公开(公告)号：US5622590A

公开(公告)日：1997-04-22

申请号：US430484

申请日：1995-04-28

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  B32B7/12 ,  B29C65/54 ,  H01L21/58 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5550408A

公开(公告)日：1996-08-27

申请号：US408965

申请日：1995-03-23

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  H01L23/28

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2224/92125 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in a matrix. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成矩阵的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5406459A

公开(公告)日：1995-04-11

申请号：US939000

申请日：1992-09-02

申请人： Masahide Tsukamoto ,  Seiichi Nakatani ,  Toru Ishida

发明人： Masahide Tsukamoto ,  Seiichi Nakatani ,  Toru Ishida

IPC分类号： H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/16

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K1/181 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10977 ,  H05K2201/10984 ,  H05K2203/0191 ,  H05K3/28 ,  H05K3/305 ,  H05K3/32 ,  H05K3/3484 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623

摘要： An electric circuit board module includes a substrate with electric components mounted on one side thereof and electrodes provided on the other side thereof for the electric connection with the mounted electrical components. The electric circuit board module further includes conductor columns adhered to the electrodes and an adhesion layer provided on the other side of the substrate and around the conductor columns such that the conductor columns extrude from the adhesion layer by a predetermined length. By pressing the electric circuit board module against a separate circuit board to mount thereon, the electric components are electrically connected with electrodes of the sperate circuit board through conductor columns. Since conductor columns are made of a resinous paste with metallic powders dispersed therein, no heating operation as required in conventional module using a solder flow is necessary, resulting in that electric components are kept from the degradation caused by the heat.

摘要翻译： 一种电路板模块，包括其一侧安装有电气部件的基板和设置在其另一侧上的电极，用于与所安装的电气部件的电连接。 电路板模块还包括粘附到电极的导体柱和设置在基板的另一侧上并围绕导体柱的粘合层，使得导体列从粘合层挤出预定长度。 通过将电路板模块压靠在单独的电路板上以安装在其上，电气部件通过导体柱与工作电路板的电极电连接。 由于导体柱由分散有金属粉末的树脂浆料制成，因此不需要使用焊料流动的常规模块中的加热操作，导致电子部件不受热引起的劣化。

公开(公告)号：US4352286A

公开(公告)日：1982-10-05

申请号：US208478

申请日：1980-11-19

申请人： Yoshihiko Nakatani ,  Masayuki Sakai ,  Seiichi Nakatani ,  Michio Matsuoka

发明人： Yoshihiko Nakatani ,  Masayuki Sakai ,  Seiichi Nakatani ,  Michio Matsuoka

IPC分类号： G01N27/12

CPC分类号： G01N27/12

摘要： There is provided a novel combustible gas detecting element and method for production thereof. The element comprises a gas sensing body comprising a sintered body or film of an amorphous semiconductor comprising a metal oxide, a sulfate and halide.

摘要翻译： 提供了一种新型的可燃气体检测元件及其生产方法。 元件包括气体感测体，其包括包含金属氧化物，硫酸盐和卤化物的非晶半导体的烧结体或膜。

公开(公告)号：US09107306B2

公开(公告)日：2015-08-11

申请号：US13879139

申请日：2011-10-05

申请人： Seiichi Nakatani ,  Koji Kawakita

发明人： Seiichi Nakatani ,  Koji Kawakita

IPC分类号： H05K1/03 ,  H01L23/15 ,  H05K3/46 ,  H05K3/10 ,  H01L21/48 ,  H01L23/498 ,  H05K3/00

CPC分类号： H05K1/0306 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K3/0097 ,  H05K3/107 ,  H05K3/4605 ,  H05K2201/029 ,  H05K2203/1126

摘要： A hybrid substrate includes a core layer composed of a glass woven cloth as a reinforcing material, and a glass-ceramic sintered body which at least has a glass component and a metal oxide component. The glass woven cloth and the glass-ceramic sintered body formed by an impregnation with respect to the glass woven cloth are in a form of sintering integration with each other.

摘要翻译： 混合基板包括由作为增强材料的玻璃织物构成的芯层和至少具有玻璃成分和金属氧化物成分的玻璃 - 陶瓷烧结体。 通过相对于玻璃布的浸渍形成的玻璃织布和玻璃 - 陶瓷烧结体是彼此烧结一体化的形式。

公开(公告)号：US08709293B2

公开(公告)日：2014-04-29

申请号：US11793175

申请日：2005-12-14

申请人： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

发明人： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

IPC分类号： H01B1/02

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.

摘要翻译： 提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可以应用于下一代LSI的倒装芯片安装。 这种倒装芯片安装树脂组合物包括树脂，金属颗粒和在加热树脂13时沸腾的对流添加剂12.当加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。 将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和电极的每个电极之间的区域 半导体芯片。 结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。 最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。

公开(公告)号：US08501583B2

公开(公告)日：2013-08-06

申请号：US12497996

申请日：2009-07-06

申请人： Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

发明人： Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

IPC分类号： H01L21/30 ,  H01L21/4763

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/0695 ,  H01L2924/05432 ,  H01L2924/0001

摘要： A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates.

摘要翻译： 在每个具有多个电极的基板之间的空间中提供含有导电颗粒和气泡发生剂的树脂。 然后将树脂加热以熔化包含在树脂中的导电颗粒，并从气泡发生剂产生气泡。 在至少一个基板上形成台阶部。 在加热树脂的过程中，通过生长的气泡将树脂推开，其结果是，包含在树脂中的导电颗粒被引导到电极之间的空间，并且在空间中形成连接器 。 同时，树脂被引导到形成台阶部分的基板的部分之间的空间，并固化以固定基板之间的距离。

公开(公告)号：US20120319159A1

公开(公告)日：2012-12-20

申请号：US13581695

申请日：2011-02-23

申请人： Seiichi Nakatani ,  Tatsuo Ogawa ,  Kazuo Kimura ,  Shigetoshi Segawa

发明人： Seiichi Nakatani ,  Tatsuo Ogawa ,  Kazuo Kimura ,  Shigetoshi Segawa

IPC分类号： H01L33/62 ,  H01L21/02 ,  H01L29/86

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2933/0033 ,  H01L2924/00

摘要： There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.

摘要翻译： 提供了一种用于发光元件的基板，其包括安装有发光元件的安装表面，该安装表面是基板的两个相对的主表面之一。 本发明的基板设置有用于发光元件的保护元件，该保护元件包括嵌入在该基板本体中的依赖于电压的电阻层，并且包括第一电极和第二电极，每个第一电极和第二电极 与电压相关的电阻层相关联，其中发光元件将被安装成使其与电压相关的电阻层重叠。

公开(公告)号：US08324623B2

公开(公告)日：2012-12-04

申请号：US13080152

申请日：2011-04-05

申请人： Koichi Hirano ,  Tetsuyoshi Ogura ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Tetsuyoshi Ogura ,  Seiichi Nakatani

IPC分类号： H01L21/00

CPC分类号： H01L24/13 ,  H01G4/008 ,  H01G4/33 ,  H01G9/045 ,  H01G9/07 ,  H01G9/15 ,  H01L23/5223 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/1131 ,  H01L2224/11831 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13155 ,  H01L2224/1358 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/1379 ,  H01L2224/138 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A semiconductor chip comprising a capacitor capable of effectively controlling the voltage drop of an LSI is provided. A semiconductor substrate is provided with an element electrode having at least its surface constituted of an aluminum electrode. The surface of the aluminum electrode is roughened. An oxide film is provided on the aluminum electrode. A conductive film is provided on the oxide film. The aluminum electrode, oxide film and conductive film form a capacitor.

摘要翻译： 提供了包括能够有效地控制LSI的电压降的电容器的半导体芯片。 半导体衬底设置有至少其表面由铝电极构成的元件电极。 铝电极的表面被粗糙化。 在铝电极上设置氧化膜。 在氧化膜上设置导电膜。 铝电极，氧化膜和导电膜形成电容器。

公开(公告)号：US08288778B2

公开(公告)日：2012-10-16

申请号：US12672127

申请日：2008-08-06

申请人： Seiichi Nakatani ,  Yoshihisa Yamashita ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiichi Nakatani ,  Yoshihisa Yamashita ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： H01L51/52

CPC分类号： H01L27/3274 ,  H01L27/283 ,  H01L27/3248 ,  H01L27/3276 ,  H01L51/0005 ,  H01L51/0558 ,  H01L2227/323

摘要： A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided.A semiconductor device comprising a resin film that has a through hole that penetrates from one surface to the other surface thereof, an organic semiconductor disposed inside the through hole, an insulating film on one end of the organic semiconductor, a gate electrode on the insulating film, a source electrode connected electrically to the other end of the organic semiconductor and a drain electrode connected electrically to the other end of the organic semiconductor.

摘要翻译： 提供了具有以更高密度形成的半导体元件的半导体器件。 此外，还提供了使用该半导体器件的图像显示装置。 一种半导体器件，包括具有从一个表面到另一个表面穿透的通孔的树脂膜，设置在所述通孔内的有机半导体，在所述有机半导体的一端上的绝缘膜，所述绝缘膜上的栅电极 与该有机半导体的另一端电连接的源电极和与该有机半导体的另一端电连接的漏电极。