且具有100Pa·s以下的粘度（在剪切速度为15.7 [1 / s]下测定）和在剪切速度为15.7℃时测定的触变性比（在剪切速度为3.1 [1 / s]下测定） [1 / s]）为4以下。

公开(公告)号：US09217088B2

公开(公告)日：2015-12-22

申请号：US13168465

申请日：2011-06-24

Applicant: Sachin Parashar ,  Siuli Sarkar ,  Oscar Khaselev ,  Brian G. Lewis ,  Michael T. Marczi ,  Bawa Singh ,  Nitin Desai ,  Michael Liberatore

Inventor： Sachin Parashar ,  Siuli Sarkar ,  Oscar Khaselev ,  Brian G. Lewis ,  Michael T. Marczi ,  Bawa Singh ,  Nitin Desai ,  Michael Liberatore

IPC: C09D11/03 ,  B22F1/00 ,  B22F9/24 ,  B82Y30/00 ,  C09D7/12 ,  C09D11/00 ,  C09D11/38 ,  C23C24/08 ,  C23C26/00 ,  H01B1/02 ,  H01L51/00 ,  H05K1/09 ,  C08K3/08 ,  C08K9/04

CPC classification number: C09D11/03 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B82Y30/00 ,  C01P2002/84 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/08 ,  C08K9/04 ,  C09D7/62 ,  C09D7/67 ,  C09D11/00 ,  C09D11/38 ,  C23C24/08 ,  C23C26/00 ,  H01B1/02 ,  H01L51/0022 ,  H05K1/097 ,  H05K2201/0224 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.

Abstract translation: 提供颗粒和颗粒膜。 在某些实例中，由单相工艺生产的颗粒可用于提供用于诸如印刷线路板的装置的颗粒的工业规模合成。

公开(公告)号：US20150187453A1

公开(公告)日：2015-07-02

申请号：US14140534

申请日：2013-12-26

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： CHANG-CHIN WU ,  PEI-RONG SHIEH

IPC: H01B1/16 ,  H01B13/00

CPC classification number: H01B1/16 ,  G02F1/13452 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0227 ,  Y10T428/249983

Abstract: An anisotropic conductive film includes a base board and an insulation adhesive layer coated on a side surface of the base board. The insulation adhesive layer includes a plurality of conductive particles dispersed in the insulation adhesive layer. Each of the plurality of conductive particles includes a spherical base portion, a conductive film formed on the spherical base portion, and an insulation layer with ceramic materials formed on the conductive film. The insulation layer defines a plurality of holes, thus the insulation layer is porous, the insulation layer is capable of being partly exposed from the plurality of holes when the plurality of conductive particles is pressed. A method for manufacturing the anisotropic conductive film is also provided.

Abstract translation: 各向异性导电膜包括基板和涂覆在基板的侧表面上的绝缘粘合剂层。 绝缘粘合剂层包括分散在绝缘粘合剂层中的多个导电颗粒。 多个导电粒子中的每一个包括球形基部，形成在球形基部上的导电膜，以及在导电膜上形成有陶瓷材料的绝缘层。 绝缘层限定多个孔，因此绝缘层是多孔的，当多个导电颗粒被按压时，绝缘层能够从多个孔部分露出。 还提供了制造各向异性导电膜的方法。

公开(公告)号：US08916089B2

公开(公告)日：2014-12-23

申请号：US12155674

申请日：2008-06-06

Applicant: Mark Allen ,  Tomi Mattila ,  Ari Alastalo ,  Heikki Seppä

Inventor： Mark Allen ,  Tomi Mattila ,  Ari Alastalo ,  Heikki Seppä

IPC: B22F7/00

CPC classification number: H05K3/02 ,  H05K3/105 ,  H05K3/1266 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/0117 ,  H05K2203/0121 ,  H05K2203/0143 ,  H05K2203/0517 ,  H05K2203/105 ,  H05K2203/1131 ,  H05K2203/1545

Abstract: This publication discloses a method and apparatus for functionalizing nanoparticle systems. The method comprises treating a nanoparticle-containing layer so as to produce a pattern of structurally transformed zones, the treatment comprising applying an electric field through the nanoparticle layer. According to the invention an AC-field capacitively coupled to the nanoparticle-containing layer is used as said electric field. The treatment preferably results in at least partly sintered structures, which can be used as conductors, for example. The document discloses several realizations for utilization of the disclosed functionalization in mass-fabrication lines.

Abstract translation: 该出版物公开了一种功能化纳米粒子体系的方法和装置。 该方法包括处理含纳米颗粒的层以产生结构转化区的图案，该处理包括通过纳米颗粒层施加电场。 根据本发明，使用电容耦合到含纳米粒子层的AC场作为所述电场。 处理优选地导致例如至少部分烧结的结构，其可以用作导体。 该文献公开了在批量生产线中利用所公开的功能化的几种实现。

公开(公告)号：US20140308489A1

公开(公告)日：2014-10-16

申请号：US14347075

申请日：2012-09-12

Applicant: Tetsuro Miyahira ,  Yoshihiro Kato ,  Takaaki Ogashiwa ,  Hiroshi Takahashi

Inventor： Tetsuro Miyahira ,  Yoshihiro Kato ,  Takaaki Ogashiwa ,  Hiroshi Takahashi

IPC: H05K1/03 ,  B32B27/20

CPC classification number: H05K1/0373 ,  B32B27/20 ,  C01G39/00 ,  C01G39/02 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/84 ,  C08J5/24 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2255 ,  C08L63/00 ,  C08L71/12 ,  C09C1/0003 ,  H05K2201/0224 ,  Y10T428/24893 ,  Y10T428/256

Abstract: The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.

Abstract translation: 本发明提供了一种新型的表面处理的钼化合物粉末，并且提供了在平面方向上具有低热膨胀系数的预浸料，层压体，金属箔层压体，印刷线路板等，并且具有优异的可钻性，热 阻力和阻燃性。 本发明的经表面处理的钼化合物粉末的表面的至少一部分涂覆有无机氧化物，并将其用作填料。

公开(公告)号：US08846142B2

公开(公告)日：2014-09-30

申请号：US12982184

申请日：2010-12-30

Applicant: Yasushi Akutsu ,  Hidetsugu Namiki

Inventor： Yasushi Akutsu ,  Hidetsugu Namiki

IPC: B05D5/12 ,  C09J9/02 ,  H05K3/32 ,  H01B1/22 ,  H01R4/04

CPC classification number: H01R4/04 ,  C09J9/02 ,  H01B1/22 ,  H05K3/323 ,  H05K2201/0224 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.

Abstract translation: 公开了用于在各向异性导电连接材料之间建立导电互连的导电颗粒。 基板和电气部件。 导电性粒子包括至少在其表面具有导电性的基体颗粒（2）和由构成树脂膜的绝缘树脂的细颗粒（3a）形成的连续绝缘树脂膜（3）。 基体颗粒的表面涂覆有连续的绝缘树脂膜。 至少在相邻的细颗粒之间形成空隙。

公开(公告)号：US08821676B2

公开(公告)日：2014-09-02

申请号：US13099394

申请日：2011-05-03

Applicant: Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC: B29C65/02 ,  B32B5/02 ,  B32B5/16

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US20140113109A1

公开(公告)日：2014-04-24

申请号：US14124509

申请日：2011-06-10

Applicant: Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

Inventor： Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

IPC: C09J11/06

CPC classification number: C09J11/06 ,  B22F1/0018 ,  B22F1/0062 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/24413 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.

Abstract translation: 使用银纳米颗粒的接合材料响应于组成的轻微变化而显着改变涂层材料性质，并且其稳定性对于大量施加而言不足。 使用银纳米颗粒的接合材料满足大量印刷的要求，获得尺寸稳定性，并提供光滑的印刷表面。 接合材料包括至少具有1nm至200nm的平均初级粒径且已经涂覆有碳原子数为8以下的有机物的分散介质和由有机物构成的粘度调节剂的银纳米粒子， 并且具有100Pa·s以下的粘度（在剪切速度15.7 [1 / s]下测定）和在剪切速度为15.7°下测定的触变性比（在剪切速度3.1 [1 / s]下测定） [1 / s]）为4以下。