公开(公告)号：US08841171B2

公开(公告)日：2014-09-23

申请号：US13298391

申请日：2011-11-17

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/13 ,  H01L23/367 ,  H01L25/16 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L23/31

CPC classification number: H01L23/5389 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2101 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A method of making a stackable semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive, a plated through-hole, first build-up circuitry and second build-up circuitry is disclosed. The heat spreader includes a bump and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the first build-up circuitry and thermally connected to the bump. The bump extends into an opening in the adhesive and the flange extends laterally from the bump at the cavity entrance. The first build-up circuitry and the second build-up circuitry extend beyond the semiconductor device in opposite vertical directions. The plated through-hole extends through the adhesive and provides signal routing between the first build-up circuitry and the second build-up circuitry. The heat spreader provides heat dissipation for the semiconductor device.

Abstract translation: 公开了一种制造可堆叠半导体组件的方法，其包括半导体器件，散热器，粘合剂，电镀通孔，第一积聚电路和第二积聚电路。 散热器包括凸块和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到第一积聚电路并热连接到凸块。 凸块延伸到粘合剂中的开口中，并且凸缘从空腔入口处的凸起横向延伸。 第一积聚电路和第二堆积电路在相反的垂直方向上延伸超出半导体器件。 电镀通孔延伸穿过粘合剂并且在第一聚集电路和第二聚集电路之间提供信号路由。 散热器为半导体器件提供散热。

公开(公告)号：US08329510B2

公开(公告)日：2012-12-11

申请号：US12978421

申请日：2010-12-24

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/00

CPC classification number: H01L23/60 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/0104 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post, a base, an ESD protection layer and a metal layer, wherein the post extends above the base and the ESD protection layer is sandwiched between the base and the metal layer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the ESD protection layer and an underlayer that includes at least a portion of the metal layer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱，基底，ESD保护层和金属层，其中柱延伸到基底之上，并且ESD保护层夹在基底和金属层之间，安装粘合剂 在基座上包括将柱插入粘合剂的开口中，将导电层安装在粘合剂上，包括使该柱与导电层中的孔对准，然后使粘合剂在柱和导电层之间向上流动，使粘合剂固化， 然后提供包括导电层的焊盘，端子和选定部分的导电迹线，提供包括柱，基底，ESD保护层和底层的散热器，所述底层包括金属层的至少一部分 ，然后将半导体器件安装在柱上，将半导体器件电连接到导电迹线并热连接半导体器件 e到散热器。

公开(公告)号：US08324723B2

公开(公告)日：2012-12-04

申请号：US12950999

申请日：2010-11-20

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

CPC classification number: H01L33/642 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump that includes first, second and third bent corners that shape a cavity. The conductive trace includes a pad and a terminal. The semiconductor device is located within the cavity, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends into an opening in the adhesive and provides a recessed die paddle and a reflector for the semiconductor device. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括凸起，该凸起包括形成空腔的第一，第二和第三弯曲角。 导电迹线包括焊盘和端子。 半导体器件位于腔内，电连接到导电迹线并热连接到凸块。 凸块延伸到粘合剂中的开口中，并提供用于半导体器件的凹陷模板和反射器。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US08314438B2

公开(公告)日：2012-11-20

申请号：US12911729

申请日：2010-10-26

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L33/00

CPC classification number: H05K1/021 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01087 ,  H01L2924/15153 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/10106 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00014

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括凸块，底座和凸缘。 导电迹线包括焊盘和端子。 半导体器件延伸到凸块中的空腔中，电连接到导电迹线并且热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。

公开(公告)号：US08283211B2

公开(公告)日：2012-10-09

申请号：US12951066

申请日：2010-11-22

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/00 ,  H01L23/12

CPC classification number: H01L33/642 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of making a semiconductor chip assembly includes providing a bump and a ledge, wherein the bump includes first, second and third bent corners that shape a cavity, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the ledge, providing a heat spreader that includes the bump, then mounting a semiconductor device on the bump within the cavity, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供凸块和凸缘，其中所述凸块包括形成空腔的第一，第二和第三弯曲角，将粘合剂安装在凸缘上，包括将凸块插入粘合剂中的开口中，安装 所述粘合剂上的导电层包括将所述凸块与所述导电层中的孔对准，然后使所述粘合剂在所述凸块和所述导电层之间流动，固化所述粘合剂，然后提供导电迹线，其包括焊盘，端子和选定部分 提供包括凸起的散热器，然后将半导体器件安装在空腔内的凸块上，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器上。

公开(公告)号：US08232573B2

公开(公告)日：2012-07-31

申请号：US12721551

申请日：2010-03-10

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader is aluminum and includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace includes a silver coating and a copper core and provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器是铝，包括一个柱子和一个基座。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线包括银涂层和铜芯，并且在焊盘和端子之间提供信号路由。

公开(公告)号：US08227270B2

公开(公告)日：2012-07-24

申请号：US12834013

申请日：2010-07-12

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/50

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a thermal post, a signal post, a base and a terminal, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer and downward between the base and the terminal, solidifying the adhesive, providing a conductive trace that includes a pad, the terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供热柱，信号柱，基座和端子，将粘合剂安装在基座上，包括将热柱插入粘合剂中的第一开口中，并将信号柱插入第二开口 在粘合剂中，将导电层安装在粘合剂上，包括将热柱与导电层中的第一孔对准，并且在导电层中具有第二孔的信号柱，然后使粘合剂在热柱和导电层之间向上流动 并且在信号柱和导电层之间并且在底部和端子之间向下固化粘合剂，提供包括焊盘，端子和信号柱的导电迹线，其中焊盘包括导电层的选定部分， 将半导体器件安装在包括热柱和基座的散热器上，将半导体器件电连接到连接器 导电迹线，并将半导体器件热连接到散热器上。

公开(公告)号：US08076182B2

公开(公告)日：2011-12-13

申请号：US12714495

申请日：2010-02-28

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L21/00

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the adhesive above the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将基底安装在粘合剂上，包括使柱与基底中的孔对准， 然后将粘合剂在位于柱和基底之间的孔中的间隙中向上流动，固化粘合剂，然后蚀刻柱以在柱上方的粘合剂中形成空腔，然后将半导体器件安装在柱上，其中 散热器包括柱和基座，并且半导体器件延伸到空腔中，将半导体器件电连接到衬底并将半导体器件热连接到散热器。

公开(公告)号：US07901993B2

公开(公告)日：2011-03-08

申请号：US12722526

申请日：2010-03-12

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture in the copper layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a silver coating and a copper core that is a selected portion of the copper layer, mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将铜层安装在粘合剂上，包括使柱与孔中的铜对准 然后使粘合剂在位于柱和铜层之间的孔中的间隙中和向上流动，固化粘合剂，然后提供导电迹线，其包括衬垫，端子，银涂层和铜芯，其是 铜层的选定部分，将半导体器件安装在柱上，其中铝散热器包括柱和基座，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US07750483B1

公开(公告)日：2010-07-06

申请号：US11586787

申请日：2006-10-26

Applicant: Charles W. C. Lin ,  Cheng-Chung Chen

Inventor： Charles W. C. Lin ,  Cheng-Chung Chen

IPC: H01L23/48

CPC classification number: H01L24/83 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/85 ,  H01L24/90 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85207 ,  H01L2224/85365 ,  H01L2224/9202 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20755 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/013

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and an enlarged plated contact terminal, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, the metal pillar is welded to the routing line and includes a ball bond and a stem, and the plated contact terminal is plated on the stem.

Abstract translation: 半导体芯片组件包括：半导体芯片，其包括导电焊盘，包括布线线的导电迹线，金属柱和扩大的电镀接触端子，电连接布线线和焊盘的连接接头以及密封剂。 芯片和金属柱嵌入密封剂中，引导线横向延伸超过金属柱朝向芯片，金属柱焊接到布线线，并包括球接头和杆，并且电镀接触端子电镀 在茎上。